HCPL-2731-000E Avago Technologies US Inc., HCPL-2731-000E Datasheet - Page 6

• Manufacturer Part Number: HCPL-2731-000E
• Description: OPTOCOUPLER DARL-OUT 2CH 8DIP
• Manufacturer: Avago Technologies US Inc.

Specifications of HCPL-2731-000E

• Input Type: DC
• Package / Case: 8-DIP (0.300", 7.62mm)
• Voltage - Isolation: 3750Vrms
• Number Of Channels: 2, Unidirectional
• Current - Output / Channel: 60mA
• Data Rate: 100KBd
• Propagation Delay High - Low @ If: 25µs @ 500µA
• Current - Dc Forward (if): 20mA
• Output Type: Open Collector
• Mounting Type: Through Hole
• Isolation Voltage: 3750 Vrms
• Output Device: Darlington With Base
• Configuration: 2 Channel
• Current Transfer Ratio: 5000 %
• Maximum Baud Rate: 100 KBps
• Maximum Forward Diode Voltage: 1.7 V
• Maximum Reverse Diode Voltage: 5 V
• Maximum Input Diode Current: 20 mA
• Maximum Power Dissipation: 135 mW
• Maximum Operating Temperature: + 70 C
• Minimum Operating Temperature: 0 C
• No. Of Channels: 2
• Optocoupler Output Type: Photodarlington
• Input Current: 12mA
• Output Voltage: 18V
• Opto Case Style: DIP
• No. Of Pins: 8
• Ctr Max: 5000%
• Ctr Min: 300%
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 516-1543-5

Recommended Pb-Free IR Profile
Solder Reflow Thermal Profile
TEMPERATURE
6
ROOM
NOTES:
THE TIME FROM 25 °C to PEAK TEMPERATURE = 8 MINUTES MAX.
T
T
T
smax
smax
smin
300
200
100
25
T
T
p
L
0
= 200 °C, T
Note: Non-halide flux should be used.
0
Note: Non-halide flux should be used.
150 - 200 °C
217 °C
PREHEATING RATE 3°C + 1°C/–0.5°C/SEC.
REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC.
160°C
150°C
140°C
t 25 °C to PEAK
3 °C/SEC. MAX.
60 to 180 SEC.
smin
PREHEAT
RAMP-UP
= 150 °C
t
50
s
3°C + 1°C/–0.5°C
260 +0/-5 °C
PREHEATING TIME
150°C, 90 + 30 SEC.
TIME
2.5°C ± 0.5°C/SEC.
100
TIME (SECONDS)
t
t
L
p
TIME WITHIN 5 °C of ACTUAL
PEAK TEMPERATURE
20-40 SEC.
60 to 150 SEC.
TEMP.
PEAK
245°C
RAMP-DOWN
6 °C/SEC. MAX.
150
SEC.
SEC.
30
30
50 SEC.
SOLDERING
200°C
TIME
200
PEAK
TEMP.
240°C
TIGHT
TYPICAL
LOOSE
TEMP.
PEAK
230°C
250
Regulatory Information
The HCPL-2731/2730 have been ap-
proved by the following organiza-
tions:
UL
Recognized under UL 1577, Com-
ponent Recognition Program, File
E55361.
CSA
Approved under CSA Component
Acceptance Notice #5, File CA
88324.
IEC/EN/DIN EN 60747-5-2
Approved under
IEC 60747-5-2:1997 + A1:2002
EN 60747-5-2:2001 + A1:2002
DIN EN 60747-5-2 (VDE 0884
Teil 2):2003-01
(Option 060 only)