HCPL-2200-000E Avago Technologies US Inc., HCPL-2200-000E Datasheet - Page 5

• Manufacturer Part Number: HCPL-2200-000E
• Description: OPTOCOUPLER LOGIC 2.5MBD 8-DIP
• Manufacturer: Avago Technologies US Inc.

Specifications of HCPL-2200-000E

• Package / Case: 8-DIP (0.300", 7.62mm)
• Voltage - Isolation: 3750Vrms
• Number Of Channels: 1, Unidirectional
• Current - Output / Channel: 25mA
• Data Rate: 2.5MBd
• Propagation Delay High - Low @ If: 210ns @ 3mA
• Current - Dc Forward (if): 10mA
• Input Type: DC
• Output Type: Tri-State
• Mounting Type: Through Hole
• Isolation Voltage: 3750 Vrms
• Maximum Continuous Output Current: 25 mA
• Maximum Fall Time: 0.007 us
• Maximum Forward Diode Current: 10 mA
• Output Device: Logic Gate Photo IC
• Configuration: 1 Channel
• Maximum Baud Rate: 5 MBd(Typ)
• Maximum Forward Diode Voltage: 1.7 V
• Maximum Reverse Diode Voltage: 5 V
• Maximum Power Dissipation: 210 mW
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• No. Of Channels: 1
• Optocoupler Output Type: Logic Gate
• Input Current: 5mA
• Output Voltage: 20V
• Opto Case Style: DIP
• No. Of Pins: 8
• Common Mode Ratio: 2.5k
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 516-1647-5

TEMPERATURE
Solder Reflow Thermal Profile
5
Insulation and Safety Related Specifications
Option 300 – surface mount classification is Class A in accordance with CECC 00802.
Recommended Pb-Free IR Profile
Parameter
Min. External Air Gap
(External Clearance)
Min. External
Tracking Path
(External Creepage)
Minimum Internal
Plastic Gap
(Internal Clearance)
Tracking Resistance
(Comparative
Tracking Index)
Isolation Group
ROOM
NOTES:
THE TIME FROM 25 °C to PEAK TEMPERATURE = 8 MINUTES MAX.
T
T
T
smax
smax
smin
300
200
100
T
T
25
0
p
L
0
= 200 °C, T
Note: Non-halide flux should be used.
Note: Non-halide flux should be used.
150 - 200 °C
217 °C
PREHEATING RATE 3°C + 1°C/–0.5°C/SEC.
REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC.
160°C
150°C
140°C
t 25 °C to PEAK
3 °C/SEC. MAX.
60 to 180 SEC.
smin
PREHEAT
RAMP-UP
= 150 °C
50
t
s
3°C + 1°C/–0.5°C
Symbol
260 +0/-5 °C
L(IO1)
L(IO2)
PREHEATING TIME
150°C, 90 + 30 SEC.
CTI
TIME
2.5°C ± 0.5°C/SEC.
100
TIME (SECONDS)
t
t
L
Value
p
0.08
200
IIIa
7.1
7.4
TEMP.
TIME WITHIN 5 °C of ACTUAL
PEAK TEMPERATURE
20-40 SEC.
60 to 150 SEC.
PEAK
245°C
RAMP-DOWN
6 °C/SEC. MAX.
150
Units
mm
mm
mm
V
SEC.
SEC.
30
30
50 SEC.
SOLDERING
Conditions
Measured from input terminals to output terminals,
shortest distance through air.
Measured from input terminals to output terminals,
shortest distance path along body.
Through insulation distance, conductor to conductor,
usually the direct distance between the photoemitter
and photodetector inside the optocoupler cavity.
DIN IEC 112/VDE 0303 Part 1
Material Group (DIN VDE 0110, 1/89, Table 1)
200°C
TIME
200
PEAK
TEMP.
240°C
TIGHT
TYPICAL
LOOSE
TEMP.
PEAK
230°C
250
Regulatory Information
The HCPL-2200/2219 have been
approved by the following
organizations:
UL
Recognized under UL 1577,
Component Recognition Program,
File E55361.
CSA
Approved under CSA Component
Acceptance Notice #5, File CA
88324.
IEC/EN/DIN EN 60747-5-2
Approved under:
IEC 60747-5-2:1997 + A1:2002
EN 60747-5-2:2001 + A1:2002
DIN EN 60747-5-2 (VDE 0884
(Option 060 only)
Teil 2):2003-01.