HCPL-2200-000E Avago Technologies US Inc., HCPL-2200-000E Datasheet - Page 7

• Manufacturer Part Number: HCPL-2200-000E
• Description: OPTOCOUPLER LOGIC 2.5MBD 8-DIP
• Manufacturer: Avago Technologies US Inc.

Specifications of HCPL-2200-000E

• Package / Case: 8-DIP (0.300", 7.62mm)
• Voltage - Isolation: 3750Vrms
• Number Of Channels: 1, Unidirectional
• Current - Output / Channel: 25mA
• Data Rate: 2.5MBd
• Propagation Delay High - Low @ If: 210ns @ 3mA
• Current - Dc Forward (if): 10mA
• Input Type: DC
• Output Type: Tri-State
• Mounting Type: Through Hole
• Isolation Voltage: 3750 Vrms
• Maximum Continuous Output Current: 25 mA
• Maximum Fall Time: 0.007 us
• Maximum Forward Diode Current: 10 mA
• Output Device: Logic Gate Photo IC
• Configuration: 1 Channel
• Maximum Baud Rate: 5 MBd(Typ)
• Maximum Forward Diode Voltage: 1.7 V
• Maximum Reverse Diode Voltage: 5 V
• Maximum Power Dissipation: 210 mW
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• No. Of Channels: 1
• Optocoupler Output Type: Logic Gate
• Input Current: 5mA
• Output Voltage: 20V
• Opto Case Style: DIP
• No. Of Pins: 8
• Common Mode Ratio: 2.5k
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 516-1647-5

Recommended Operating Conditions
*The initial switching threshold is 1.6 mA or less. It is recommended that 2.2 mA be used to permit
at least a 20% CTR degradation guardband.
Absolute Maximum Ratings
(No Derating Required up to 70 C)
7
Parameter
Power Supply Voltage
Enable Voltage High
Enable Voltage Low
Forward Input Current
Forward Input Current
Operating Temperature
Fan Out
Parameter
Storage Temperature
Operating Temperature
Average Forward Input Current
Peak Transient Input Current
( 1 s Pulse Width, 300 pps)
Reverse Input Voltage
Average Output Current
Supply Voltage
Three State Enable Voltage
Output Voltage
Total Package Power Dissipation
Lead Solder Temperature
Solder Reflow Temperature Profile
Symbol
I
I
F(OFF)
F(ON)
V
V
V
T
N
CC
EH
EL
A
Min.
1.6*
4.5
2.0
0
–
0
Symbol
I
I
F(TRAN)
F(AVG)
V
T
T
V
V
V
P
I
CC
260 C for 10 sec., 1.6 mm below seating plane
O
A
R
O
S
E
T
Max.
85
See Package Outline Drawings section
0.8
0.1
20
20
5
4
[1]
TTL Loads
Min.
-0.5
-0.5
-55
-40
Units
0
mA
mA
V
V
V
C
Max.
125
210
1.0
85
10
25
20
20
20
5
Units
mW
mA
mA
A
V
V
V
V
C
C
Note
1
1