OPTOCOUPLER 2.0A 250KHZ 8-DIP

HCPL-3180-000E

Manufacturer Part NumberHCPL-3180-000E
DescriptionOPTOCOUPLER 2.0A 250KHZ 8-DIP
ManufacturerAvago Technologies US Inc.
HCPL-3180-000E datasheet
 

Specifications of HCPL-3180-000E

Package / Case8-DIP (0.300", 7.62mm)Voltage - Isolation3750Vrms
Number Of Channels1, UnidirectionalCurrent - Output / Channel2.5A
Propagation Delay High - Low @ If150ns @ 10mACurrent - Dc Forward (if)16mA
Input TypeDCOutput TypeGate Driver
Mounting TypeThrough HoleIsolation Voltage3750 Vrms
Maximum Fall Time0.025 usMaximum Forward Diode Current25 mA
Minimum Forward Diode Voltage1.2 VOutput DeviceIntegrated Photo IC
Configuration1 ChannelMaximum Forward Diode Voltage1.8 V
Maximum Reverse Diode Voltage5 VMaximum Power Dissipation295 mW
Maximum Operating Temperature+ 100 CMinimum Operating Temperature- 40 C
Number Of Elements1Forward Voltage1.8V
Forward Current25mAPackage TypePDIP
Operating Temp Range-40C to 100CPower Dissipation295mW
Propagation Delay Time200nsPin Count8
MountingThrough HoleReverse Breakdown Voltage5V
Operating Temperature ClassificationIndustrialNo. Of Channels1
Optocoupler Output TypeGate DriveInput Current16mA
Output Voltage20VOpto Case StyleDIP
No. Of Pins8Common Mode Ratio10 KV/uS
Rohs CompliantYesLead Free Status / RoHS StatusLead free / RoHS Compliant
Other names516-1674-5  
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HCPL-3180 Gull Wing Surface Mount Option 300
9.65 ± 0.25
(0.380 ± 0.010)
6
8
7
1
3
2
1.19
(0.047)
MAX.
1.080 ± 0.320
(0.043 ± 0.013)
2.54
(0.100)
BSC
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES).
NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.
Solder Reflow Temperature Profile
300
PREHEATING RATE 3°C + 1°C/–0.5°C/SEC.
REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC.
200
160°C
150°C
140°C
3°C + 1°C/–0.5°C
100
PREHEATING TIME
150°C, 90 + 30 SEC.
ROOM
TEMPERATURE
0
0
50
Note: Non-halide flux should be used.
3
LAND PATTERN RECOMMENDATION
1.016 (0.040)
5
6.350 ± 0.25
(0.250 ± 0.010)
4
1.27 (0.050)
9.65 ± 0.25
1.780
(0.380 ± 0.010)
(0.070)
MAX.
7.62 ± 0.25
(0.300 ± 0.010)
3.56 ± 0.13
(0.140 ± 0.005)
0.635 ± 0.25
(0.025 ± 0.010)
0.635 ± 0.130
(0.025 ± 0.005)
PEAK
PEAK
TEMP.
TEMP.
245°C
240°C
2.5°C ± 0.5°C/SEC.
SOLDERING
TIME
30
200°C
SEC.
30
SEC.
50 SEC.
100
150
200
TIME (SECONDS)
10.9 (0.430)
2.0 (0.080)
+ 0.076
0.254
- 0.051
+ 0.003)
(0.010
- 0.002)
12° NOM.
PEAK
TEMP.
230°C
TIGHT
TYPICAL
LOOSE
250