HCPL-3180-000E Avago Technologies US Inc., HCPL-3180-000E Datasheet - Page 5

OPTOCOUPLER 2.0A 250KHZ 8-DIP

HCPL-3180-000E

Manufacturer Part Number
HCPL-3180-000E
Description
OPTOCOUPLER 2.0A 250KHZ 8-DIP
Manufacturer
Avago Technologies US Inc.
Datasheet

Specifications of HCPL-3180-000E

Package / Case
8-DIP (0.300", 7.62mm)
Voltage - Isolation
3750Vrms
Number Of Channels
1, Unidirectional
Current - Output / Channel
2.5A
Propagation Delay High - Low @ If
150ns @ 10mA
Current - Dc Forward (if)
16mA
Input Type
DC
Output Type
Gate Driver
Mounting Type
Through Hole
Isolation Voltage
3750 Vrms
Maximum Fall Time
0.025 us
Maximum Forward Diode Current
25 mA
Minimum Forward Diode Voltage
1.2 V
Output Device
Integrated Photo IC
Configuration
1 Channel
Maximum Forward Diode Voltage
1.8 V
Maximum Reverse Diode Voltage
5 V
Maximum Power Dissipation
295 mW
Maximum Operating Temperature
+ 100 C
Minimum Operating Temperature
- 40 C
Number Of Elements
1
Forward Voltage
1.8V
Forward Current
25mA
Package Type
PDIP
Operating Temp Range
-40C to 100C
Power Dissipation
295mW
Propagation Delay Time
200ns
Pin Count
8
Mounting
Through Hole
Reverse Breakdown Voltage
5V
Operating Temperature Classification
Industrial
No. Of Channels
1
Optocoupler Output Type
Gate Drive
Input Current
16mA
Output Voltage
20V
Opto Case Style
DIP
No. Of Pins
8
Common Mode Ratio
10 KV/uS
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
516-1674-5
Insulation and Safety Related Specifications
Parameter
Note: Option 300 – surface mount classification is Class A in accordance with CECC 00802.
Absolute Maximum Ratings
Parameter
5
Minimum External Air Gap
(Clearance)
Minimum External Tracking
(Creepage)
Minimum Internal Plastic Gap
(Internal Clearance)
Tracking Resistance
Isolation Group
Storage Temperature
Junction Temperature
Average Input Current
Peak Transient Input Current
(<1 µs pulse width, 300 pps)
Reverse Input Voltage
“High” Peak Output Current
“Low” Peak Output Current
Supply Voltage
Output Voltage
Output Power Dissipation
Total Power Dissipation
Lead Solder Temperature
Solder Reflow Temperature Profile
(Comparative Tracking Index)
800
700
600
500
400
300
200
100
0
0
25
T
S
50
– CASE TEMPERATURE – °C
75
100
125
P
I
S
150 175
S
(mA)
(mW)
200
Symbol
L(101)
L(102)
CTI
HCPL-3180
7.1
7.4
0.08
>175
IIIa
Symbol
T
T
I
I
V
I
I
V
V
P
P
260°C for 10 sec., 1.6 mm below seating plane
See Package Outline Drawings section
F(AVG)
F(TRAN)
OH(PEAK)
OL(PEAK)
J
S
O
T
R
CC
O(PEAK)
-V
EE
Units
mm
mm
mm
V
Min.
-55
-40
-0.5
0
Conditions
Measured from input terminals to output
terminals, shortest distance through air.
Measured from input terminals to output
terminals, shortest distance path along body.
Through insulation distance conductor to
conductor, usually the straight line distance
thickness between the emitter and detector.
DIN IEC 112/VDE 0303 Part 1
Material Group (DIN VDE 0110, 1/89, Table 1)
Max.
125
125
25
1.0
5
2.5
2.5
25
V
250
295
CC
Units
°C
°C
mA
A
V
A
A
V
V
mW
mW
Note
1
2
2
3
4

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