HCPL-260L#500 Avago Technologies US Inc., HCPL-260L#500 Datasheet - Page 5

• Manufacturer Part Number: HCPL-260L#500
• Description: OPTOCOUPLER 15MBD 3.3V 8-SMD
• Manufacturer: Avago Technologies US Inc.

Specifications of HCPL-260L#500

• Package / Case: 8-SMD Gull Wing
• Voltage - Isolation: 3750Vrms
• Number Of Channels: 1, Unidirectional
• Current - Output / Channel: 50mA
• Data Rate: 15MBd
• Propagation Delay High - Low @ If: 50ns @ 7.5mA
• Current - Dc Forward (if): 20mA
• Input Type: DC
• Output Type: Open Collector
• Mounting Type: Surface Mount, Gull Wing
• Isolation Voltage: 3750 Vrms
• Maximum Continuous Output Current: 50 mA
• Maximum Fall Time: 20 ns
• Maximum Forward Diode Current: 20 mA
• Maximum Rise Time: 45 ns
• Minimum Forward Diode Voltage: 1.4 V
• Output Device: Logic Gate Photo IC
• Configuration: 1 Channel
• Maximum Baud Rate: 15 MBps
• Maximum Forward Diode Voltage: 1.75 V
• Maximum Reverse Diode Voltage: 5 V
• Maximum Power Dissipation: 85 mW
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

Solder Reflow Temperature Profile
Recommended PB-Free IR Profile
5
TEMPERATURE
ROOM
NOTES:
THE TIME FROM 25 C to PEAK TEMPERATURE = 8 MINUTES MAX.
T
T
T
smax
300
200
100
smax
smin
25
T
T
0
p
L
0
= 200 C, T
Note: Non-halide flux should be used.
Note: Non-halide flux should be used.
150 - 200 C
217 C
PREHEATING RATE 3
REFLOW HEATING RATE 2.5
160 C
150 C
140 C
t 25 C to PEAK
3 C/SEC. MAX.
60 to 180 SEC.
smin
PREHEAT
RAMP-UP
= 150 C
t
s
260 +0/-5 C
50
TIME
3 C + 1 C/–0.5 C
PREHEATING TIME
150 C, 90 + 30 SEC.
°
C + 1
t
t
L
p
°
C/–0.5
°
C ± 0.5
2.5 C ± 0.5 C/SEC.
TIME WITHIN 5 C of ACTUAL
PEAK TEMPERATURE
20-40 SEC.
60 to 150 SEC.
100
°
C/SEC.
TIME (SECONDS)
°
RAMP-DOWN
6 C/SEC. MAX.
C/SEC.
TEMP.
PEAK
245
°
C
150
SEC.
SEC.
30
30
50 SEC.
SOLDERING
200
TIME
200
°
C
PEAK
TEMP.
240
°
C
TIGHT
TYPICAL
LOOSE
TEMP.
230
PEAK
°
C
250