HCNW138 Avago Technologies US Inc., HCNW138 Datasheet - Page 6

• Manufacturer Part Number: HCNW138
• Description: OPTOCOUPLER 1CH 100KBD 8-DIP
• Manufacturer: Avago Technologies US Inc.

Specifications of HCNW138

• Input Type: DC
• Package / Case: 8-DIP (0.400", 10.16mm)
• Voltage - Isolation: 3750Vrms
• Number Of Channels: 1, Unidirectional
• Current - Output / Channel: 60mA
• Data Rate: 100KBd
• Propagation Delay High - Low @ If: 1.6µs @ 1.6mA
• Current - Dc Forward (if): 25mA
• Output Type: Open Collector
• Mounting Type: Through Hole
• Isolation Voltage: 5000 Vrms
• Minimum Forward Diode Voltage: 1.25 V
• Output Device: Photodarlington
• Configuration: 1 Channel
• Current Transfer Ratio: 1500 %
• Maximum Baud Rate: 100 KBps
• Maximum Forward Diode Voltage: 1.85 V
• Maximum Reverse Diode Voltage: 3 V
• Maximum Input Diode Current: 20 mA
• Maximum Power Dissipation: 135 mW
• Maximum Operating Temperature: + 70 C
• Minimum Operating Temperature: 0 C
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

Solder Reflow Temperature Profile
8-Pin Widebody DIP Package with Gull Wing Surface Mount Option 300 (HCNW139/HCNW138)
TEMPERATURE
ROOM
(0.070 ± 0.006)
1.78 ± 0.15
300
200
100
0
0
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES).
NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.
PREHEATING RATE 3°C + 1°C/–0.5°C/SEC.
REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC.
160°C
150°C
140°C
8
1
(0.442 ± 0.006)
11.15 ± 0.15
7
2
50
(0.100)
3°C + 1°C/–0.5°C
6
3
BSC
2.54
PREHEATING TIME
150°C, 90 + 30 SEC.
4
5
(0.061)
MAX.
1.55
2.5°C ± 0.5°C/SEC.
(0.354 ± 0.006)
(0.158)
9.00 ± 0.15
4.00
100
TIME (SECONDS)
MAX.
(0.030 ± 0.010)
0.75 ± 0.25
TEMP.
PEAK
245°C
LAND PATTERN RECOMMENDATION
150
SEC.
SEC.
30
30
(0.051)
1.3
(0.039 ± 0.006)
(0.484 ± 0.012)
1.00 ± 0.15
50 SEC.
12.30 ± 0.30
(0.433)
11.00
SOLDERING
200°C
TIME
200
MAX.
PEAK
TEMP.
240°C
TIGHT
TYPICAL
LOOSE
(0.09)
2.29
TEMP.
PEAK
230°C
6
7° NOM.
250
(0.534)
13.56
(0.010
0.254
- 0.0051
+ 0.003)
- 0.002)
+ 0.076