HCPL-3180-560 Avago Technologies US Inc., HCPL-3180-560 Datasheet - Page 3

• Manufacturer Part Number: HCPL-3180-560
• Description: OPTOCOUPLER DRVR 2.5A VDE 8-SMD
• Manufacturer: Avago Technologies US Inc.

Specifications of HCPL-3180-560

• Package / Case: 8-SMD Gull Wing
• Voltage - Isolation: 3750Vrms
• Number Of Channels: 1, Unidirectional
• Current - Output / Channel: 2.5A
• Propagation Delay High - Low @ If: 150ns @ 10mA
• Current - Dc Forward (if): 16mA
• Input Type: DC
• Output Type: Gate Driver
• Mounting Type: Surface Mount
• Isolation Voltage: 3750 Vrms
• Maximum Fall Time: 25 ns
• Maximum Forward Diode Current: 25 mA
• Maximum Rise Time: 25 ns
• Minimum Forward Diode Voltage: 1.2 V
• Output Device: Integrated Photo IC
• Configuration: 1 Channel
• Maximum Forward Diode Voltage: 1.8 V
• Maximum Reverse Diode Voltage: 5 V
• Maximum Power Dissipation: 295 mW
• Maximum Operating Temperature: + 100 C
• Minimum Operating Temperature: - 40 C
• Number Of Elements: 1
• Forward Voltage: 1.8V
• Forward Current: 25mA
• Package Type: PDIP SMD
• Operating Temp Range: -40C to 100C
• Power Dissipation: 295mW
• Propagation Delay Time: 200ns
• Pin Count: 8
• Mounting: Surface Mount
• Reverse Breakdown Voltage: 5V
• Operating Temperature Classification: Industrial
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Contains lead / RoHS non-compliant

Solder Reflow Temperature Profile
3
HCPL-3180 Gull Wing Surface Mount Option 300
TEMPERATURE
ROOM
(0.043 ± 0.013)
1.080 ± 0.320
300
200
100
0
Note: Non-halide flux should be used.
0
(0.047)
MAX.
1.19
PREHEATING RATE 3°C + 1°C/–0.5°C/SEC.
REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC.
160°C
150°C
140°C
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES).
NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.
1
8
(0.100)
2.54
BSC
(0.380 ± 0.010)
50
9.65 ± 0.25
7
2
3°C + 1°C/–0.5°C
150°C, 90 + 30 SEC.
PREHEATING TIME
6
3
2.5°C ± 0.5°C/SEC.
4
5
(0.070)
MAX.
100
1.780
TIME (SECONDS)
(0.140 ± 0.005)
(0.250 ± 0.010)
6.350 ± 0.25
3.56 ± 0.13
TEMP.
PEAK
245°C
(0.025 ± 0.005)
0.635 ± 0.130
150
LAND PATTERN RECOMMENDATION
SEC.
SEC.
30
30
1.27 (0.050)
50 SEC.
SOLDERING
(0.380 ± 0.010)
(0.300 ± 0.010)
(0.025 ± 0.010)
0.635 ± 0.25
9.65 ± 0.25
1.016 (0.040)
7.62 ± 0.25
200°C
TIME
200
PEAK
TEMP.
240°C
TIGHT
TYPICAL
LOOSE
TEMP.
PEAK
230°C
250
12° NOM.
10.9 (0.430)
2.0 (0.080)
(0.010
0.254
+ 0.003)
- 0.002)
+ 0.076
- 0.051