HCPL-263N-020E Avago Technologies US Inc., HCPL-263N-020E Datasheet - Page 5

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HCPL-263N-020E

Manufacturer Part Number
HCPL-263N-020E
Description
OPTOCOUPLER 2CH 10MBD UL 8-DIP
Manufacturer
Avago Technologies US Inc.
Datasheet

Specifications of HCPL-263N-020E

Voltage - Isolation
5000Vrms
Number Of Channels
2, Unidirectional
Current - Output / Channel
50mA
Data Rate
10MBd
Propagation Delay High - Low @ If
53ns @ 3.5mA
Current - Dc Forward (if)
10mA
Input Type
DC
Output Type
Open Collector
Mounting Type
Through Hole
Package / Case
8-DIP (0.300", 7.62mm)
No. Of Channels
2
Optocoupler Output Type
Logic Gate
Input Current
10mA
Output Voltage
7V
Opto Case Style
DIP
No. Of Pins
8
Peak Reflow Compatible (260 C)
Yes
Isolation Voltage
5kV
Number Of Elements
2
Baud Rate
10Mbps
Forward Voltage
1.6V
Forward Current
10mA
Output Current
50mA
Package Type
PDIP
Operating Temp Range
-40C to 85C
Power Dissipation
60mW
Propagation Delay Time
100ns
Pin Count
8
Mounting
Through Hole
Reverse Breakdown Voltage
3V
Operating Temperature Classification
Industrial
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HCPL-263N-020E
Manufacturer:
AVAGO
Quantity:
20 000
TEMPERATURE
HCPL-061A/061N/063A/063N Outline Drawing
Figure 3. 8-Pin Small Outline Package Device Drawing.
Recommended Pb-Free IR Profile
5
Solder Reflow Thermal Profile
Note: Non-halide flux should be used.
ROOM
(0.155 ± 0.005)
(0.016 ± 0.003)
3.937 ± 0.127
0.406 ± 0.076
(0.125 ± 0.005)
* TOTAL PACKAGE LENGTH (INCLUSIVE OF MOLD FLASH)
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES) MAX.
3.175 ± 0.127
5.207 ± 0.254 (0.205 ± 0.010)
NOTES:
THE TIME FROM 25 °C to PEAK TEMPERATURE = 8 MINUTES MAX.
T
T
T
smax
smax
smin
300
200
100
T
T
25
p
L
0
= 200 °C, T
0
150 - 200 °C
217 °C
Note: Non-halide flux should be used.
PREHEATING RATE 3°C + 1°C/–0.5°C/SEC.
REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC.
160°C
150°C
140°C
8
1
* 5.080 ± 0.127
(0.200 ± 0.005)
t 25 °C to PEAK
3 C/SEC. MAX.
60 to 180 SEC.
smin
7
2
PREHEAT
YWW
RAMP-UP
= 150 °C
XXX
6
3
t
s
50
260 +0/-5 °C
3°C + 1°C/–0.5°C
5
4
PREHEATING TIME
150°C, 90 + 30 SEC.
TIME
(0.050)
1.270
(0.236 ± 0.008)
(0.060)
5.994 ± 0.203
1.524
2.5 C ± 0.5°C/SEC.
BSC
t
TYPE NUMBER
(LAST 3 DIGITS)
DATE CODE
t
L
p
100
TIME (SECONDS)
TIME WITHIN 5 °C of ACTUAL
PEAK TEMPERATURE
20-40 SEC.
60 to 150 SEC.
RAMP-DOWN
6 °C/SEC. MAX.
TEMP.
PEAK
245°C
150
NOTE: FLOATING LEAD PROTRUSION IS 0.15 mm (6 mils) MAX.
LAND PATTERN RECOMMENDATION
7
SEC.
SEC.
30
(0.012)
30
0.305
50 SEC.
MIN.
SOLDERING
0.64 (0.025)
45 X
200°C
TIME
200
(0.008 ± 0.004)
0.203 ± 0.102
PEAK
TEMP.
240°C
(0.017)
0.432
1.9 (0.075)
TIGHT
TYPICAL
LOOSE
TEMP.
PEAK
230°C
7.49 (0.295)
(0.009 ± 0.001)
0.228 ± 0.025
250
Regulatory Information
The HCPL-261A and HCPL-261N
families have been approved by the
following organizations:
UL
Recognized under UL 1577, Com-
ponent Recognition Program, File
E55361.
CSA
Approved under CSA Component
Acceptance Notice #5, File CA
88324.
IEC/EN/DIN EN 60747-5-2
Approved under:
IEC 60747-5-2:1997 + A1:2002
EN 60747-5-2:2001 + A1:2002
DIN EN 60747-5-2 (VDE 0884
(Option 060 only)
Teil 2):2003-01.

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