PC817XPJ000F Sharp Microelectronics, PC817XPJ000F Datasheet

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PC817XPJ000F

Manufacturer Part Number
PC817XPJ000F
Description
PHOTOCOUPLER TRAN OUT 4-SMD
Manufacturer
Sharp Microelectronics
Datasheet

Specifications of PC817XPJ000F

Number Of Channels
1
Input Type
DC
Voltage - Isolation
5000Vrms
Current Transfer Ratio (min)
50% @ 5mA
Current Transfer Ratio (max)
600% @ 5mA
Voltage - Output
80V
Current - Output / Channel
50mA
Current - Dc Forward (if)
50mA
Vce Saturation (max)
200mV
Output Type
Transistor
Mounting Type
Surface Mount
Package / Case
4-SMD
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PC817XPJ000F
Manufacturer:
LITTELFUSE
Quantity:
40 000
■ Description
■ Features
PC817XJ0000F
Series
(model No. PC847XJ0000F Series)
coupled to a phototransistor.
spacing option and SMT gullwing lead-form option.
600% at input current of 5mA.
1. 4pin DIP package
2. Double transfer mold package (Ideal for Flow Solder-
3. High collector-emitter voltage (V
4. Current transfer ratio (CTR : MIN. 50% at I
5. Several CTR ranks available
6. High isolation voltage between input and output
7. Lead-free and RoHS directive compliant
4-channel package type is also available.
Notice The content of data sheet is subject to change without prior notice.
PC817XJ0000F Series contains an IRED optically
It is packaged in a 4pin DIP, available in wide-lead
Input-output isolation voltage(rms) is 5.0kV.
Collector-emitter voltage is 80V and CTR is 50% to
ing)
V
(V
CE
iso(rms)
=5V)
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
: 5.0 kV)
CEO
:80V)
F
=5 mA,
1
■ Agency approvals/Compliance
■ Applications
DIP 4pin General Purpose
Photocoupler
1. Recognized by UL1577 (Double protection isolation),
2. Package resin : UL flammability grade
1. I/O isolation for MCUs (Micro Controller Units)
2. Noise suppression in switching circuits
3. Signal transmission between circuits of different po-
file No. E64380 (as model No. PC817)
(94V-0)
tentials and impedances
PC817XJ0000F Series
Sheet No.: D2-A03102EN
© SHARP Corporation
Date Jun. 30. 2005

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PC817XPJ000F Summary of contents

Page 1

PC817XJ0000F Series ∗ 4-channel package type is also available. (model No. PC847XJ0000F Series) ■ Description PC817XJ0000F Series contains an IRED optically coupled to a phototransistor packaged in a 4pin DIP, available in wide-lead spacing option and SMT gullwing ...

Page 2

Internal Connection Diagram 1 2 ■ Outline Dimensions 1. Through-Hole [ex. PC817XJ0000F] Rank mark Anode mark Factory identification mark Date code C817 2 3 ±0.5 6.5 ±0.3 7.62 Epoxy resin ±0.1 0.26 θ θ θ : ...

Page 3

Date code (2 digit) 1st digit Year of production A.D. Mark A.D Mark 1990 A 2002 P 1991 B 2003 R 1992 C 2004 S 1993 D 2005 T 1994 E 2006 U 1995 F 2007 V 1996 H 2008 ...

Page 4

Absolute Maximum Ratings Parameter Symbol Forward current Peak forward current I FM Reverse voltage V R Power dissipation P Collector-emitter voltage V CEO Emitter-collector voltage V ECO Collector current I C Collector power dissipation P C ...

Page 5

... PC817XJ0000F PC817X1J000F PC817X2J000F PC817X3J000F PC817X4J000F Model No. PC817X5J000F PC817X6J000F PC817X7J000F PC817X8J000F PC817X9J000F PC817X0J000F SMT Gullwing Lead Form Sleeve Package 100pcs/sleeve PC817XIJ000F PC817XPJ000F PC817XI1J00F PC817XP1J00F PC817XI2J00F PC817XP2J00F PC817XI3J00F PC817XP3J00F PC817XI4J00F PC817XP4J00F Model No. PC817XI5J00F PC817XP5J00F PC817XI6J00F PC817XP6J00F PC817XI7J00F PC817XP7J00F PC817XI8J00F PC817XP8J00F PC817XI9J00F PC817XP9J00F ...

Page 6

Fig.1 Forward Current vs. Ambient Temperature − Ambient temperature T Fig.3 Collector Power Dissipation vs. Ambient Temperature 250 200 150 100 50 0 − Ambient temperature T ...

Page 7

Fig.7 Forward Current vs. Forward Voltage T =75˚C a 50˚C 100 0.5 1 1.5 2 Forward voltage V Fig.9 Relative Current Transfer Ratio vs. Ambient Temperature 150 I =1mA 100 ...

Page 8

Fig.13 Response Time vs. Load Resistance V = =2mA C T =25˚C a 100 0.1 0.01 0.1 1 Load resistance R Fig.15 Frequency Response 0 −10 R =10kΩ L − ...

Page 9

Design Considerations ● Design guide While operating at I <1.0mA, CTR variation may increase. F Please make design considering this fact. This product is not designed against irradiation and incorporates non-coherent IRED. ● Degradation In general, the emission of ...

Page 10

Manufacturing Guidelines ● Soldering Method Reflow Soldering: Reflow soldering should follow the temperature profile shown below. Soldering should not exceed the curve of temperature profile and time. Please don't solder more than twice. (˚C) 300 Terminal : 260˚C peak ...

Page 11

Cleaning instructions Solvent cleaning: Solvent temperature should be 45˚C or below Immersion time should be 3 minutes or less Ultrasonic cleaning: The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time, ...

Page 12

Package specification ● Sleeve package 1. Through-Hole or SMT Gullwing Lead-Form Package materials Sleeve : HIPS (with anti-static material) Stopper : Styrene-Elastomer Package method MAX. 100pcs of products shall be packaged in a sleeve. Both ends shall be closed ...

Page 13

Tape and Reel package 1. SMT Gullwing Package materials Carrier tape : PS Cover tape : PET (three layer system) Reel : PS Carrier tape structure and Dimensions F Dimensions List A ±0.3 16.0 7.5 H ±0.1 10.4 0.4 ...

Page 14

Wide SMT Gullwing Package materials Carrier tape : PS Cover tape : PET (three layer system) Reel : PS Carrier tape structure and Dimensions Dimensions List A ±0.3 24.0 11.5 H ±0.1 12.4 0.4 Reel structure and Dimensions e ...

Page 15

Important Notices · The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for ...

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