PC851XPJ000F Sharp Microelectronics, PC851XPJ000F Datasheet
PC851XPJ000F
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PC851XPJ000F Summary of contents
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PC851XJ0000F Series ■ Description PC851XJ0000F Series contains an IRED optically coupled to a phototransistor packaged in a 4-pin DIP, available in SMT gull- wing lead-form option. Input-output isolation voltage(rms) is 5.0kV. Collector-emitter voltage is 350V. ■ Features 1. ...
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Internal Connection Diagram 1 2 ■ Outline Dimensions 1. Through-Hole [ex. PC851XJ0000F] Anode mark Factory identification mark Date code 1 4 PC851 3 2 ±0.5 6.5 ±0.3 7.62 Epoxy resin θ θ θ 13˚ Product mass ...
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Date code (2 digit) 1st digit Year of production A.D. Mark A.D Mark 1990 A 2002 P 1991 B 2003 R 1992 C 2004 S 1993 D 2005 T 1994 E 2006 U 1995 F 2007 V 1996 H 2008 ...
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... Model Line-up Lead Form Through Hole Sleeve Package 100pcs/sleeve Model No. PC851XJ0000F PC851XIJ000F Please contact a local SHARP sales representative to inquire about production status. SMT Gullwing Taping 2 000pcs/reel PC851XPJ000F 4 PC851XJ0000F Series Sheet No.: D2-A03402EN ...
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Absolute Maximum Ratings Parameter Symbol Forward current Peak forward current I FM Reverse voltage V R Power dissipation P Collector-emitter voltage V CEO Emitter-collector voltage V ECO Collector current I C Collector power dissipation P C ...
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Fig.1 Forward Current vs. Ambient Temperature − Ambient temperature T Fig.3 Collector Power Dissipation vs. Ambient Temperature 250 200 150 100 50 0 − Ambient temperature T ...
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Fig.7 Current Transfer Ratio vs. Forward Current 200 100 0 0.1 1 Forward current I F Fig.9 Relative Current Transfer Ratio vs. Ambient Temperature 150 100 50 0 − Ambient temperature T Fig.11 Collector Dark Current vs. ...
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Fig.13 Response Time vs. Load Resistance V = =2mA C T =25˚C a 100 10 1 0.1 0.01 0.1 1 Load resistance R L Fig.15 Frequency Response 0 R =10kΩ L −10 − Frequency f (kHz) ...
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Design Considerations ● Design guide While operating at I <1.0mA, CTR variation may increase. F Please make design considering this fact. This product is not designed against irradiation and incorporates non-coherent IRED. ● Degradation In general, the emission of ...
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Manufacturing Guidelines ● Soldering Method Reflow Soldering: Reflow soldering should follow the temperature profile shown below. Soldering should not exceed the curve of temperature profile and time. Please don't solder more than twice. (˚C) 300 Terminal : 260˚C peak ...
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Cleaning instructions Solvent cleaning: Solvent temperature should be 45˚C or below Immersion time should be 3 minutes or less Ultrasonic cleaning: The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time, ...
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Package specification ● Sleeve package Package materials Sleeve : HIPS (with anti-static material) Stopper : Styrene-Elastomer Package method MAX. 100pcs of products shall be packaged in a sleeve. Both ends shall be closed by tabbed and tabless stoppers. The ...
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Tape and Reel package Package materials Carrier tape : PS Cover tape : PET (three layer system) Reel : PS Carrier tape structure and Dimensions F Dimensions List A ±0.3 16.0 7.5 H ±0.1 10.4 0.4 Reel structure and ...
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Important Notices · The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for ...