PC81713NSZ Sharp Microelectronics, PC81713NSZ Datasheet

PHOTOCOUPLER LO IF TRAN 4-DIP

PC81713NSZ

Manufacturer Part Number
PC81713NSZ
Description
PHOTOCOUPLER LO IF TRAN 4-DIP
Manufacturer
Sharp Microelectronics
Datasheet

Specifications of PC81713NSZ

Number Of Channels
1
Input Type
DC
Voltage - Isolation
5000Vrms
Current Transfer Ratio (min)
100% @ 500µA
Current Transfer Ratio (max)
600% @ 500µA
Voltage - Output
80V
Current - Output / Channel
2.5mA
Current - Dc Forward (if)
10mA
Vce Saturation (max)
200mV
Output Type
Transistor
Mounting Type
Through Hole
Package / Case
4-DIP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Other names
425-1462-5
■ Description
■ Features
PC8171xNSZ
Series
coupled to a phototransistor.
ing lead-form option.
600% at input current of 0.5mA and CMR is MIN.
10kV/µs.
1. 4pin DIP package
2. Double transfer mold package (Ideal for Flow Solder-
3. Low input current type (I
4. High collector-emitter voltage(V
5. High noise immunity due to high common rejection
6. High isolation voltage between input and output
Notice The content of data sheet is subject to change without prior notice.
PC8171xNSZ Series contains an IRED optically
It is packaged in a 4pin DIP, available in SMT gullw-
Input-output isolation voltage(rms) is 5.0kV.
Collector-emitter voltage is 80V
ing)
voltage (CMR : MIN. 10kV/µs)
(V
(*)Up to Date code"P7"(July 2002)V
iso(rms)
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
: 5.0 kV)
F
=0.5mA)
CEO
: 70V
CEO
(*)
.
, CTR is 100% to
: 80V
(*)
)
1
■ Agency approvals/Compliance
■ Applications
DIP 4pin High CMR,
Low Input Current
Photocoupler
1. Recognized by UL1577 (Double protection isolation),
2. Package resin : UL flammability grade (94V-0)
1. Programmable controllers
2. Facsimiles
3. Telephones
file No. E64380 (as model No. PC8171)
PC8171xNSZ Series
Sheet No.: D2-A03301EN
© SHARP Corporation
Date Sep. 30. 2003

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PC81713NSZ Summary of contents

Page 1

PC8171xNSZ Series ■ Description PC8171xNSZ Series contains an IRED optically coupled to a phototransistor packaged in a 4pin DIP, available in SMT gullw- ing lead-form option. Input-output isolation voltage(rms) is 5.0kV. (*) Collector-emitter voltage is 80V 600% at ...

Page 2

Internal Connection Diagram 1 2 ■ Outline Dimensions 1. Through-Hole [ex. PC8171xNSZ] Rank mark Anode mark Factory identification mark Date code ±0.5 6.5 ±0.3 7.62 Epoxy resin θ θ θ : ...

Page 3

Date code (2 digit) 1st digit Year of production A.D. Mark A.D Mark 1990 A 2002 P 1991 B 2003 R 1992 C 2004 S 1993 D 2005 T 1994 E 2006 U 1995 F 2007 V 1996 H 2008 ...

Page 4

Absolute Maximum Ratings Parameter Symbol Forward current Peak forward current I FM Reverse voltage V R Power dissipation P *4 Collector-emitter voltage V CEO Emitter-collector voltage V ECO Collector current I C Collector power dissipation P ...

Page 5

... Through-Hole SMT Gullwing Sleeve Taping Package 100pcs/sleeve 2000pcs/reel PC81710NSZ PC81710NIP PC81711NSZ PC81711NIP PC81712NSZ PC81712NIP Model No. PC81713NSZ PC81713NIP PC81715NSZ PC81715NIP PC81716NSZ PC81716NIP PC81718NSZ PC81718NIP Please contact a local SHARP sales representative to inquire about production status and Lead-Free options. I [mA] C Rank mark =0.5mA, V =5V ...

Page 6

Fig.1 Test Circuit for Common Mode Rejection Voltage Fig.2 Forward Current vs. Ambient Temperature − Ambient temperature T Fig.4 Collector Power Dissipation vs. Ambient Temperature 200 150 100 ...

Page 7

Fig.6 Peak Forward Current vs. Duty Ratio 2 000 Pulse width≤100µ 000 500 200 100 −3 − Duty ratio Fig.8 Current Transfer Ratio vs. Forward Current 800 ...

Page 8

Fig.12 Collector Dark Current vs. Ambient Temperature −5 10 =50V V CE −6 10 −7 10 −8 10 −9 10 −10 10 −11 10 −30 −20 − Ambient temperature T Fig.14 Response Time vs. ...

Page 9

Design Considerations ● Design guide While operating at I <0.5mA, CTR variation may increase. F Please make design considering this fact. In case that some sudden big noise caused by voltage variation is provided between primary and secondary terminals ...

Page 10

Manufacturing Guidelines ● Soldering Method Reflow Soldering: Reflow soldering should follow the temperature profile shown below. Soldering should not exceed the curve of temperature profile and time. Please don't solder more than twice. (˚C) 300 Terminal : 260˚C peak ...

Page 11

Cleaning instructions Solvent cleaning: Solvent temperature should be 45˚C or below Immersion time should be 3minutes or less Ultrasonic cleaning: The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time, size ...

Page 12

Package specification ● Sleeve package Package materials Sleeve : HIPS (with anti-static material) Stopper : Styrene-Elastomer Package method MAX. 100pcs of products shall be packaged in a sleeve. Both ends shall be closed by tabbed and tabless stoppers. The ...

Page 13

Tape and Reel package Package materials Carrier tape : PS Cover tape : PET (three layer system) Reel : PS Carrier tape structure and Dimensions F Dimensions List A ±0.3 16.0 7.5 H ±0.1 10.4 0.4 Reel structure and ...

Page 14

Important Notices · The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for ...

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