PC817X2 Sharp Microelectronics, PC817X2 Datasheet

PHOTOCOUPLER TRAN OUT 4-DIP

PC817X2

Manufacturer Part Number
PC817X2
Description
PHOTOCOUPLER TRAN OUT 4-DIP
Manufacturer
Sharp Microelectronics
Datasheet

Specifications of PC817X2

Number Of Channels
1
Input Type
DC
Voltage - Isolation
5000Vrms
Current Transfer Ratio (min)
50% @ 5mA
Current Transfer Ratio (max)
600% @ 5mA
Voltage - Output
80V
Current - Output / Channel
50mA
Current - Dc Forward (if)
50mA
Vce Saturation (max)
200mV
Output Type
Transistor
Mounting Type
Through Hole
Package / Case
4-DIP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Other names
425-1466-5

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■ Description
■ Features
PC817X Series
(model No. PC847X Series)
to a phototransistor.
spacing option and SMT gullwing lead-form option.
to 600% at input current of 5mA.
1. 4pin DIP package
2. Double transfer mold package (Ideal for Flow Solder-
3. High collector-emitter voltage (V
4. Current transfer ratio (CTR : MIN. 50% at I
5. Several CTR ranks available
6. High isolation voltage between input and output
4-channel package type is also available.
Notice The content of data sheet is subject to change without prior notice.
(*) Up to Date code "P7" (July 2002) V
PC817X Series contains an IRED optically coupled
It is packaged in a 4pin DIP, available in wide-lead
Input-output isolation voltage(rms) is 5.0kV.
Collector-emitter voltage is 80V
ing)
V
(V
CE
iso(rms)
From the production Date code "J5" (May 1997) to "P7" (July
2002), however the products were screened by BV
=5V)
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
: 5.0 kV)
CEO
(*)
CEO
: 35V.
and CTR is 50%
:80V
(*)
)
F
CEO
=5 mA,
≥70V.
1
■ Agency approvals/Compliance
■ Applications
DIP 4pin General Purpose
Photocoupler
1. Recognized by UL1577 (Double protection isolation),
2. Package resin : UL flammability grade
1. I/O isolation for MCUs (Micro Controller Units)
2. Noise suppression in switching circuits
3. Signal transmission between circuits of different po-
file No. E64380 (as model No. PC817)
(94V-0)
tentials and impedances
PC817X Series
Sheet No.: D2-A03101EN
© SHARP Corporation
Date Sep. 30. 2003

Related parts for PC817X2

PC817X2 Summary of contents

Page 1

PC817X Series ∗ 4-channel package type is also available. (model No. PC847X Series) ■ Description PC817X Series contains an IRED optically coupled to a phototransistor packaged in a 4pin DIP, available in wide-lead spacing option and SMT gullwing ...

Page 2

Internal Connection Diagram 1 2 ■ Outline Dimensions 1. Through-Hole [ex. PC817X] Rank mark Anode mark Factory identification mark Date code C817 2 3 ±0.5 6.5 ±0.3 7.62 Epoxy resin ±0.1 0.26 θ θ θ : ...

Page 3

Date code (2 digit) 1st digit Year of production A.D. Mark A.D Mark 1990 A 2002 P 1991 B 2003 R 1992 C 2004 S 1993 D 2005 T 1994 E 2006 U 1995 F 2007 V 1996 H 2008 ...

Page 4

Absolute Maximum Ratings Parameter Symbol Forward current Peak forward current I FM Reverse voltage V R Power dissipation P Collector-emitter voltage V CEO Emitter-collector voltage V ECO Collector current I C Collector power dissipation P C ...

Page 5

... Model Line-up Lead Form Through-Hole Wide Through-Hole Sleeve Package 100pcs/sleeve PC817X PC817XF PC817X1 PC817XF1 PC817X2 PC817XF2 PC817X3 PC817XF3 PC817X4 PC817XF4 Model No. PC817X5 PC817XF5 PC817X6 PC817XF6 PC817X7 PC817XF7 PC817X8 PC817XF8 PC817X9 PC817XF9 PC817X0 PC817XF0 Please contact a local SHARP sales representative to inquire about production status and Lead-Free options. ...

Page 6

Fig.1 Forward Current vs. Ambient Temperature − Ambient temperature T Fig.3 Collector Power Dissipation vs. Ambient Temperature 250 200 150 100 50 0 − Ambient temperature T ...

Page 7

Fig.7 Forward Current vs. Forward Voltage 500 =75˚ 200 50˚C 100 0.5 1.0 1.5 2.0 Forward voltage V Fig.9 Relative Current Transfer Ratio vs. Ambient Temperature 150% =1mA ...

Page 8

Fig.13 Response Time vs. Load Resistance 500 = =2mA I 200 C =25˚ 100 0.5 0.2 0.1 0.01 0.1 1 Load resistance R Fig.15 Frequency Response ...

Page 9

Design Considerations ● Design guide While operating at I <1.0mA, CTR variation may increase. F Please make design considering this fact. This product is not designed against irradiation and incorporates non-coherent IRED. ● Degradation In general, the emission of ...

Page 10

Manufacturing Guidelines ● Soldering Method Reflow Soldering: Reflow soldering should follow the temperature profile shown below. Soldering should not exceed the curve of temperature profile and time. Please don't solder more than twice. (˚C) 300 Terminal : 260˚C peak ...

Page 11

Cleaning instructions Solvent cleaning: Solvent temperature should be 45˚C or below Immersion time should be 3minutes or less Ultrasonic cleaning: The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time, size ...

Page 12

Package specification ● Sleeve package 1. Through-Hole or SMT Gullwing Lead-Form Package materials Sleeve : HIPS (with anti-static material) Stopper : Styrene-Elastomer Package method MAX. 100pcs of products shall be packaged in a sleeve. Both ends shall be closed ...

Page 13

Tape and Reel package 1. SMT Gullwing Package materials Carrier tape : PS Cover tape : PET (three layer system) Reel : PS Carrier tape structure and Dimensions F Dimensions List A ±0.3 16.0 7.5 H ±0.1 10.4 0.4 ...

Page 14

Wide SMT Gullwing Package materials Carrier tape : PS Cover tape : PET (three layer system) Reel : PS Carrier tape structure and Dimensions Dimensions List A ±0.3 24.0 11.5 H ±0.1 12.4 0.4 Reel structure and Dimensions e ...

Page 15

Important Notices · The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for ...

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