PC844IJ1 Sharp Microelectronics, PC844IJ1 Datasheet
PC844IJ1
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PC844IJ1 Summary of contents
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PC844XJ0000F Series ∗ 1-channel package type is also available. (model No. PC814XJ0000F Series) ■ Description PC844XJ0000F Series contains an IRED optically coupled to a phototransistor packaged in a 4-channel 16pin DIP. Input-output isolation voltage(rms) is 5.0kV. Collector-emitter voltage ...
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Internal Connection Diagram ■ Outline Dimensions ±0.3 1.2 ±0.2 0 PC844 ±0.25 Date code 2.54 Rank mark ...
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Date code (2 digit) 1st digit Year of production A.D. Mark A.D Mark 1990 A 2002 P 1991 B 2003 R 1992 C 2004 S 1993 D 2005 T 1994 E 2006 U 1995 F 2007 V 1996 H 2008 ...
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Absolute Maximum Ratings Parameter Symbol Forward current Peak forward current I FM Power dissipation P Collector-emitter voltage V CEO Emitter-collector voltage V ECO Collector current I C Collector power dissipation P C Total power dissipation P ...
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Model Line-up Sleeve Package Rank mark 25 pcs/sleeve PC844XJ0000F with or without Model No. PC844X1J000F Please contact a local SHARP sales representative to inquire about production status. I [mA =±1.0mA, V =5V, T =25˚ ...
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Fig.1 Forward Current vs. Ambient Temperature − Ambient temperature T Fig.3 Collector Power Dissipation vs. Ambient Temperature 250 200 150 100 50 0 − Ambient temperature T ...
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Fig.7 Current Transfer Ratio vs. Forward Current 140 120 100 0.1 0.2 0 Forward current I F Fig.9 Relative Current Transfer Ratio vs. Ambient Temperature 150 100 50 0 − ...
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Fig.13 Response Time vs. Load Resistance V = =2mA C T =25˚C a 100 0.1 0.01 0.1 1 Load resistance R Fig.15 Frequency Response 5 0 −5 R =10kΩ 1kΩ L −10 ...
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Design Considerations ● Design guide While operating at I <1.0mA, CTR variation may increase. F Please make design considering this fact. This product is not designed against irradiation and incorporates non-coherent IRED. ● Degradation In general, the emission of ...
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Manufacturing Guidelines ● Soldering Method Flow Soldering : Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the below listed guidelines. Flow soldering should be completed below 270˚C and within 10s. Preheating is ...
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Package specification ● Sleeve package Package materials Sleeve : HIPS (with anti-static material) Stopper : Styrene-Elastomer Package method MAX. 25pcs of products shall be packaged in a sleeve. Both ends shall be closed by tabbed and tabless stoppers. The ...
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Important Notices · The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for ...