PHOTOCOUPLER TRANS-OUT 4-SMD

TLP181

Manufacturer Part NumberTLP181
DescriptionPHOTOCOUPLER TRANS-OUT 4-SMD
ManufacturerToshiba
TLP181 datasheets
 


Specifications of TLP181

Number Of Channels1Input TypeDC
Voltage - Isolation3750VrmsCurrent Transfer Ratio (min)50% @ 5mA
Current Transfer Ratio (max)600% @ 5mAVoltage - Output80V
Current - Output / Channel50mACurrent - Dc Forward (if)50mA
Vce Saturation (max)400mVOutput TypeTransistor
Mounting TypeSurface MountPackage / Case4-SMD
Lead Free Status / RoHS StatusContains lead / RoHS non-compliant  
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2011-3
PRODUCT GUIDE
Photocouplers and Photorelays
S E M I C O N D U C T O R
h t t p : / / w w w . s e m i c o n . t o s h i b a . c o . j p / e n g

TLP181 Summary of contents

  • Page 1

    PRODUCT GUIDE Photocouplers and Photorelays ...

  • Page 2

    ... IEC380/VDE0806, IEC60950/EN60950 and IEC60065/EN60065. Small-Package Products Toshiba offers a wide variety of photocouplers in a small package to meet the space-saving requirement of increasingly smaller and thinner end products. Packaging options include mini-flat packages (MFSOPs) and half-pitch (1.27 mm) mini-flat SOP packages ...

  • Page 3

    ... TLP176A MOSFET (Photorelay) TLP176D 2.54SOP4 MOSFET (Photorelay) TLP176G 2.54SOP4 MOSFET (Photorelay) TLP176GA 2.54SOP4 MOSFET (Photorelay) TLP179D 2.54SOP4 MOSFET (Photorelay) TLP180 MFSOP6 Transistor TLP181 MFSOP6 Transistor SO6 TLP184 Transistor TLP185 SO6 Transistor TLP190B MFSOP6 Photovoltaic TLP191B MFSOP6 Photovoltaic TLP192A 2.54SOP6 MOSFET (Photorelay) TLP192G 2 ...

  • Page 4

    Product Index Part Number Package TLP3212 SSOP4 MOSFET (Photorelay) SSOP4 MOSFET (Photorelay) TLP3213 TLP3214 SSOP4 MOSFET (Photorelay) SSOP4 TLP3215 MOSFET (Photorelay) TLP3216 SSOP4 MOSFET (Photorelay) SSOP4 TLP3217 MOSFET (Photorelay) TLP3218 SSOP4 MOSFET (Photorelay) TLP3219 SSOP4 MOSFET (Photorelay) SSOP4 MOSFET ...

  • Page 5

    ... New Products Small Surface-Mount IC-Output Photocouplers in the SO8 Package Toshiba is expanding its portfolio of IC-output photocouplers in the small and thin SO8 package. To meet customer needs, Toshiba has released photocouplers featuring various data rates, dual-channel configurations and power device drivers. Data rate Part Number (typ ...

  • Page 6

    ... TLP2108 2-ch IC-Output Photocouplers for IPM Drive Applications Toshiba offers IC-output photocouplers ideal for IPM drive applications. Compared to the conventional TLP114A (IGM), these IC-output photocouplers provide shorter propagation delay times, a wider operating temperature range and digital output. Thus, they help to simplify system design and improve system performance ...

  • Page 7

    ... High-ION Photorelays: TLP354x Series (Under Development) Toshiba is now developing the TLP354x Series in the DIP6 package targeting applications that deal with relatively large current. Housed in the DIP6 package, the TLP354x photorelays allow B and C connections, enabling the switching of 8-A, 7-A, 6-A and 4-A dc current respectively ...

  • Page 8

    ... General-Purpose Photorelays Certified for Reinforced Insulation: TLP220 Series and TLP221A (Under Development) Toshiba is now developing the TLP220 Series and the TLP221 targeting factory equipment applications, and wattmeter and smart meter applications for the monitoring of electrical energy consumption. These photorelays meet the requirements for high isolation voltage between input and output, as well as for international safety standards certification ...

  • Page 9

    Photocoupler Product Tree Photocoupler Product Tree Package DIP4 DIP6 DIP8 DIP16 SO8 SOP4 2.54SOP4 2.54SOP6 Transistor-Output Photorelays Photorelays Thyristor- and Triac-Output Triac Output Thyristor Output ZC DIP4 DIP6 DIP8 DIP16 ● ≥ 7-mm clearance/creepage; ≥ 0.4-mm isolation thickness SDIP6 ...

  • Page 10

    ... Specifications subject to change without notice. For the latest information, please contact your nearest Toshiba sales representative. SOP16 SOP16 SO6 SO16 MFSOP6 Quad Single Quad Single TLP281-4 TLP291-4* TLP131 TLP285-4 TLP185* TLP181 TLP124 TLP137 TLP280-4 TLP290-4* TLP284-4 TLP184* TLP130 TLP180 TLP126 TLP127 10 DIP6 DIP4 DIP8 ...

  • Page 11

    ... Mini-flat MFSOP6 TLP137 Low input drive current Internal base connection Mini-flat MFSOP6 TLP181 (4) SEMKO-approved TST part recm’ SOP4 Lead pitch = 1.27 mm TLP281 (4) SEMKO-approved TST part recm’ Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages. ...

  • Page 12

    ... Design which meets safety standard/approval pending as of January 2011 EN 60747-5-2-approved with option For the latest information, please contact your nearest Toshiba sales representative. Note 3: Some CTR ranks may be limited in production quantities. For details, please contact your nearest Toshiba sales representative. (3) CTR (%) ...

  • Page 13

    ... Design which meets safety standard/approval pending as of January 2011 EN 60747-5-2-approved with option For the latest information, please contact your nearest Toshiba sales representative. Note 3: Some CTR ranks may be limited in production quantities. For details, please contact your nearest Toshiba sales representative. (3) CTR (%) ...

  • Page 14

    ... Note 3: Some CTR ranks may be limited in production quantities. For details, please contact your nearest Toshiba sales representative. Note 4: Product manufactured by Toshiba Semiconductor (Thailand) Co.,Ltd. [TST] is recommended. See page 38 for detail. Japan product is non-promotional item. Note 5: For safety standard compliance criteria including the operating temperature conditions, please contact your nearest Toshiba representative. ...

  • Page 15

    ... For the latest information, please contact your nearest Toshiba sales representative. Note 3: Some CTR ranks may be limited in production quantities. For details, please contact your nearest Toshiba sales representative. Note 4: Product manufactured by Toshiba Semiconductor (Thailand) Co.,Ltd. [TST] is recommended. See page 38 for detail. Japan product is non-promotional item. (3) ...

  • Page 16

    ... For the latest information, please contact your nearest Toshiba sales representative. Note 3: Some CTR ranks may be limited in production quantities. For details, please contact your nearest Toshiba sales representative. Note 4: Product manufactured by Toshiba Semiconductor (Thailand) Co.,Ltd. [TST] is recommended. See page 38 for detail. Japan product is non-promotional item. (3) ...

  • Page 17

    ... Specifications subject to change without notice. For the latest information, please contact your nearest Toshiba sales representative. Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages. Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details. ...

  • Page 18

    ... Specifications subject to change without notice. For the latest information, please contact your nearest Toshiba sales representative. Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages. Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details. ...

  • Page 19

    ... Specifications subject to change without notice. For the latest information, please contact your nearest Toshiba sales representative. Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages. Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details. ...

  • Page 20

    ... Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages. Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details. Note 2: BSI and IEC: : Approved (supplementary or basic insulation) EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved TÜ ...

  • Page 21

    ... Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages. Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details. Note 2: BSI and IEC: : Approved (supplementary or basic insulation) EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved TÜ ...

  • Page 22

    ... Specifications subject to change without notice. For the latest information, please contact your nearest Toshiba sales representative. Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages. Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details. ...

  • Page 23

    ... TLP701A* ± 0.6 A (max) TLP701H* TLP705A* TLP700 ± 2.0 A (max) TLP700H* ± 2.5 A (max) *Under development. Specifications subject to change without notice. For the latest information, please contact your nearest Toshiba sales representative. Propagation Delay Time Output Form/CTR Features (Max) 800 ns 25% ...

  • Page 24

    ... Specifications subject to change without notice. For the latest information, please contact your nearest Toshiba sales representative. Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages. Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details. ...

  • Page 25

    ... Specifications subject to change without notice. For the latest information, please contact your nearest Toshiba sales representative. Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages. Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details. ...

  • Page 26

    ... Specifications subject to change without notice. For the latest information, please contact your nearest Toshiba sales representative. SSOP4 SO6 2.54SOP4 2.54SOP6 TLP3230 TLP3130 TLP3250 TLP3131 TLP3231 TLP3203 TLP3100 TLP3213 TLP3113 TLP3216 ...

  • Page 27

    ... OFF * Under development. Specifications subject to change without notice. For the latest information, please contact your nearest Toshiba sales representative. Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages. Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details. ...

  • Page 28

    ... OFF Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages. Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details. Note 2: BSI and IEC: : Approved (supplementary or basic insulation) EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved TÜ ...

  • Page 29

    ... Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages. Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details. Note 2: BSI and IEC: : Approved (supplementary or basic insulation) EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved TÜ ...

  • Page 30

    ... Under development. Specifications subject to change without notice. For the latest information, please contact your nearest Toshiba sales representative. Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages. Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details. ...

  • Page 31

    ... SEMKO-approved Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages. Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details. Note 2: BSI and IEC: : Approved (supplementary or basic insulation) EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved TÜ ...

  • Page 32

    ... SEMKO-approved Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages. Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details. Note 2: BSI and IEC: : Approved (supplementary or basic insulation) EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved TÜ ...

  • Page 33

    ... Note 2: BSI and IEC: : Approved (supplementary or basic insulation) EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved TÜV and VDE: : Approved : Design which meets safety standard/approval pending as of January 2011 EN 60747-5-2-approved with option For the latest information, please contact your nearest Toshiba sales representative. R (Max ...

  • Page 34

    ... TLP168J 4000 Vrms 5000 Vrms 800 V 5000 Vrms *Under development. Specifications subject to change without notice. For the latest information, please contact your nearest Toshiba sales representative. NZC: Non-zero cross ZC: Zero cross Triac-Output Photocouplers for Solid State Relays ( SSRs ) Part Number Pin Configuration ...

  • Page 35

    ... Note 2: BSI and IEC: : Approved (supplementary or basic insulation) EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved TÜV and VDE: : Approved : Design which meets safety standard/approval pending as of January 2011 EN 60747-5-2-approved with option For the latest information, please contact your nearest Toshiba sales representative. I (Max) V (Max) ...

  • Page 36

    ... Note 2: BSI and IEC: : Approved (supplementary or basic insulation) EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved TÜV and VDE: : Approved : Design which meets safety standard/approval pending as of January 2011 EN 60747-5-2-approved with option For the latest information, please contact your nearest Toshiba sales representative. I (Max) V (Max) ...

  • Page 37

    ... Note 2: BSI and IEC: : Approved (supplementary or basic insulation) EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved TÜV and VDE: : Approved : Design which meets safety standard/approval pending as of January 2011 EN 60747-5-2-approved with option For the latest information, please contact your nearest Toshiba sales representative. I (Max) V (Max) ...

  • Page 38

    ... AC input SEMKO-approved Mini-flat MFSOP6 TLP181 Transistor output General-purpose Under development. Specifications subject to change without notice. For the latest information, please contact your nearest Toshiba sales representative. Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages. ...

  • Page 39

    ... Design which meets safety standard/approval pending as of January 2011 EN 60747-5-2-approved with option For the latest information, please contact your nearest Toshiba sales representative. Some of the photocouplers with triac output are also manufactured by Toshiba Semiconductor Thailand Co.,Ltd. For detailed information, please contact your nearest Toshiba sales representative. BVs ...

  • Page 40

    ... Design which meets safety standard/approval pending as of January 2011 EN 60747-5-2-approved with option For the latest information, please contact your nearest Toshiba sales representative. Some of the photocouplers with triac output are also manufactured by Toshiba Semiconductor Thailand Co.,Ltd. For detailed information, please contact your nearest Toshiba sales representative. Off-State ...

  • Page 41

    ... Note: The length of part names is limited to 18 characters. Longer names are abbreviated by omitting the “-“ character and/or using shorthand symbols. However, be sure to give full part names when you have any inquiries. For details, please contact your nearest Toshiba sales representative. ...

  • Page 42

    Package Information 1 Lead Form Options for DIP Packages The DIP4, DIP6, DIP8 and DIP16 packages offer three surface-mount lead form options and a wide-spaced lead form option. The electrical characteristics are identical, regardless of these options. Lead Form ...

  • Page 43

    Package Dimensions ( 4-Pin DIP ) Standard DIP4 4.58 ± 0.25 7.62 ± 0.25 1.2 ± 0.15 0.5 ± 0.1 7.85 to 8.80 2.54 ± 0.25 DIP4 (LF2 10.16 ± 0.25 ...

  • Page 44

    Package Information 2 Package Dimensions ( 6-Pin DIP ) Standard DIP6 7.12 ± 0.25 0.5 ± 0.1 1.2 ± 0.15 2.54 ± 0.25 DIP6 (LF2 7.12 ± ...

  • Page 45

    Package Dimensions ( 8-Pin DIP ) Standard DIP8 9.66 ± 0.25 1.2 ± 0.15 0.5 ± 0.1 2.54 ± 0.25 DIP8 (LF2 9.66 ...

  • Page 46

    Package Information 2 Package Dimensions ( Other DIP Packages ) 5-pin DIP6 7.12 ± 0.25 0.5 ± 0.1 1.2 ± 0.15 2.54 ± 0.25 5-pin DIP (with Pin 5 Cut ...

  • Page 47

    Package Dimensions ( Surface Mount ) SDIP6 4.58 ± 0. 7.62 ± 0.25 1.27 ± 0.2 1.25 ± 0.2 0.4 ± 0.1 9.7 ± 0.3 4-pin MFSOP6 7.0 ± ...

  • Page 48

    Package Information 2 Package Dimensions ( Surface Mount ) 2.54SOP4 3.9 ± 0.25 0.4 ± 0.1 2.54 ± 0.25 2.54SOP8 9.4 ± 0.25 2.54 ± 0.25 0.4 ...

  • Page 49

    ... The following gives the rank classifications and rank marks printed on packages. FT Rank Name ✽ Part Marking when No CTR Rank Is Specified Part Number None TLP421 TLP180 Blank, YE, TLP280 BL,GB GR, TLP531/532 BL, YE TLP630 TLP181 Blank, BL TLP281 Y, G TLP531 ■ YE, TLP621 G, TLP631 ■ TLP632 GR, B, TLP731 ■ B ...

  • Page 50

    ... Marking Examples (a) 4-pin mini-flat 1-channel type P (b) TLP421, TLP421F (c) TLP280, TLP281 P280 (d) Others TLP Note: When ordering a standard photocoupler, add a CTR or I Examples: TLP181(GB) TLP532(GR) Use the standard part number when applying for safety standard approval. Part number Example TLP181(GB max FT or Lot No ...

  • Page 51

    Packing Information 1 Photocoupler Magazine Packing Specifications Magazine Dimensions Device Package Pin Count Quantities per Magazine Quantity (pcs Packing Dimensions A Number of Magazines Standard DIP DIPs with LF1, LF2, LF4 and LF5 Lead ...

  • Page 52

    Packing Information Unit: mm SO6 10.5 4.8 Magazine Dimensions 4.7 Length = 555 Thickness = 0.5 Package 5 Device Pin Count (SO6) Quantities per Magazine Quantity (pcs) 125 B Packing Dimensions Package SO6 MFSOP6 SO8 Photocoupler Package Type MFSOP6 ...

  • Page 53

    ... TLP620 TLP631, TLP734, TLP747G TLP555, TLP2601 53 Typical Devices TLP165J, TLP181, TLP190B TLP2105, TLP2108, TLP2405, TLP2408 TLP280, TLP281 TLP280-4, TLP281-4 TLP176G, TLP176A, TLP176D TLP197G TLP200D,TLP206A,TLP206G TLP3212 to 3217, TLP3230 to TLP3250 TLP701, TLP705, TLP719 ...

  • Page 54

    Packing Information 3. Reel Dimensions U E ø380 mm Photocoupler MFSOP, SO6 SO8 SOP4 Package Type ( TPL ) , ( TPR ) ( Tape Option ø380 ± ...

  • Page 55

    ... Specification Zero Any 40-mm portion of tape except leader and trailer. 0.2% max/reel ✽2 Except leader and trailer. e) Purchase order Specify the part number, tape and quantity as follows. Example TLP181 4. Lot number . [[G]]/RoHS COMPATIBLE ” 55 DIP ( LF1, LF5 ) DIP ( LF4 ) SDIP6 ...

  • Page 56

    ... Board Assembly 1 Example Land Patterns Below are the example land patterns for surface-mount packages. Mini-flat and SOP couplers 0.8 2.54 MFSOP6 (4-Pin) [e.g., TLP181] MFSOP6 (5-Pin) [e.g., TLP114A] 2.54SOP4 [e.g., TLP197G] SO6 (4-Pin) [e.g., TLP265J] 1.27 1.27 1.27 SO8 [e.g., TLP2105] ...

  • Page 57

    ... Example of temperature profile of lead (Pb) solder c. Example of temperature profile of lead (Pb)-free solder The profile below shows only the typical temperature profile and conditions, which might not apply to all Toshiba photocouplers. Temperature profiles and conditions may differ from product to product. Refer to the relevant technical datasheets and databooks when mounting a device. (° ...

  • Page 58

    ... Projected Operating Life Based on LED Light Output Degradation Toshiba photocouplers use one of four types of LEDs and a projection of the operating life has been made for each LED. The table on page 57 shows the types of LED used in photocouplers and the figures on pages show projections of long-term light output performance and operating life ...

  • Page 59

    ... TLP166J 1 4N29 ( SHORT ) TLP168J 1 4N29A ( SHORT ) TLP172 Series 1 4N30 ( SHORT ) TLP174G 1 4N31 ( SHORT ) 1 TLP176 Series 4N32 ( SHORT ) 1 TLP180 4N32A ( SHORT ) TLP181 1 4N33 ( SHORT ) TLP190B 1 4N35 ( SHORT ) 1 TLP191B 4N36 ( SHORT ) 1 TLP192 Series 4N37 ( SHORT ) 1 TLP197 Series 4N38 ( SHORT ) TLP200D 1 4N38A ( SHORT ) TLP202 Series ...

  • Page 60

    Device Degradation GaAs LED Projected Light Output Degradation Data 1 Test conditions mA 40°C F 140 120 100 100 1000 Test time (h) Test conditions ...

  • Page 61

    GaA As (SH) LED Projected Light Output Degradation Data Test conditions mA 40°C F 140 120 100 100 1000 Test time (h) Test conditions ...

  • Page 62

    Device Degradation GaA As (DH) LED Projected Light Output Degradation Data 3 Test conditions mA 40°C F 140 120 100 100 1000 Test time (h) Test conditions: ...

  • Page 63

    ... GaA As (MQW) LED Projected Light Output Degradation and Operating Life Data Toshiba is now preparing the light output degradation and operating life data for GaA As LEDs. These data are available for individual LEDs. Ask your local Toshiba sales representative ...

  • Page 64

    Device Degradation Reading the Projected LED Operating Life Graph For example, let's calculate the operating life of the GaAs LED, based on the data shown on page 60. Here is an example of how to read an operating life, ...

  • Page 65

    ... Vpk 565 Vpk 565 Vpk 6000 Vpk 6000 Vpk 4000 Vpk 4000 Vpk TLP2105 TLP2108 TLP2166A TLP2116 TLP2117 TLP180 TLP127 TLP181 TLP260J TLP160G TLP261J TLP160J TLP161G TLP161J 65 Coupling Medium (Window) Package (Body) Lead LED Chip SO8 2.54SOP DIP ...

  • Page 66

    ... Devices Triac/Thyrsitor Output The table above lists photocouplers and photorelays that have already been approved as of January 2011. The information herein is subject to change. For the latest information, please contact your nearest Toshiba sales representative. (DIN EN60747-5-2) (Continued) Single-Molded Packages Coupling Medium ...

  • Page 67

    Photocoupler Application Circuit Examples 1 Digital Interface Applications High Speed TLP118, TLP2601 7 390 Ω LSTTL Low Input Current Drive TLP553 0 4.7 kΩ kΩ CMOS ...

  • Page 68

    Photocoupler Application Circuit Examples 2 Inverter and AC-DC Servo Applications [ Photo-IC couplers: high-speed base/gate drive applications ] GTR Direct Drive TLP109 / TLP2409 IGBT / TLP550 / TLP559 Power MOS Direct Drive TLP759 High-Speed (Numerical control, Robotics) Driving ...

  • Page 69

    Driving the Gate of a 50-A-Class IGBT Module TLP350 0.1 μ 390 Ω LSTTL Driving the Gate of a 400-A-Class IGBT Module TLP351/ TLP2541 8 1 0.1 μF ...

  • Page 70

    Photocoupler Application Circuit Examples 3 Home Appliance Applications Electric Oven/Grills Magnetron Thermo-Switch Grill Heater Oven- TLP560G Cavity Lamp 120 Vac 50/60 Hz Door-Detector Circuit Weight Sensor Gas Sensor Refrigerator Block Diagram Panel Input Door Switch Temperature Sensor Door-Open Monitor ...

  • Page 71

    Automatic Washing Machines M Drain Valve Water Supply Valve 100 Vac Fan Heaters (1)Block Diagram Panel Main Switch Adjustment Switches Display Speaker Room Temperature Sensor Preheat Sensor Earthquake Sensor TLP560G ...

  • Page 72

    Photocoupler Application Circuit Examples 4 Home Appliance Applications (2)Waveform Examples 1. Example of Operating Waveform for Burner Motor Top: waveforms Medium: Bottom: Horizontal: Inverter Air Conditioners Remote Control Panel Microcontroller for Indoor Control Panel Unit Room Temperature Sensor Temperature ...

  • Page 73

    Programmable Controller Applications DC Output for Sequencers TLP127 /TLP627 TLP225A /TLP222A Input for Sequencers 1 2 Limit Switches ● Thermostats ● Transducer ● DC-AC 3 Inputs 4 COMMON ...

  • Page 74

    Photocoupler Application Circuit Examples 6 SSR and Power Control Circuit Applications Zero-Crossing Phototriac Output: TLP561G/TLP561J and Mini-Flat TLP161G/TLP166J TLP161G/ TLP561G/ TLP3042 ( S ) TLP166J / TLP561J / TLP3062 ( TLP3082 ( TLP3782 ...

  • Page 75

    ... Voltage (Note 1) 1577 7002(EN60950) 3750 Vrms 5000 Vrms * 5000 Vrms Safety Standard Approvals Isolation UL Voltage 1577 2500 Vrms 4000 Vrms 75 + Regulated Voltage − + TLP181 TLP285 TLP781 − + TLP148G TLP548J TLP549J − TLP748J CTR ( Rank (%) C F Nordic Min SEMKO (Note 2) No Rank 50 ...

  • Page 76

    ... Push-Button Telephone Application A variety of photocouplers are used to isolate between telephone lines (L1 and L2) and a CPU. Line Detector TLP629 TLP320 Application Package Type DIP4 TLP781 Ring Detector TLP181 MFSOP6 SOP4 TLP627 DIP4 Dial TLP127 MFSOP6 Pulsing TLP628 DIP4 Line DIP4 TLP629 Detector DIP4 ...

  • Page 77

    Photovoltaic Coupler Applications TLP190B TLP590B TLP191B TLP591B Transformerless AC-DC converter TLP590B x n 100 Aac 10 Photorelays for Tester Application TLP3120 /TLP3122 /TLP3542 Power Source Timing Generator CPU Pattern Generator 11 Photorelay ( MOSFET Output ) Application L 1 ...

  • Page 78

    ... TLP280 TLP281 Half-Pitch Mini-Flat Coupler 13 Competitor Part Number Cross Reference Search The Toshiba Semiconductor webpage at http://www.semicon.toshiba.co.jp/eng/product/opto/selection/coupler/xref/index.html offers a cross reference search tool for photocouplers and photorelays. No need for output snubber circuit ● ● No need for reverse-blocking diode in input side Off-Hook Relay ...

  • Page 79

    ... HCPL-2630 TLP2631 HCPL-2631 TLP2631 HCPL-3120 TLP350 HCPL-3140 TLP351 HCPL-3150 TLP351 HCPL-3180 TLP350 HCPL-314J TLP701 x2 HCPL-4504 TLP559 HCPL-0708 TLP116A HCPL-181 TLP181 HCPL-354 TLP180 HCPL-814 TLP620 LITEON Part Number Toshiba Part Number LTV-123 TLP781 LTV-816 TLP781 LTV-817 TLP781 LTV-851 TLP628 LTV-356T TLP181 LTV-357T ...

  • Page 80

    ... Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable laws or regulations. The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise ...