PHOTOCOUPLER TRANS-OUT 4-SMD

TLP181

Manufacturer Part NumberTLP181
DescriptionPHOTOCOUPLER TRANS-OUT 4-SMD
ManufacturerToshiba
TLP181 datasheets
 


Specifications of TLP181

Number Of Channels1Input TypeDC
Voltage - Isolation3750VrmsCurrent Transfer Ratio (min)50% @ 5mA
Current Transfer Ratio (max)600% @ 5mAVoltage - Output80V
Current - Output / Channel50mACurrent - Dc Forward (if)50mA
Vce Saturation (max)400mVOutput TypeTransistor
Mounting TypeSurface MountPackage / Case4-SMD
Lead Free Status / RoHS StatusContains lead / RoHS non-compliant  
1
2
3
4
5
6
7
8
9
10
11
Page 11
12
Page 12
13
Page 13
14
Page 14
15
Page 15
16
Page 16
17
Page 17
18
Page 18
19
Page 19
20
Page 20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
Page 11/80

Download datasheet (3Mb)Embed
PrevNext
New Products with Reinforced Insulation in a Small, Surface-Mount SOP Package
(≥ 5-mm Clearance/Creepage and ≥ 0.4-mm Internal Isolation Thickness)
Part Number
Pin Configuration
3
4
SOP4
Lead pitch = 1.27 mm
AC Input
TLP284
(4)
SEMKO-approved
TST part recm’ed
1
2
SOP16
16
15
14
13
12
11
10
9
4-channel version of
the TLP284
TLP284-4
Lead pitch = 1.27 mm
AC Input
1
2
3
4
5
6
7
8
SEMKO-approved
4
3
SOP4
Lead pitch = 1.27 mm
TLP285
(4)
SEMKO-approved
TST part recm’ed
1
2
16
15
14
13
12
11
10
9
SOP16
4-channel version of
the TLP285
TLP285-4
Lead pitch = 1.27 mm
SEMKO-approved
1
2
3
4
5
6
7
8
General-Purpose, Transistor-Output Photocouplers
Part Number
Pin Configuration
6
4
Mini-flat
MFSOP6
TLP124
Low input drive current
1
3
6
5
4
Mini-flat
MFSOP6
TLP131
Internal base
connection
1
3
6
5
4
Mini-flat
MFSOP6
TLP137
Low input drive current
Internal base
connection
1
3
6
4
Mini-flat
MFSOP6
TLP181
(4)
SEMKO-approved
TST part recm’ed
1
3
4
3
SOP4
Lead pitch = 1.27 mm
TLP281
(4)
SEMKO-approved
TST part recm’ed
1
2
Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages.
Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details.
Note 2: BSI and IEC: : Approved (supplementary or basic insulation)
EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved
TÜV and VDE: : Approved
: Design which meets safety standard/approval pending as of January 2011
EN 60747-5-2-approved with option V4 or D4
For the latest information, please contact your nearest Toshiba sales representative.
Note 3: Some CTR ranks may be limited in production quantities. For details, please contact your nearest Toshiba sales representative.
Note 4: Product manufactured by Toshiba Semiconductor (Thailand) Co.,Ltd. [TST] is recommended. See page 38 for detail. Japan product is non-promotional item.
(3)
CTR (%)
Features
Rank
Min
Max
@I
, V
F
CE
50
600
Y
50
150
±5 mA,
GR
100
300
5 V
BL
200
600
GB
100
600
50
600
±5 mA,
5 V
GB
100
600
50
600
Y
50
150
GR
100
300
BL
200
600
5 mA,
GB
100
600
5 V
YH
75
150
GRL
100
200
GRH
150
300
BLL
200
400
50
600
5 mA,
5 V
GB
100
600
(3)
CTR (%)
Features
Rank
Min
Max
@I
, V
F
CE
100
1200
1 mA,
0.5 V
BV
200
1200
50
600
Y
50
150
5 mA,
GR
100
300
5 V
BL
200
600
GB
100
600
100
1200
1 mA,
0.5 V
BV
200
1200
50
600
Y
50
150
GR
100
300
BL
200
600
5 mA,
GB
100
600
5 V
YH
75
150
GRL
100
200
GRH
150
300
BLL
200
400
50
600
Y
50
150
GR
100
300
BL
200
600
5 mA,
GB
100
600
5 V
YH
75
150
GRL
100
200
GRH
150
300
BLL
200
400
: Approved (reinforced insulation)
: Design which meets safety standard/approval pending as of January 2011
11
(2)
Safety Standards
V
BVs
CEO
UL/
UL
TÜV
VDE
BSI
IEC
C
3750
(1)
80 V
/
Vrms
3750
80 V
/
(1)
Vrms
3750
80 V
/
(1)
(1)
Vrms
3750
(1)
80 V
/
Vrms
(2)
Safety Standards
V
BVs
CEO
UL/
UL
TÜV
VDE
BSI
IEC
C
3750
80 V
/
Vrms
3750
80 V
/
Vrms
3750
80 V
/
Vrms
3750
80 V
(1)
/
Vrms
2500
(1)
(1)
80 V
/
Vrms