PHOTOCOUPLER TRANS-OUT 4-SMD

TLP181

Manufacturer Part NumberTLP181
DescriptionPHOTOCOUPLER TRANS-OUT 4-SMD
ManufacturerToshiba
TLP181 datasheets
 


Specifications of TLP181

Number Of Channels1Input TypeDC
Voltage - Isolation3750VrmsCurrent Transfer Ratio (min)50% @ 5mA
Current Transfer Ratio (max)600% @ 5mAVoltage - Output80V
Current - Output / Channel50mACurrent - Dc Forward (if)50mA
Vce Saturation (max)400mVOutput TypeTransistor
Mounting TypeSurface MountPackage / Case4-SMD
Lead Free Status / RoHS StatusContains lead / RoHS non-compliant  
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4
Selection Guide
General-Purpose, Transistor-Output Photocouplers (Continued)
Part Number
Pin Configuration
6
5
4
DIP6
TLP734
SEMKO-approved
TLP734F
1
2
3
4
3
DIP 4
TLP781
(6)
High isolation voltage
TLP781F
UL-approved (double
(6)
protection)
1
2
4
3
DIP 4
TLP785*
(6)
High isolation voltage
UL-approved (double
TLP785F*
(6)
protection)
1
2
AC-Input, Transistor-Output Photocouplers
Part Number
Pin Configuration
6
4
Mini-flat
MFSOP6
TLP126
AC input
Low input drive current
1
3
6
5
4
Mini-flat
MFSOP6
AC input
TLP130
Internal base
connection
1
3
6
4
Mini-flat
MFSOP6
TLP180
(4)
AC input
SEMKO-approved
TST part recm’ed
1
3
3
4
SOP4
Lead pitch = 1.27 mm
TLP280
(4)
AC input
SEMKO-approved
TST part recm’ed
1
2
SOP16
16
15
14
13
12
11
10
9
4-channel version
of the TLP280
TLP280-4
Lead pitch = 1.27 mm
AC input
SEMKO-approved
1
2
3
4
5
6
7
8
*
Under development. Specifications subject to change without notice. For the latest information, please contact your nearest Toshiba sales representative.
Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages.
Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details.
Note 2: BSI and IEC: : Approved (supplementary or basic insulation)
EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved
TÜV and VDE: : Approved
: Design which meets safety standard/approval pending as of January 2011
EN 60747-5-2-approved with option V4 or D4
For the latest information, please contact your nearest Toshiba sales representative.
Note 3: Some CTR ranks may be limited in production quantities. For details, please contact your nearest Toshiba sales representative.
Note 4: Product manufactured by Toshiba Semiconductor (Thailand) Co.,Ltd. [TST] is recommended. See page 38 for detail. Japan product is non-promotional item.
Note 5: For safety standard compliance criteria including the operating temperature conditions, please contact your nearest Toshiba representative.
Note 6: About the package dimensions and lead form options, see each datasheet.
(3)
CTR (%)
Features
Rank
Min
Max
@I
, V
F
CE
50
600
5 mA,
GB
100
600
5 V
GR
100
300
50
600
Y
50
150
GR
100
300
BL
200
600
5 mA,
GB
100
600
5 V
YH
75
150
GRL
100
200
GRH
150
300
BLL
200
400
50
600
Y
50
150
GR
100
300
BL
200
600
5 mA,
GB
100
600
5 V
YH
75
150
GRL
100
200
GRH
150
300
BLL
200
400
(3)
CTR (%)
Features
Rank
Min
Max
@I
, V
F
CE
±1 mA,
100
1200
0.5 V
50
600
±5 mA,
5 V
GB
100
600
50
600
Y
50
150
±5 mA,
GR
100
300
5 V
BL
200
600
GB
100
600
50
600
Y
50
150
±5 mA,
GR
100
300
5 V
BL
200
600
GB
100
600
50
600
±5 mA,
5 V
GB
100
600
: Approved (reinforced insulation)
: Design which meets safety standard/approval pending as of January 2011
14
(2)
Safety Standards
V
BVs
CEO
UL/
UL
TÜV
VDE
BSI
IEC
C
4000
55 V
/ –
Vrms
(5)
5000
80 V
/
Vrms
(5)
5000
80 V
/
Vrms
(2)
Safety Standards
V
BVs
CEO
UL/
UL
TÜV
VDE
BSI
IEC
C
3750
80 V
/
Vrms
3750
80 V
/
Vrms
3750
(1)
(1)
80 V
/
Vrms
2500
(1)
(1)
80 V
/
Vrms
2500
(1)
80 V
/
Vrms