PHOTOCOUPLER TRANS-OUT 4-SMD

TLP181

Manufacturer Part NumberTLP181
DescriptionPHOTOCOUPLER TRANS-OUT 4-SMD
ManufacturerToshiba
TLP181 datasheets
 


Specifications of TLP181

Number Of Channels1Input TypeDC
Voltage - Isolation3750VrmsCurrent Transfer Ratio (min)50% @ 5mA
Current Transfer Ratio (max)600% @ 5mAVoltage - Output80V
Current - Output / Channel50mACurrent - Dc Forward (if)50mA
Vce Saturation (max)400mVOutput TypeTransistor
Mounting TypeSurface MountPackage / Case4-SMD
Lead Free Status / RoHS StatusContains lead / RoHS non-compliant  
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
Page 21
22
Page 22
23
Page 23
24
Page 24
25
Page 25
26
Page 26
27
Page 27
28
Page 28
29
Page 29
30
Page 30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
Page 21/80

Download datasheet (3Mb)Embed
PrevNext
Photocouplers for Logic Signal Transmission at 5 Mbit/s (Typ.) (Continued)
Part Number
Pin Configuration
8
7
6
5
SO8
Dual-channel version for
TLP2105
the TLP105
V
CC
1
2
3
4
8
7
6
5
SO8
Dual-channel version for
TLP2108
the TLP108
V
CC
1
2
3
4
8
7
6
5
DIP8
Low input current
TLP2200
V
CC
1
2
3
4
Photocouplers for Logic Signal Transmission at 1 Mbit/s (Typ.)
Part Number
Pin Configuration
6
5
4
TLP109
SO6 (reinforced insulation)
1
3
8
7
6
5
SO8
TLP2409
Topr = 125˚C(max)
SO8 version of the TLP109
1
2
3
4
6
5
4
DIP6
6-pin package version
TLP512
of the TLP550
1
2
3
8
7
6
5
DIP8
TLP550
High CMR
1
2
3
4
8
7
6
5
DIP8
TLP551
Internal base connection
1
2
3
4
8
7
6
5
SO8
Low input current
TLP2403
SO8 version of the TLP553
1
2
3
4
8
7
6
5
DIP8
TLP553
Low input drive current
1
2
3
4
8
7
6
5
DIP8
High CMR version
TLP559
of the TLP550
1
2
3
4
8
7
6
5
DIP8
TLP651
Internal base connection
1
2
3
4
6
5
4
TLP719
SDIP6
High CMR
TLP719F
1
2
3
Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages.
Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details.
Note 2: BSI and IEC: : Approved (supplementary or basic insulation)
EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved
TÜV and VDE: : Approved
: Design which meets safety standard/approval pending as of January 2011
EN 60747-5-2-approved with option V4 or D4
For the latest information, please contact your nearest Toshiba sales representative.
Propagation
Features
Delay Time
Output Form
(Max)
Totem pole
250 ns
output
(Buffer logic)
= 4.5 to 20 V
Totem pole
250 ns
output
(Inverter logic)
= 4.5 to 20 V
3-state
400 ns
(Buffer logic)
= 4.5 to 20 V
Data Rate
CTR
Features
(NRZ) (Typ.)
1 Mbit/s
20%
(min)
1 Mbit/s
20%
(min)
1 Mbit/s
20%
(min)
10%
(min)
1 Mbit/s
(19% min for rank 0)
10%
(min)
1 Mbit/s
(19% min for rank 0)
300 kbit/s
400%
(min)
300 kbit/s
400%
(min)
1 Mbit/s
20% (min)
10%
(min)
1 Mbit/s
(19% min for rank 0)
1 Mbit/s
20%
(min)
: Approved (reinforced insulation)
: Design which meets safety standard/approval pending as of January 2011
21
I
(2)
,
Safety Standards
FHL
I
BVs
FLH
UL/cUL TÜV
VDE
BSI
(Max)
3750
(1)
1.6 mA
/
Vrms
3750
1.6 mA
/
(1)
Vrms
2500
1.6 mA
/
Vrms
(2)
Safety Standards
BVs
@I
UL/cUL TÜV
VDE
BSI
F
3750
16 mA
/
(1)
Vrms
3750
16 mA
/
(1)
Vrms
2500
16 mA
/ –
Vrms
2500
16 mA
/
Vrms
2500
16 mA
/
Vrms
3750
0.5 mA
(1)
/
Vrms
2500
0.5 mA
/ –
Vrms
2500
16 mA
/
Vrms
5000
16 mA
/
Vrms
5000
16 mA
/
Vrms
IEC
IEC