PHOTOCOUPLER TRANS-OUT 4-SMD

TLP181

Manufacturer Part NumberTLP181
DescriptionPHOTOCOUPLER TRANS-OUT 4-SMD
ManufacturerToshiba
TLP181 datasheets
 


Specifications of TLP181

Number Of Channels1Input TypeDC
Voltage - Isolation3750VrmsCurrent Transfer Ratio (min)50% @ 5mA
Current Transfer Ratio (max)600% @ 5mAVoltage - Output80V
Current - Output / Channel50mACurrent - Dc Forward (if)50mA
Vce Saturation (max)400mVOutput TypeTransistor
Mounting TypeSurface MountPackage / Case4-SMD
Lead Free Status / RoHS StatusContains lead / RoHS non-compliant  
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Transistor-Output and Darlington-Transistor-Output Photocouplers (Continued)
Pin Configuration
Part Number
6
4
SO6 (reinforced insulation)
TLP184*
AC input
1
3
6
4
SO6 (reinforced insulation)
TLP185*
1
3
4
3
SOP4
TLP280
Lead pitch = 1.27 mm
AC input
1
2
4
3
SOP4
Lead pitch = 1.27 mm
TLP281
General-purpose
SEMKO-approved
1
2
SOP4 (reinforced insulation)
4
3
Lead pitch = 1.27 mm
Creepage/clearance ≥ 5 mm
TLP284
Isolation thickness ≥ 0.4 mm
1
2
AC input
SOP4 (reinforced insulation)
4
3
Lead pitch = 1.27 mm
TLP285
Creepage/clearance ≥ 5 mm
Isolation thickness ≥ 0.4 mm
1
2
SEMKO-approved
4
3
DIP4
Transistor output
TLP620
AC input
SEMKO-approved
1
2
8
7
6
5
DIP8
Dual-channel version of
TLP620-2
the TLP620
SEMKO-approved
1
2
3
4
4
3
DIP4
Darlington transistor output
TLP627
High V
SEMKO-approved
1
2
8
7
6
5
DIP8
Dual-channel version of
TLP627-2
the TLP627
SEMKO-approved
1
2
3
4
16
15
14
13
12
11
10
9
SO16
4-channel version
TLP290-4*
Lead pitch = 1.27 mm
AC input
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
SO16
TLP291-4*
4-channel version
Lead pitch = 1.27 mm
1
2
3
4
5
6
7
8
Photocouplers for IGBT/MOSFET Gate Drive
Part Number
Pin Configuration
6
5
4
SO6 (reinforced Insulation)
T
TLP155E
Direct drive of a
small-power
IGBT/MOSFET
1
3
*
Under development. Specifications subject to change without notice. For the latest information, please contact your nearest Toshiba sales representative.
Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages.
Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details.
Note 2: BSI and IEC: : Approved (supplementary or basic insulation)
EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved
TÜV and VDE: : Approved
: Design which meets safety standard/approval pending as of January 2011
EN 60747-5-2-approved with option V4 or D4
For the latest information, please contact your nearest Toshiba sales representative.
Some of the photocouplers with triac output are also manufactured by Toshiba Semiconductor Thailand Co.,Ltd. For detailed information, please contact your nearest Toshiba sales
representative.
BVs
Features
V
CEO
@1 Minute
3750
80 V
Vrms
3750
80 V
Vrms
2500
80 V
Vrms
2500
80 V
Vrms
3750
80 V
Vrms
3750
80 V
Vrms
5000
55 V
Vrms
5000
55 V
Vrms
5000
300 V
Vrms
CEO
5000
300 V
Vrms
2500
80 V
Vrms
2500
80 V
Vrms
Propagation
Features
Delay Time
Output
(Max)
Peak output
= 100°C (max)
opr
0.2 μs
current (max):
±0.6 A
: Approved (reinforced insulation)
: Design which meets safety standard/approval pending as of January 2011
39
(2)
Safety Standards
UL
c-UL
TÜV
VDE
BSI
(1)
(1)
(1)
(1)
(1)
(1)
(1)
(1)
(1)
(1)
(1)
(2)
(2)
(2)
Safety Standards
I
FHL
BVs
(Max)
UL/cUL TÜV
VDE
BSI
3750
7.5 mA
/
Vrms
IEC
IEC