PHOTOCOUPLER TRANS-OUT 4-SMD

TLP181

Manufacturer Part NumberTLP181
DescriptionPHOTOCOUPLER TRANS-OUT 4-SMD
ManufacturerToshiba
TLP181 datasheets
 


Specifications of TLP181

Number Of Channels1Input TypeDC
Voltage - Isolation3750VrmsCurrent Transfer Ratio (min)50% @ 5mA
Current Transfer Ratio (max)600% @ 5mAVoltage - Output80V
Current - Output / Channel50mACurrent - Dc Forward (if)50mA
Vce Saturation (max)400mVOutput TypeTransistor
Mounting TypeSurface MountPackage / Case4-SMD
Lead Free Status / RoHS StatusContains lead / RoHS non-compliant  
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2
New Products
General-Purpose Photorelays Certified for Reinforced Insulation:
TLP220 Series and TLP221A (Under Development)
Toshiba is now developing the TLP220 Series and the TLP221 targeting factory equipment applications, and wattmeter and smart meter
applications for the monitoring of electrical energy consumption. These photorelays meet the requirements for high isolation voltage
between input and output, as well as for international safety standards certification. Housed in the DIP4 package, the new photorelays
save board space and provide an isolation voltage of 5 kV. The TLP220 Series is available in versions with 60-V, 200-V, 350-V, 400-V
and 600-V peak off-state voltages. The TLP221A provides a 60-V peak off-state voltage and a 1.5-A on-state current.
Existing Photorelay Examples
Characteristic
Symbol
Unit
Package
Peak Off-State Voltage
V
V
OFF
(min)
On-State Current
I
A
ON
(max)
On-State Resistance
R
Ω
ON
(max)
Isolation Voltage
B
Vrms
VS
(min)
*Under development. Specifications subject to change without notice.
For the latest information, please contact your nearest Toshiba sales representative.
IC-Output Photocouplers in the SO6 Package Certified for Reinforced Insulation
Despite the same footprint size as the MFSOP6 package, the new SO6 package provides
reinforced insulation, offering clearance and creepage distances of ≥ 5 mm; an internal
isolation thickness of ≥ 0.4 mm; and an isolation voltage of 3750 Vrms.
Additionally, the SO6 features the maximum PCB mounted height of 2.3 mm, approximately
20% lower than the MFSOP6. This makes the photocouplers in SO6 ideal for low-profile
applications.
Clearance/creepage: ≥ 5 mm
Thin package: ≤ 2.3 mm
Internal Faraday shield: ≥ 0.4 mm
Thin package: ≤ 2.3 mm
Data rate
Part Number
(typ.)
TLP104
1 Mbit/s
Open-collector, optimized for IPM drive
TLP109
1 Mbit/s
Open-collector
TLP116A
20 Mbit/s
Totem-pole inverting logic
TLP2366*
TLP118
20 Mbit/s
Open-collector inverting logic
TLP2368*
TLP2367*
50 Mbit/s
Totem-pole inverting logic
*Under development. Specifications subject to change without notice.
For the latest information, please contact your nearest Toshiba sales representative.
TLP222A
TLP222G
TLP220A
TLP220D
60
350
60
200
0.5
0.12
0.5
0.25
2
50
2
8
5000
5000
5000
5000
Input Threshold
Output
Supply voltage
Current (max)
4.5 V to 30 V
4.5 V to 30 V
5 V
3.3 V/5 V
5 V
3.3 V/5 V
3.3 V/5 V
8
Scheduled for mass production in June to August
Under Development
TLP220G
TLP220GA
TLP220J
TLP221A
DIP4
350
400
600
0.1
0.12
0.09
50
35
60
5000
5000
5000
5 mA
2.3
5 mA
5 mA
5 mA
5 mA
5 mA
60
1.5
0.2
5000
SO6
SO6