PHOTOCOUPLER TRANS-OUT 4-SMD

TLP181

Manufacturer Part NumberTLP181
DescriptionPHOTOCOUPLER TRANS-OUT 4-SMD
ManufacturerToshiba
TLP181 datasheets
 


Specifications of TLP181

Number Of Channels1Input TypeDC
Voltage - Isolation3750VrmsCurrent Transfer Ratio (min)50% @ 5mA
Current Transfer Ratio (max)600% @ 5mAVoltage - Output80V
Current - Output / Channel50mACurrent - Dc Forward (if)50mA
Vce Saturation (max)400mVOutput TypeTransistor
Mounting TypeSurface MountPackage / Case4-SMD
Lead Free Status / RoHS StatusContains lead / RoHS non-compliant  
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Photocoupler Product Tree
Photocoupler Product Tree
Package
DIP4
DIP6
DIP8
DIP16
SO8
SOP4
2.54SOP4
2.54SOP6
Transistor-Output
Photorelays
Photorelays
Thyristor- and Triac-Output
Triac Output
Thyristor Output
ZC
DIP4
DIP6
DIP8
DIP16
≥ 7-mm clearance/creepage; ≥ 0.4-mm isolation thickness
SDIP6
6-pin SMD package (1.27-mm lead pitch)
≥ 5-mm clearance/creepage; ≥ 0.4-mm isolation thickness
SO6
SDIP6
5-pin SMD package (1.27-mm lead pitch); low-profile
SO8
8-pin SMD package (1.27-mm lead pitch)
SO6
16-pin SMD package (1.27-mm lead pitch)
SO16
SO16
SOP4
4-pin SMD package (1.27-mm lead pitch)
16-pin SMD package (1.27-mm lead pitch)
SOP16
SOP16
MFSOP6
SMD package (1.27-mm lead pitch)
MFSOP6
2.54SOP4
2.54SOP6
2.54SOP8
SMD package (2.54-mm lead pitch)
2.54SOP8
SSOP4
Ultra-small; SMD package (1.27-mm lead pitch)
SSOP4
USOP4
USOP4
Ultra-small; SMD package (1.27-mm lead pitch)
Transistor-Output
Darlington-Transistor Output
Output Choices
Photovoltaic-Output
Photovoltaic-Output
9
General-purpose packages
Lead-forming options for surface mounting
IC-Output
Logic Output
Vcc
GND
V
CC
GND
Gate Drive