PC3SD11NTZB Sharp Microelectronics, PC3SD11NTZB Datasheet
PC3SD11NTZB
Specifications of PC3SD11NTZB
Related parts for PC3SD11NTZB
PC3SD11NTZB Summary of contents
Page 1
PC3SD11NTZ Series ∗ Zero cross type is also available. (PC3SD21NTZ Series) ■ Description PC3SD11NTZ Series Phototriac Coupler include an infrared emitting diode (IRED) optically coupled to an output Phototriac. These devices feature full wave control and are ideal isolated drivers ...
Page 2
Internal Connection Diagram ■ Outline Dimensions 1. Through-Hole [ex. PC3SD11NTZ] ±0.3 1.2 ±0.2 0.6 Model No. SHARP mark Rank mark "S" Anode mark Date code (2 digit) 1 ...
Page 3
Outline Dimensions 5. Through-Hole VDE option [ex. PC3SD11YTZ] ±0.3 1.2 ±0.2 0.6 Model No. SHARP mark Rank mark "S" Anode 4 mark Date code (2 digit VDE Factory ...
Page 4
Date code (2 digit) 1st digit Year of production A.D. Mark A.D Mark 1990 A 2002 P 1991 B 2003 R 1992 C 2004 S 1993 D 2005 T 1994 E 2006 U 1995 F 2007 V 1996 H 2008 ...
Page 5
Absolute Maximum Ratings Parameter Forward current Input Reverse voltage RMS ON-state current Output Peak one cycle surge current Repetitive peak OFF-state voltage *1 Isolation voltage Operating temperature Storage temperature *2 Soldering temperature * 60%RH, AC for 1minute, ...
Page 6
... PC3SD11YWZBF PC3SD11NWZCF PC3SD11YWZCF PC3SD11NXPCF PC3SD11YXPCF PC3SD11NWPCF PC3SD11YWPCF ■ Model Line-up (2) (Lead solder plating components) Lead Form Through-Hole Shipping Package DIN Approved - EN60747-5-2 PC3SD11NTZA PC3SD11YTZA Model No. PC3SD11NTZB PC3SD11YTZB PC3SD11NTZC PC3SD11YTZC Lead Form Wide SMT Gullwing Sleeve Shipping Package 50pcs/sleeve DIN Approved - EN60747-5-2 PC3SD11NWZA PC3SD11YWZA PC3SD11NXPA PC3SD11YXPA PC3SD11NWPA PC3SD11YWPA Model No ...
Page 7
Fig.1 Forward Current vs. Ambient Temperature − Ambient temperature T Fig.3-a Forward Current vs. Forward Voltage (Rank A) 100 T =100° 75°C 50°C 25°C 0°C 10 −30°C 5 ...
Page 8
Fig.5 Relative Repetitive Peak OFF-state Voltage vs. Ambient Temperature 1.3 1.2 1.1 1 0.9 0.8 0.7 −40 − Ambient temperature T Fig.7 Holding Current vs. Ambient Temperature 10 1 0.1 −40 − Ambient temperature ...
Page 9
Design Considerations ● Design guide In order for the Phototriac to turn off, the triggering current (I Please refrain from using these devices in a direct drive configuration. These Phototriac Coupler are intended to be used as triggering device ...
Page 10
Standard Circuit (Medium/High Power Triac Drive Circuit) PC3SD11NTZ Note) Please add the snubber circuit according to a condition. Any snubber or varistor used for the above mentioned scenarios should be located as close to the main ...
Page 11
Manufacturing Guidelines ● Soldering Method Reflow Soldering: Reflow soldering should follow the temperature profile shown below. Soldering should not exceed the curve of temperature profile and time. Please don't solder more than twice. (˚C) 300 Terminal : 260˚C peak ...
Page 12
Cleaning instructions Solvent cleaning : Solvent temperature should be 45˚C or below. Immersion time should be 3minutes or less. Ultrasonic cleaning : The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning ...
Page 13
Package specification ● Sleeve package 1. Through-Hole or SMT Gullwing Package materials Sleeve : HIPS (with anti-static material) Stopper : Styrene-Elastomer Package method MAX. 50pcs of products shall be packaged in a sleeve. Both ends shall be closed by ...
Page 14
Tape and Reel package 1. SMT Gullwing Package materials Carrier tape : A-PET (with anti-static material) Cover tape : PET (three layer system) Reel : PS Carrier tape structure and Dimensions F Dimensions List A ±0.3 16.0 7.5 H ...
Page 15
Wide SMT Gullwing Package materials Carrier tape : A-PET (with anti-static material) Cover tape : PET (three layer system) Reel : PS Carrier tape structure and Dimensions Dimensions List A ±0.3 24.0 11.5 H ±0.1 12.2 0.4 Reel structure ...
Page 16
Important Notices · The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for ...