HYS64T128020HU-3S-B Qimonda, HYS64T128020HU-3S-B Datasheet - Page 29

MODULE DDR2 1GB 240-DIMM

HYS64T128020HU-3S-B

Manufacturer Part Number
HYS64T128020HU-3S-B
Description
MODULE DDR2 1GB 240-DIMM
Manufacturer
Qimonda
Datasheet

Specifications of HYS64T128020HU-3S-B

Memory Type
DDR2 SDRAM
Memory Size
1GB
Speed
333MHz
Package / Case
240-DIMM
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
675-1024
1) For details and notes see the relevant Qimonda component data sheet
2)
3) Timing that is not specified is illegal and after such an event, in order to guarantee proper operation, the DRAM must be powered down
4) Timings are guaranteed with CK/CK differential Slew Rate of 2.0 V/ns. For DQS signals timings are guaranteed with a differential Slew
5) The CK / CK input reference level (for timing reference to CK / CK) is the point at which CK and CK cross. The DQS / DQS, RDQS/ RDQS,
6) Inputs are not recognized as valid until
7) The output timing reference voltage level is
8) For each of the terms, if not already an integer, round to the next highest integer.
9) The clock frequency is allowed to change during self-refresh mode or precharge power-down mode.
10) For timing definition, refer to the Component data sheet.
11) Consists of data pin skew and output pattern effects, and p-channel to n-channel variation of the output drivers as well as output Slew Rate
12) MIN (
Rev. 1.3, 2006-12
03292006-6GMD-RSFT
Parameter
Average periodic refresh Interval
Auto-Refresh to Active/Auto-Refresh
command period
Precharge-All (4 banks) command period
Precharge-All (8 banks) command period
Read preamble
Read postamble
Active bank A to Active bank B command
period
Active bank A to Active bank B command
period
Internal Read to Precharge command delay
Write preamble
Write postamble
Write recovery time for write without Auto-
Precharge
Internal Write to Read command delay
Exit power down to any valid command
(other than NOP or Deselect)
Exit active power-down mode to Read
command (slow exit, lower power)
Exit precharge power-down to any valid
command (other than NOP or Deselect)
Exit Self-Refresh to non-Read command
Exit Self-Refresh to Read command
Write recovery time for write with Auto-
Precharge
V
and then restarted through the specified initialization sequence before normal operation can continue.
Rate of 2.0 V/ns in differential strobe mode and a Slew Rate of 1 V/ns in single ended mode.
input reference level is the crosspoint when in differential strobe mode.
the WR parameter stored in the MR.
mis-match between DQS / DQS and associated DQ in any given cycle.
be greater than the minimum specification limits for
DDQ
t
= 1.8 V ± 0.1 V;
CL
,
t
CH
) refers to the smaller of the actual clock low time and the actual clock high time as provided to the device (i.e. this value can
V
DD
= 1.8 V ±0.1 V. See notes
V
REF
V
stabilizes. During the period before
TT
.
Symbol
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
WR
REFI
RFC
RP
RP
RPRE
RPST
RRD
RRD
RTP
WPRE
WPST
WR
WTR
XARD
XARDS
XP
XSNR
XSRD
t
CL
5)6)7)8)
and
t
CH
).
29
HYS[64/72]T[32/64/128]xx0HU-[25F/2.5/3/3S/3.7/5]-B
DDR2–533
105
t
15 + 1tCK
0.9
0.40
7.5
7.5
0.25
0.40
15
7.5
2
6 – AL
2
t
200
t
Min.
RP
10
RFC
WR
/
+ 1
t
+10
CK
t
CK
V
t
REF
CK
refers to the application clock period. WR refers to
stabilizes, CKE = 0.2 x
Max.
3.9
1.1
0.60
0.60
Unbuffered DDR2 SDRAM Module
V
DDQ
Unit
µs
ns
ns
ns
t
t
ns
ns
ns
t
t
ns
ns
t
t
t
ns
t
t
Internet Data Sheet
CK
CK
CK
CK
CK
CK
CK
CK
CK
is recognized as low.
Note
1)2)3)4)5)6)7)
16)18)
17)
14)
14)
14)18)
16)22)
19)
20)
21)
21)
22)

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