HYS64T128020HU-3S-B Qimonda, HYS64T128020HU-3S-B Datasheet - Page 3

• Manufacturer Part Number: HYS64T128020HU-3S-B
• Description: MODULE DDR2 1GB 240-DIMM
• Manufacturer: Qimonda

Specifications of HYS64T128020HU-3S-B

• Memory Type: DDR2 SDRAM
• Memory Size: 1GB
• Speed: 333MHz
• Package / Case: 240-DIMM
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 675-1024

1
This chapter gives an overview of the 240-Pin unbuffered DDR2 SDRAM Modules product family and describes its main
characteristics.
1.1
Feature list and performance tables
• 240-Pin PC2–6400, PC2–5300, PC2–4200 and
• 32M × 64, 64M × 64, 64M × 72, 128M × 64 and 128M ×72
• Standard Double-Data-Rate-Two Synchronous DRAMs
• 256MB, 512MB and 1GB modules built with 512-Mbit
• All speed grades faster than DDR2–400 comply with
• Programmable CAS Latencies (3, 4 and 5),
1) RoHS Compliant Product: Restriction of the use of certain hazardous substances (RoHS) in electrical and electronic equipment as defined
Rev. 1.3, 2006-12
03292006-6GMD-RSFT
Product Type Speed Code
Speed Grade
Max. Clock Frequency
Min. RAS-CAS-Delay
Min. Row Precharge Time
Min. Row Active Time
Min. Row Cycle Time
PC2–3200 DDR2 SDRAM memory modules.
module organization and 32M × 16, 64M × 8 chip
organization
(DDR2 SDRAM) with a single + 1.8 V (± 0.1 V) power
supply
DDR2 SDRAMs in P-TFBGA-84 and P-TFBGA-60
chipsize packages
DDR2–400 timing specifications.
Burst Length (8 & 4) and Burst Type
in the directive 2002/95/EC issued by the European Parliament and of the Council of 27 January 2003. These substances include mercury,
lead, cadmium, hexavalent chromium, polybrominated biphenyls and polybrominated biphenyl ethers.
Overview
Features
@CL6
@CL5
@CL4
@CL3
f
f
f
f
t
t
t
t
CK6
CK5
CK4
CK3
RCD
RP
RAS
RC
–25F
PC2–6400
5–5–5
400
400
266
200
12.5
12.5
45
57.5
–2.5
PC2–6400
6–6–6
400
333
266
200
15
15
45
60
3
• Auto Refresh (CBR) and Self Refresh
• Programmable self refresh rate via EMRS2 setting
• Programmable partial array refresh via EMRS2 settings
• Average Refresh Period 7.8 µs at a
• DCC enabling via EMRS2 setting
• All inputs and outputs SSTL_1.8 compatible
• Off-Chip Driver Impedance Adjustment (OCD) and
• Serial Presence Detect with E
• UDIMM Dimensions (nominal):
• Based on standard reference layouts Raw Card “C”,
• RoHS compliant products
HYS[64/72]T[32/64/128]xx0HU-[25F/2.5/3/3S/3.7/5]-B
–3
PC2–5300
4–4–4
—
333
333
200
12
12
45
57
85 °C, 3.9µs between 85 °C and 95 °C.
On-Die Termination (ODT)
30 mm high, 133.35 mm wide
“D”,”E”,”F” and “G“
–3S
PC2–5300
5–5–5
—
333
266
200
15
15
45
60
Unbuffered DDR2 SDRAM Module
–3.7
PC2–4200
4–4–4
—
266
266
200
15
15
45
60
1)
2
PROM
Performance Table
Internet Data Sheet
T
200
200
200
–5
PC2–3200
3–3–3
—
15
15
40
55
CASE
lower than
TABLE 1
Unit
—
MHz
MHz
MHz
MHz
ns
ns
ns
ns