DIODE IR EMITTING GAAS TO-46

SE5455-004

Manufacturer Part NumberSE5455-004
DescriptionDIODE IR EMITTING GAAS TO-46
ManufacturerHoneywell Sensing and Control
SE5455-004 datasheets
 

Specifications of SE5455-004

Viewing Angle20°Current - Dc Forward (if)100mA
Radiant Intensity (ie) Min @ If1.8mW/sr @ 100mAWavelength935nm
Voltage - Forward (vf) Typ1.7VOrientationTop View
Mounting TypeThrough HolePackage / CaseTO-46-2, Metal Can
Peak Wavelength935nmForward Current If(av)100mA
Rise Time700nsFall Time Tf700ns
Supply Voltage Range1.7VOperating Temperature Range-55°C To +125°C
Lead Free Status / RoHS StatusLead free / RoHS CompliantOther names480-2984
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SD3443.
Features:TO-46 metal-can package • Flat
window • 90° acceptance angle option
• Wide operating temperature range -55
°C to 125 °C [-67 °F to 257 °F] • External
base connection for added control •
Enhanced sensitivity • Mechanically and
spectrally matched to SE3450/5450,
SE3455/5455, and SE3470/5470 infrared
emitters
Benefits: Phototransistor. Flat window
provides wide acceptance angle. Often
ideally suited for operation in hostile
environments.
SD5443.
Features: TO-46 metal-can package
• Lensed package • 18° (nominal)
acceptance angle option • Wide operating
temperature range -55 °C to 125 °C [-67
°F to 257 °F] • External base connection
for added control • Enhanced sensitivity
• Mechanically and spectrally matched
to SE3450/5450, SE3455/5455, and
SE3470/5470 infrared emitters
Benefits: Phototransistor. Glass-lensed
can provides a narrow acceptance angle.
Often ideally suited for operation in hostile
environments.
SD5491.
Features: TO-18 metal-can package
• 12° (nominal) acceptance angle • Wide
operating temperature range -55 °C to 125
°C [-67 °F to 257 °F] • Enhanced response
time • Wide sensitivity ranges • External
base connection for added control
• Mechanically and spectrally matched
to SE3450/5450, SE3455/5455, and
SE3470/5470 infrared emitters
Benefits: Phototransistor. Biconvex lens
provides high optical sensitivity with
a narrow acceptance angle to enable
maximum radiation coupling. Often offers
protection against harsh environments, as
well as enhanced thermal characteristics.
Unless otherwise noted, potential applications include printers and copiers, motion control systems, metering systems, liquid-level
sensing, data storage systems, scanning, automated transaction, drop sensors, and other noninvasive medical equipment.
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PHOTOTRANSISTORS - PLASTIC
AND CERAMIC PACKAGE
SDP8405.
Features: T-1 plastic package • 20°
(nominal) acceptance angle • Consistent
optical properties • Wide sensitivity
ranges • Mechanically and spectrally
matched to SEP8505 and SEP8705
infrared emitters
Benefits: Phototransistor. Transfer molding
provides enhanced optical centerline
performance compared to other molding
processes. Lead lengths are staggered
to provide a simple method of polarity
identification.
SDP8406.
Features: Side-looking plastic package
• 50° (nominal) acceptance angle
• Wide sensitivity ranges • Mechanically
and spectrally matched to SEP8506 and
SEP8706 infrared emitters
Benefits: Phototransistor molded in a
side-looking clear plastic package. Chip
positioned to accept radiation through a
plastic lens from the side of the package.
SDP8436.
Features: Side-detecting, tight-beam
sidelooker in a plastic package • 18°
(nominal) acceptance angle • Enhanced
coupling distance • Internal visible light
rejection filter • Low profile for design
flexibility • Wide sensitivity ranges
• Mechanically matched to SEP8736
infrared emitters
Benefits: Phototransistor molded
in a black plastic package which
combines the mounting advantages of
a side-looking package with the narrow
acceptance angle and high optical
gain of a T-1 package. Designed for
potential applications with longer coupling
distances than standard side-looking
devices, such as touch screens. Often
suited to potential applications in which
adjacent channel cross-talk could be a
problem. Package is highly transmissive
to the IR source energy while effectively
shielding against visible ambient light.
SMD2440.
Features: Small ceramic package size
• Glass-lensed optics for efficient optical
coupling • Upright or inverted mounting
capability • Low profile, small size for
flexible layout of multiple channels
and custom arrays • Compatible with
automated solder processes • Choice of
photodiode or phototransistor detectors
• Infrared emitter features high power
dissipation capability • Tape and reel
packaging option (pick and place
machine compatible)
Benefits: Lens minimizes cross-talk and
often eliminates the need for apertures
in non-critical applications. Low profile
components may be mounted on
the printed circuit board, lens up or
inverted, allowing flexibility in layouts
for multiple channel and custom arrays.
Phototransistor’s gain characteristics often
make it useful for potential applications
requiring high responsivity. Potential
applications include optical encoders
for motion control, computer peripherals,
vending and point-of-sale applications,
smoke detectors, and medical equipment.
ENCODER DETECTORS
HLC2701.
Features: Side-looking plastic package
• TTL/LSTTL/CMOS compatible • Senses
speed and direction of mechanical motion
• Inverting logic output • Linear or rotary
encoder applications • Resolution to
0,229 mm [0.009 in] • Sensitivity versus
temperature compensation • Mechanically
and spectrally matched to SEP8506 and
SEP8706 infrared emitters
Benefits: Monolithic IC, consisting of two
narrow adjacent photodiodes, amplifiers,
and Schmitt trigger output stages.
Outputs are NPN collectors with internal
10 kOhm (nominal) pull-up resistors to
Vcc which can directly drive TTL loads.
Circuitry compensates the sensitivity for
the output power versus temperature
characteristics of an infrared emitter. IC is
encapsulated in a molded, unlensed black