SFH 4641-Z OSRAM Opto Semiconductors Inc, SFH 4641-Z Datasheet
SFH 4641-Z
Specifications of SFH 4641-Z
Q65110A8098
SFH 4641-Z
Related parts for SFH 4641-Z
SFH 4641-Z Summary of contents
Page 1
... High Power Infrared LED • Short switching times • Narrow halfangle (± 15°) • Low profile component • Usable as top-looking and side-looking device • SFH 4641: Taping as Toplooker SFH 4646: Taping as Sidelooker Applications • Infrared Illumination for cameras • IR Data Transmission • ...
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... I FSM P tot R thJA 2 2 each R thJS Symbol Symbol λ peak λ centroid Δλ I max I max ϕ SFH 4641, SFH 4646 Wert Einheit Value Unit – 40 … + 100 ° 700 mA 140 mW 380 K/W 220 K/W Wert Einheit Value Unit 950 nm 940 ...
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... Symbol × × Ω Ω Φ e typ bzw. Φ Φ λ SFH 4641, SFH 4646 Wert Einheit Value Unit 0.2 × 0.2 mm² 1.6 (< 2.0) V 2.4 (< 3.0) V μA not designed for reverse operation 33 mW – 0.5 %/K – 3.5 mV/K + 0.3 nm/K ...
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... Symbol - min max I 120 e typ f = (ϕ) rel 10˚ 0˚ 1.0 0.8 0.6 0.4 0.2 0 0˚ 20˚ 40˚ 60˚ 80˚ 4 SFH 4641, SFH 4646 Werte Values - 125 185 295 465 OHF03823 100˚ 120˚ Einheit Unit mW/sr mW/sr mW/sr ...
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... Capability (τ), duty cycle D = parameter OHF04058 0 0 0.005 0.01 0.4 0.02 0.05 0.1 0.3 0.2 0.3 0.5 0 SFH 4641, SFH 4646 Max. Permissible Forward Current 380 K thJA Permissible Pulse Handling Capability (τ), duty cycle D = parameter 0 0.6 0.5 0.4 ...
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... Maßzeichnung Package Outlines Maß Dimensions in mm. Gehäuse / Package MID mit klarem Silikonverguss / MID casted with clear Silicone Anschlussbelegung Pad 1 = Anode / anode Pin configuration Pad 2 = Kathode / cathode 2009-09-08 SFH 4641, SFH 4646 6 ...
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... SFH 4641 Optical axis/viewing direction 7 SFH 4641, SFH 4646 Verpackungseinheit 2000/Rolle, ø180 mm oder 9000/Rolle, ø330 mm Packing unit 2000/reel, ø180 mm or 9000/reel, ø330 mm 0.3 (0.012) ±0.02 (0.001) 1.75 (0.069) ±0.05 (0.002) OHAY2431 0.3 (0.012) ± ...
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... Verarbeitungshinweis: Das Gehäuse ist mit Silikon vergossen. Mechanischer Stress auf der Bauteiloberfläche sollte so gering wie möglich gehalten werden. Handling indication: The package is casted with silicone. Mechanical stress at the surface of the unit should be as low as possible. 2009-09- SFH 4641, SFH 4646 2.4 OHF02422 1.7 OHF02421 ...
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... Preconditioning acc. to JEDEC Level 2 (nach J-STD-020C) (acc. to J-STD-020C) Maximum Solder Profile Recommended Solder Profile Minimum Solder Profile 120 s max 50 100 150 9 SFH 4641, SFH 4646 OHLA0687 +0 ˚C 260 ˚C -5 ˚C 245 ˚C ±5 ˚C +5 ˚C 235 ˚C -0 ˚ min 30 s max ...