HLMP-3750 Avago Technologies US Inc., HLMP-3750 Datasheet - Page 11

• Manufacturer Part Number: HLMP-3750
• Description: LED 5MM 635NM HE RED WATER CLEAR
• Manufacturer: Avago Technologies US Inc.
• Type: Uni-Colorr

Specifications of HLMP-3750

• Viewing Angle: 24°
• Package / Case: Radial - 2 Lead
• Color: Red
• Millicandela Rating: 125mcd
• Current - Test: 20mA
• Wavelength - Dominant: 626nm
• Wavelength - Peak: 635nm
• Voltage - Forward (vf) Typ: 1.9V
• Lens Type: Clear
• Lens Style/size: Round, 5mm, T-1 3/4
• Height: 8.81mm
• Mounting Type: Through Hole
• Resistance Tolerance: 626nm
• Led Size: T-1 3/4
• Illumination Color: Red
• Lens Color/style: Non-Diffused
• Operating Voltage: 1.9 V
• Wavelength: 626 nm
• Luminous Intensity: 125 mcd
• Operating Current: 25 mA
• Lens Dimensions: 5 mm
• Lens Shape: Dome
• Maximum Operating Temperature: + 100 C
• Minimum Operating Temperature: - 40 C
• Mounting Style: Through Hole
• Application: For lighted switches, backlighting front panels, light pipe sources, keyboard indicators
• Color, Emitted: Red
• Color, Lens: Clear
• Current, Forward: 25 mA
• Diameter: 0.2 in.
• Package Type: 5 mm (T-13⁄4)
• Temperature, Operating, Maximum: 100 °C
• Temperature, Operating, Minimum: -55 °C
• Temperature, Soldering: 260 °C For 5 Sec
• Voltage, Forward: 1.9 V
• Voltage, Reverse: 5 V
• Wavelength, Peak: 635 nm
• Emitting Color: Red
• Test Current (it): 20mA
• Forward Current: 25mA
• Dominant Wave Length: 626nm
• Forward Voltage: 2.6V
• Product Length (mm): 6.1mm
• Product Height (mm): 9.19mm
• Product Depth (mm): 6.1mm
• Mounting: Through Hole
• Peak Wavelength: 635nm
• Shape Type: Circular
• Chip Material: GaP
• Main Category: Standard LED
• Number Of Elements: 1
• Pin Count: 2
• Operating Temperature Classification: Industrial
• Operating Temp Range: -40C to 100C
• Reverse Voltage: 5V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Luminous Flux @ Current - Test: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 516-1345

11
Example of Wave Soldering Temperature Profile for TH LED
Packaging Label:
(i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box)
(1T) Lot: Lot Number
LPN:
(9D)MFG Date: Manufacturing Date
(P) Customer Item:
DeptID:
(1P) Item: Part Number
(V) Vendor ID:
250
200
150
100
50
0
10
20
30
PREHEAT
TURBULENT WAVE
40
TIME (MINUTES)
Made In: Country of Origin
(9D) Date Code: Date Code
50
STANDARD LABEL LS0002
RoHS Compliant
e3
(Q) QTY: Quantity
BIN: Color Bin
CAT: Intensity Bin
60
max temp 250C
70
LAMINAR
80
HOT AIR KNIFE
90
100
Recommended solder:
Sn63 (Leaded solder alloy)
SAC305 (Lead free solder alloy)
Flux: Rosin flux
Solder bath temperature:
245°C± 5°C (maximum peak temperature = 250°C)
Dwell time: 1.5 sec – 3.0 sec (maximum = 3sec)
Note: Allow for board to be sufficiently cooled to
room temperature before exerting mechanical force.
Recommended solder:
Sn63 (Leaded solder alloy)
SAC305 (Lead free solder alloy)
Flux: Rosin flux
Solder bath temperature:
245°C± 5°C (maximum peak temperature = 250°C)
Dwell time: 1.5 sec – 3.0 sec (maximum = 3sec)
Note: Allow for board to be sufficiently cooled to
room temperature before exerting mechanical force.