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XLT20SO1-1
XLT20SO1-1 | |
|---|---|
| Manufacturer Part Number | XLT20SO1-1 |
| Description | SOCKET TRANS ICE 20DIP TO 20SOIC |
| Manufacturer | Microchip Technology |
| XLT20SO1-1 datasheets |
|
Availability: By request
International delivery:
Warranty: 60 days
×
- We provide standard 60-days warranty for all parts. If warranty differs we always mention it beforehand. In case of return we cover shipping costs.
- If you still have any questions - please contact us
×
Shipping terms
- Standard delivery time differs from 5-8 business days if the supplier is a local one to 12-14 days if the suplier is from overseas. If delivery time differs it's always mentioned in our quotation.
- We ship worldwide using main international couriers like FedEx, DHL, UPS, TNT, EMS. We can also use client's freight account. Other shipping methods can be discussed. We do best to meet your needs!
Payment terms
- For new client payment term is payment in advance. At this moment we accept 3 payment methods: wire transfer, PayPal and Western Union. Credit card payment is under constrution and will be introduced soon. Escrow service is acceptable. Net terms for regular customers is not a problem. Working with us is totally safe for you.
- If you still have any questions - please contact us
Specifications of XLT20SO1-1 | |||
|---|---|---|---|
| Module/board Type | * | Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
| For Use With/related Products | MPLAB™ICE | For Use With | AC244023 - PROC EXTENS PAK PIC18F1XK50AC162061 - HEADER INTRFC MPLAB ICD2 20PINAC162060 - HEADER INTRFC MPLAB ICD2 20PINDVA1004 - DEVICE ADAPTER 8/14/20DIPDVA16XP202 - ADAPTER DEVICE PIC16C781/782DVA16XP200 - ADAPTER ICE 20DIP/SOIC/SSOP |
PrevNext
Transition Socket Specification
TRANSITION SOCKET
APPLICATIONS – COMMENTS
AND SUGGESTIONS
Attention to component placement should be consid-
ered in mating the adapter sockets to the SOIC/SSOP
headers.
The placement of vias around the Surface Mount
Technology (SMT) layout area should be examined.
Vias immediately adjacent to the end of a SMT pad
may inadvertently come into contact with the header
leads. Vias should be placed along the center line of
the SMT pad to lessen the chance of pin-to-pin shorts
while soldering.
Care should be taken when soldering some transition
sockets to target boards. See the releated section for
specific instructions.
For information on packaging dimensions, please refer
to the Packaging Specification (DS00049).
DS51194S-page 4
GLOSSARY
Terms used in this document:
DFN – Dual Flat No lead
DIP – Dual In-line Package
MQFP – Metric Quad Flat Pack
PDIP – Plastic Dual In-line Package
PLCC – Plastic Leaded Chip Carrier
QFN – Quad Flat No lead
QFP – Quad Flat Pack
SOIC – Small Outline IC
SOT – Small Outline Transistor
SSOP – Shrink Small Outline Package
TQFP – Thin Quad Flat Pack
2010 Microchip Technology Inc.
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