XLT44PT3 Microchip Technology, XLT44PT3 Datasheet - Page 4

SOCKET TRAN ICE 44MQFP/TQFP

XLT44PT3

Manufacturer Part Number
XLT44PT3
Description
SOCKET TRAN ICE 44MQFP/TQFP
Manufacturer
Microchip Technology
Datasheets

Specifications of XLT44PT3

Module/board Type
*
Product
Microcontroller Accessories
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With/related Products
MPLAB™ICE
For Use With
DAF18-5 - DEVICE ADAPTOR FOR ICE4000DAF30-3 - DEVICE ATP FOR ICE4000DVA18PQ440 - DEVICE ADAPTER 18F4220 TQFP 44LDDVA17PQ441 - DEVICE ADAPTER FOR PIC17C42ADVA16PQ441 - ADAPTER DEVICE ICE 44PQFP/TQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Transition Socket Specification
TRANSITION SOCKET
APPLICATIONS – COMMENTS
AND SUGGESTIONS
Attention to component placement should be consid-
ered in mating the adapter sockets to the SOIC/SSOP
headers.
The placement of vias around the Surface Mount
Technology (SMT) layout area should be examined.
Vias immediately adjacent to the end of a SMT pad
may inadvertently come into contact with the header
leads. Vias should be placed along the center line of
the SMT pad to lessen the chance of pin-to-pin shorts
while soldering.
Care should be taken when soldering some transition
sockets to target boards. See the releated section for
specific instructions.
For information on packaging dimensions, please refer
to the Packaging Specification (DS00049).
DS51194S-page 4
GLOSSARY
Terms used in this document:
DFN – Dual Flat No lead
DIP – Dual In-line Package
MQFP – Metric Quad Flat Pack
PDIP – Plastic Dual In-line Package
PLCC – Plastic Leaded Chip Carrier
QFN – Quad Flat No lead
QFP – Quad Flat Pack
SOIC – Small Outline IC
SOT – Small Outline Transistor
SSOP – Shrink Small Outline Package
TQFP – Thin Quad Flat Pack
 2010 Microchip Technology Inc.

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