AD9551/PCBZ Analog Devices Inc, AD9551/PCBZ Datasheet - Page 25

• Manufacturer Part Number: AD9551/PCBZ
• Description: BOARD EVAL FOR AD9951
• Manufacturer: Analog Devices Inc

Specifications of AD9551/PCBZ

• Main Purpose: Timing, Clock Generator
• Embedded: No
• Utilized Ic / Part: AD9551
• Primary Attributes: 2 Inputs, 2 Outputs, VCO
• Secondary Attributes: Graphical User Interface, USB Interface
• Silicon Manufacturer: Analog Devices
• Application Sub Type: Clock Generator
• Kit Application Type: Clock & Timing
• Silicon Core Number: AD9551
• Kit Contents: Board
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

APPLICATIONS INFORMATION
THERMAL PERFORMANCE
Table 18. Thermal Parameters for the 40-Lead LFCSP Package
Symbol
θ
θ
θ
θ
θ
Ψ
1
2
The AD9551 is specified for a case temperature (T
ensure that T
Use the following equation to determine the junction tempera-
ture on the application PCB:
where:
T
T
the top center of the package.
Ψ
PD is the power dissipation (see the Power Consumption section).
Results are from simulations. The PCB is a JEDEC multilayer type. Thermal performance for actual applications requires careful inspection of the conditions in the
The exposed pad on the bottom of the package must be soldered to ground to achieve the specified thermal performance.
application to determine if they are similar to those assumed in these calculations.
JA
JMA
JMA
JB
JC
J
CASE
JT
JT
is the junction temperature (°C).
is the value indicated in Table 18.
T
is the case temperature (°C) measured by the customer at
J
= T
CASE
Thermal Characteristic Using a JEDEC51-7 Plus JEDEC51-5 2S2P Test Board
Junction-to-ambient thermal resistance, 0.0 m/sec airflow per JEDEC JESD51-2 (still air)
Junction-to-ambient thermal resistance, 1.0 m/sec airflow per JEDEC JESD51-6 (moving air)
Junction-to-ambient thermal resistance, 2.5 m/sec airflow per JEDEC JESD51-6 (moving air)
Junction-to-board thermal resistance, 1.0 m/sec airflow per JEDEC JESD51-8 (moving air)
Junction-to-case thermal resistance (die-to-heat sink) per MIL-Std 883, Method 1012.1
Junction-to-top-of-package characterization parameter, 0 m/sec airflow per JEDEC JESD51-2 (still air)
CASE
+ ( Ψ
is not exceeded, an airflow source can be used.
JT
× PD )
CASE
). To
Rev. B | Page 25 of 40
Values of θ
considerations. θ
of T
where T
Values of θ
design considerations when an external heat sink is required.
Values of θ
design considerations.
J
T
using the following equation:
J
= T
A
is the ambient temperature (°C).
JA
A
JC
JB
are provided for package comparison and PCB design
+ ( θ
are provided for package comparison and PCB
are provided for package comparison and PCB
1
JA
JA
× PD )
can be used for a first-order approximation
Value
45
40
36
28
8
0.6
AD9551
2
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W