AD6645-MIL/PCB Analog Devices Inc, AD6645-MIL/PCB Datasheet - Page 24

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AD6645-MIL/PCB

Manufacturer Part Number
AD6645-MIL/PCB
Description
BOARD EVAL AD6645-MIL/PCB
Manufacturer
Analog Devices Inc
Series
SoftCell®r
Datasheet

Specifications of AD6645-MIL/PCB

Design Resources
Low Jitter Sampling Clock Generator for High Performance ADCs Using AD9958/9858 and AD9515 (CN0109)
Number Of Adc's
1
Number Of Bits
14
Sampling Rate (per Second)
80M
Data Interface
Parallel
Inputs Per Adc
1 Differential
Input Range
2.2 Vpp
Power (typ) @ Conditions
1.5W @ 80MSPS
Voltage Supply Source
Analog and Digital
Operating Temperature
-35°C ~ 85°C
Utilized Ic / Part
AD6645 80MSPS
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
AD6645
OUTLINE DIMENSIONS
ORDERING GUIDE
Model
AD6645ASQ-80
AD6645ASQZ-80
AD6645ASVZ-80
AD6645ASQ-105
AD6645ASQZ-105
AD6645ASVZ-105
AD6645-80/PCBZ
AD6645-105/PCBZ
1
©2002–2008 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
Z = RoHS Compliant Part.
1.05
1.00
0.95
0.15
0.05
ROTATED 90 ° CCW
1.45
1.40
1.35
VIEW A
ROTATED 90° CCW
1
1
0.15
0.05
1
1
1
1
0° MIN
VIEW A
SEATING
PLANE
Temperature Range
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−10°C to +85°C
−10°C to +85°C
−10°C to +85°C
SEATING
0.08 MAX
COPLANARITY
0.75
0.60
0.45
PLANE
0.20
0.09
3.5°
0.10 MAX
COPLANARITY
0.20
0.08
1.20
MAX
Figure 48. 52-Lead Low Profile Quad Flat Package, PowerQuad [LQFP_PQ4]
D02647-0-10/08(D)
Figure 49. 52-Lead Thin Quad Flat Package, Exposed Pad [TQFP_EP]
13
1
VIEW A
52
14
COMPLIANT TO JEDEC STANDARDS MS-026-BCC-HD
PIN 1
COMPLIANT TO JEDEC STANDARDS MS-026-ACC
Package Description
52-Lead Low Profile Quad Flat Package, PowerQuad (LQFP_PQ4)
52-Lead Low Profile Quad Flat Package, PowerQuad (LQFP_PQ4)
52-Lead Thin Quad Flat Package, Exposed Pad [TQFP_EP]
52-Lead Low Profile Quad Flat Package, PowerQuad (LQFP_PQ4)
52-Lead Low Profile Quad Flat Package, PowerQuad (LQFP_PQ4)
52-Lead Thin Quad Flat Package, Exposed Pad [TQFP_EP]
Evaluation Board
Evaluation Board
13
1
52
14
(PINS DOWN)
12.00 BSC
TOP VIEW
Dimensions shown in millimeters
Dimensions shown in millimeters
LEAD PITCH
SQ
12.20
12.00 SQ
11.80
BSC
(PINS DOWN)
0.65
TOP VIEW
Rev. D | Page 24 of 24
(SQ-52-1)
(SV-52-1)
40
26
0.38
0.32
0.22
39
27
BSC SQ
40
26
10.00
39
27
2.65
2.50 (4 PLCS)
2.35
39
27
27
39
26
40
26
40
LEAD PITCH
BSC
0.65
BOTTOM VIEW
BOTTOM VIEW
EXPOSED
HEAT SINK
(CENTERED)
(PINS UP)
EXPOSED
(PINS UP)
PAD
2.35
2.20 (4 PLCS)
2.05
0.38
0.32
0.22
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
52
14
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
14
52
13
1
13
1
6.50 BSC
6.05
5.90 SQ
5.75
SQ
10.20
10.00 SQ
9.80
Package Option
SQ-52-1
SQ-52-1
SV-52-1
SQ-52-1
SQ-52-1
SV-52-1

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