ISL6559EVAL2 Intersil, ISL6559EVAL2 Datasheet - Page 19

• Manufacturer Part Number: ISL6559EVAL2
• Description: EVALUATION BOARD 2 ISL6559
• Manufacturer: Intersil

Specifications of ISL6559EVAL2

• Main Purpose: Special Purpose DC/DC, VRM Supply
• Outputs And Type: 1, Non-Isolated
• Power - Output: 67.6W
• Voltage - Output: 1.3V
• Current - Output: 52A
• Voltage - Input: 5V, 12V
• Regulator Topology: Buck
• Frequency - Switching: 250kHz
• Board Type: Fully Populated
• Utilized Ic / Part: HIP6601, ISL6559
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

MULTIPHASE RMS IMPROVEMENT
Figure 18 is provided as a reference to demonstrate the
dramatic reductions in input-capacitor RMS current upon the
implementation of the multiphase topology. For example,
compare the input rms current requirements of a two-phase
converter versus that of a single phase. Assume both
converters have a duty cycle of 0.25, maximum sustained
output current of 40A, and a ratio of I
single phase converter would require 17.3 Arms current
capacity while the two-phase converter would only require 10.9
Arms. The advantages become even more pronounced when
output current is increased and additional phases are added to
keep the component cost down relative to the single phase
approach.
Layout Considerations
The following multi-layer printed circuit board layout strategies
minimize the impact of board parasitics on converter
performance. The following sections highlight some important
practices which should not be overlooked during the layout
process.
Component Placement
Within the allotted implementation area, orient the switching
components first. The switching components are the most
critical because they switch large amounts of energy and
tend to generate large amounts of noise. How the switching
components are placed should also take into account power
dissipation. Align the output inductors and MOSFETs such
that space between the components is minimized while
creating the PHASE plane. Place the Intersil HIP660X
drivers as close as possible to the MOSFETs they control to
reduce the parasitics due to trace length between critical
driver input and output signals. If possible, duplicate the
same placement of these components for each phase.
Next, place the input and output capacitors. Position one
high-frequency ceramic input capacitor next to each upper
FIGURE 18. NORMALIZED INPUT-CAPACITOR RMS CURRENT
0.6
0.4
0.2
0
0
I
I
I
VS DUTY CYCLE FOR SINGLE-PHASE
CONVERTER
C,PP
C,PP
C,PP
0.2
= 0
= 0.5 I
= 0.75 I
DUTY CYCLE (V
O
O
0.4
19
C,PP
0.6
IN
/ V
to I
O
)
O
of 0.5. The
0.8
1.0
ISL6559
MOSFET drain. Place the bulk input capacitors as close to
the upper MOSFET drains as dictated by the component
size and dimensions. Long distances between input
capacitors and MOSFET drains results in too much trace
inductance and a reduction in capacitor performance. Locate
the output capacitors between the inductors and the load,
while keeping them in close proximity around the
microprocessor socket.
The ISL6559 can be placed off to one side or centered
relative to the individual phase switching components.
Routing of sense lines and PWM signals will guide final
placement. Critical small signal components to place close
to the controller include the ISEN resistors, R
feedback resistor, and compensation components.
Bypass capacitors for the ISL6559 and HIP660X driver bias
supplies must be placed next to their respective pins. Stray
trace parasitics will reduce their effectiveness.
Plane Allocation and Routing
Dedicate one solid layer, usually a middle layer, for a ground
plane. Make all critical component ground connections with
vias to this plane. Dedicate one additional layer for power
planes; breaking the plane up into smaller islands of
common voltage. Use the remaining layers for small signal
wiring.
Route PHASE planes of copper filled polygons on the top
and bottom once the switching component placement is set.
Size the trace width between the driver gate pins and the
MOFET gates to carry 1A of current. When routing
components in the switching path, use short wide traces to
reduce the associated parasitics.
T
December 29, 2004
resistor,
FN9084.8