ISL6553EVAL1 Intersil, ISL6553EVAL1 Datasheet - Page 13

• Manufacturer Part Number: ISL6553EVAL1
• Description: EVALUATION BOARD ISL6553
• Manufacturer: Intersil
• Series: Endura™r

Specifications of ISL6553EVAL1

• Main Purpose: Special Purpose DC/DC, VRM Supply
• Outputs And Type: 1, Non-Isolated
• Power - Output: 45W
• Voltage - Output: 1.5V
• Current - Output: 30A
• Voltage - Input: 5V, 12V
• Regulator Topology: Buck
• Frequency - Switching: 350kHz
• Board Type: Fully Populated
• Utilized Ic / Part: HIP6601, ISL6553
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

Component Selection Guidelines
Output Capacitor Selection
The output capacitor is selected to meet both the dynamic
load requirements and the voltage ripple requirements. The
load transient for the microprocessor CORE is characterized
by high slew rate (di/dt) current demands. In general,
multiple high quality capacitors of different size and dielectric
are paralleled to meet the design constraints.
Modern microprocessors produce severe transient load rates.
High frequency capacitors supply the initially transient current
and slow the load rate-of-change seen by the bulk capacitors.
The bulk filter capacitor values are generally determined by
the ESR (effective series resistance) and voltage rating
requirements rather than actual capacitance requirements.
High frequency decoupling capacitors should be placed as
close to the power pins of the load as physically possible. Be
careful not to add inductance in the circuit board wiring that
could cancel the usefulness of these low inductance
components. Consult with the manufacturer of the load on
specific decoupling requirements.
Use only specialized low-ESR capacitors intended for
switching-regulator applications for the bulk capacitors. The
bulk capacitor’s ESR determines the output ripple voltage
and the initial voltage drop following a high slew-rate
transient’s edge. In most cases, multiple capacitors of small
case size perform better than a single large case capacitor.
Bulk capacitor choices include aluminum electrolytic, OS-
Con, Tantalum and even ceramic dielectrics. An aluminum
electrolytic capacitor’s ESR value is related to the case size
with lower ESR available in larger case sizes. However, the
equivalent series inductance (ESL) of these capacitors
LOCATE NEXT
KEY
TO FB PIN
+5V
ISLAND ON POWER PLANE LAYER
IN
C
R
R
BP
C
FB
IN
T
13
FIGURE 11. PRINTED CIRCUIT BOARD POWER PLANES AND ISLANDS
LOCATE NEXT TO IC PIN(S)
VCC
COMP
FB
VSEN
ISL6553
FS/DIS
PWM
ISEN
R
LOCATE NEXT TO IC PIN
SEN
R
T
C
BP
ISLAND ON CIRCUIT PLANE LAYER
ISL6553
+12V
VCC
HIP6601
PVCC
increases with case size and can reduce the usefulness of
the capacitor to high slew-rate transient loading.
Unfortunately, ESL is not a specified parameter. Consult the
capacitor manufacturer and measure the capacitor’s
impedance with frequency to select a suitable component.
Output Inductor Selection
One of the parameters limiting the converter’s response to a
load transient is the time required to change the inductor
current. Small inductors in a multi-phase converter reduces
the response time without significant increases in total ripple
current.
The output inductor of each power channel controls the
ripple current. The control IC is stable for channel ripple
current (peak-to-peak) up to twice the average current. A
single channel’s ripple current is approximately:
The current from multiple channels tend to cancel each other
and reduce the total ripple current. Figure 12 gives the total
ripple current as a function of duty cycle, normalized to the
parameter
total ripple current from the number of channels and the duty
cycle, multiply the y-axis value by
Small values of output inductance can cause excessive power
dissipation. The ISL6553 is designed for stable operation for
ripple currents up to twice the load current. However, for this
condition, the RMS current is 115% above the value shown in
the following MOSFET Selection and Considerations section.
With all else fixed, decreasing the inductance could increase
the power dissipated in the MOSFETs by 30%.
∆I
=
V
------------------------------- -
PHASE
IN
F
SW
–
C
V
BOOT
(
xL
Vo
OUT
)
⁄
×
(
L F
USE INDIVIDUAL METAL RUNS
FOR EACH CHANNEL TO HELP
ISOLATE OUTPUT STAGES
V
--------------- -
⋅
V
OUT
IN
S
C
)
L
IN
O1
at zero duty cycle. To determine the
VIA CONNECTION TO GROUND PLANE
C
OUT
LOCATE NEAR TRANSISTOR
V
(
CORE
Vo
)
⁄
(
LxF
SW
)
.