LMC8101BPCONV National Semiconductor, LMC8101BPCONV Datasheet - Page 18

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LMC8101BPCONV

Manufacturer Part Number
LMC8101BPCONV
Description
BOARD EVALUATION LMC8101BP
Manufacturer
National Semiconductor
Datasheet

Specifications of LMC8101BPCONV

Channels Per Ic
1 - Single
Amplifier Type
General Purpose
Output Type
Single-Ended
Board Type
Bare (Unpopulated)
Utilized Ic / Part
LMC8101BP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Operating Temperature
-
Current - Output / Channel
-
Voltage - Supply, Single/dual (±)
-
-3db Bandwidth
-
Slew Rate
-
Current - Supply (main Ic)
-
Physical Dimensions
inches (millimeters) unless otherwise noted (Continued)
NOTES: UNLESS OTHERWISE SPECIFIED
1. EPOXY COATING
2. FOR SOLDER BUMP COMPOSITION, SEE “SOLDER INFORMATION”. IN THE PACKAGING SECTION OF THE NATIONAL SEMICONDUCTOR WEB
PAGE (www.national.com)
3. RECOMMENDED NON-SOLDER MASK DEFINED LANDING PAD.
4. PIN A1 IS ESTABLISHED BY LOWER LEFT CORNER WITH RESPECT TO TEXT ORIENTATION.
5. XXX IN DRAWING NUMBER REPRESENTS PACKAGE SIZE VARIATION WHERE X1 IS PACKAGE WIDTH, X2 IS PACKAGE LENGTH AND X3 IS
PACKAGE HEIGHT.
6. REFERENCE JEDEC REGISTRATION MO-211, VARIATION BC.
8-Bump micro SMD (Lead Free) Package
Order Package Number LMC8101TP, or LMC8101TPX
NS Package Number TPA08FFA
X
= 1.412 mm X
= 1.412 mm X
= 0.5 mm
1
2
3
www.national.com
18

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