C8051F060DK Silicon Laboratories Inc, C8051F060DK Datasheet - Page 5

DEV KIT FOR F060/F062/F063

C8051F060DK

Manufacturer Part Number
C8051F060DK
Description
DEV KIT FOR F060/F062/F063
Manufacturer
Silicon Laboratories Inc
Type
MCUr
Datasheet

Specifications of C8051F060DK

Contents
Evaluation Board, Power Supply, USB Cables, Adapter and Documentation
Processor To Be Evaluated
C8051F06x
Interface Type
USB
Silicon Manufacturer
Silicon Labs
Core Architecture
8051
Silicon Core Number
C8051F060
Silicon Family Name
C8051F06x
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
For Use With/related Products
C8051060, C8051F062 and C8051F063
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
336-1214

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
C8051F060DK
Manufacturer:
Silicon Labs
Quantity:
135
15. Oscillators ............................................................................................................. 171
16. Flash Memory ....................................................................................................... 177
17. External Data Memory Interface and On-Chip XRAM........................................ 187
18. Port Input/Output.................................................................................................. 203
15.1.Programmable Internal Oscillator ................................................................... 171
15.2.External Oscillator Drive Circuit...................................................................... 173
15.3.System Clock Selection.................................................................................. 173
15.4.External Crystal Example ............................................................................... 175
15.5.External RC Example ..................................................................................... 175
15.6.External Capacitor Example ........................................................................... 175
16.1.Programming The Flash Memory ................................................................... 177
16.2.Non-volatile Data Storage .............................................................................. 178
16.3.Security Options ............................................................................................. 179
17.1.Accessing XRAM............................................................................................ 187
17.2.Configuring the External Memory Interface .................................................... 188
17.3.Port Selection and Configuration.................................................................... 188
17.4.Multiplexed and Non-multiplexed Selection.................................................... 190
17.5.Memory Mode Selection................................................................................. 192
17.6.Timing .......................................................................................................... 194
18.1.Ports 0 through 3 and the Priority Crossbar Decoder..................................... 205
14.7.1.Enable/Reset WDT ................................................................................ 166
14.7.2.Disable WDT .......................................................................................... 166
14.7.3.Disable WDT Lockout ............................................................................ 166
14.7.4.Setting WDT Interval .............................................................................. 166
16.3.1.Summary of Flash Security Options....................................................... 183
17.1.1.16-Bit MOVX Example ........................................................................... 187
17.1.2.8-Bit MOVX Example ............................................................................. 187
17.4.1.Multiplexed Configuration....................................................................... 190
17.4.2.Non-multiplexed Configuration............................................................... 191
17.5.1.Internal XRAM Only ............................................................................... 192
17.5.2.Split Mode without Bank Select.............................................................. 192
17.5.3.Split Mode with Bank Select................................................................... 193
17.5.4.External Only.......................................................................................... 193
17.6.1.Non-multiplexed Mode ........................................................................... 196
17.6.2.Multiplexed Mode ................................................................................... 199
18.1.1.Crossbar Pin Assignment and Allocation ............................................... 205
18.1.2.Configuring the Output Modes of the Port Pins...................................... 206
18.1.3.Configuring Port Pins as Digital Inputs................................................... 207
18.1.4.Weak Pull-ups ........................................................................................ 207
17.6.1.1.16-bit MOVX: EMI0CF[4:2] = ‘101’, ‘110’, or ‘111’......................... 196
17.6.1.2.8-bit MOVX without Bank Select: EMI0CF[4:2] = ‘101’ or ‘111’..... 197
17.6.1.3.8-bit MOVX with Bank Select: EMI0CF[4:2] = ‘110’....................... 198
17.6.2.1.16-bit MOVX: EMI0CF[4:2] = ‘001’, ‘010’, or ‘011’......................... 199
17.6.2.2.8-bit MOVX without Bank Select: EMI0CF[4:2] = ‘001’ or ‘011’..... 200
17.6.2.3.8-bit MOVX with Bank Select: EMI0CF[4:2] = ‘010’....................... 201
Rev. 1.2
C8051F060/1/2/3/4/5/6/7
5

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