AD9517-4/PCBZ Analog Devices Inc, AD9517-4/PCBZ Datasheet - Page 54

• Manufacturer Part Number: AD9517-4/PCBZ
• Description: BOARD EVALUATION AD9517-4
• Manufacturer: Analog Devices Inc

Specifications of AD9517-4/PCBZ

• Design Resources: High Performance, Dual Channel IF Sampling Receiver (CN0140)
• Main Purpose: Timing, Clock Generator
• Utilized Ic / Part: AD9517-4
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

AD9517-4
THERMAL PERFORMANCE
Table 51. Thermal Parameters for the 48-Lead LFCSP
Symbol
θ
θ
θ
θ
Ψ
Ψ
Ψ
θ
Ψ
Ψ
Ψ
The AD9517 is specified for a case temperature (T
that T
Use the following equation to determine the junction
temperature on the application PCB:
where:
T
T
top center of the package.
Ψ
PD is the power dissipation (see the total power dissipation in
Table 17).
JA
JMA
JMA
JB
JC
J
CASE
JB
JB
JB
JT
JT
JT
JT
is the junction temperature (°C).
is the value from Table 51.
T
is the case temperature (°C) measured by the user at the
CASE
J
= T
is not exceeded, an airflow source can be used.
CASE
Thermal Characteristic Using a JEDEC JESD51-7 Plus JEDEC JESD51-5 2S2P Test Board
Junction-to-ambient thermal resistance, natural convection per JEDEC JESD51-2 (still air)
Junction-to-ambient thermal resistance, 1.0 m/sec airflow per JEDEC JESD51-6 (moving air)
Junction-to-ambient thermal resistance, 2.5 m/sec airflow per JEDEC JESD51-6 (moving air)
Junction-to-board thermal resistance, natural convection per JEDEC JESD51-8 (still air)
Junction-to-board characterization parameter, natural convection per JEDEC JESD51-6 (still air)
and JEDEC JESD51-8
Junction-to-board characterization parameter, 1.0 m/sec airflow per JEDEC JESD51-6 (moving air)
and JEDEC JESD51-8
Junction-to-board characterization parameter, 2.5 m/sec airflow per JEDEC JESD51-6 (moving air)
and JEDEC JESD51-8
Junction-to-case thermal resistance (die-to-heat sink) per MIL-STD-883, Method 1012.1
Junction-to-top-of-package characterization parameter, natural convection per JEDEC JESD51-2 (still air)
Junction-to-top-of-package characterization parameter, 1.0 m/sec airflow per JEDEC JESD51-2 (still air)
Junction-to-top-of-package characterization parameter, 2.0 m/sec airflow per JEDEC JESD51-2 (still air)
+ (Ψ
JT
× PD)
CASE
). To ensure
Rev. B | Page 54 of 80
Values of θ
design considerations. θ
approximation of T
where T
Values of θ
design considerations when an external heat sink is required.
Values of Ψ
design considerations.
T
J
= T
A
is the ambient temperature (°C).
A
JA
JC
JB
+ (θ
are provided for package comparison and PCB
are provided for package comparison and PCB
are provided for package comparison and PCB
JA
× PD)
J
by the equation
JA
can be used for a first-order
Value (°C/W)
24.7
21.6
19.4
12.9
11.9
11.8
11.6
1.3
0.1
0.2
0.3