C0816X7R1C103K TDK Corporation, C0816X7R1C103K Datasheet
C0816X7R1C103K
Specifications of C0816X7R1C103K
C0816X7R1C103KT
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C0816X7R1C103K Summary of contents
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C Series Low ESL Flipped Type Type: C0510 [EIA CC0204] C0816 [EIA CC0306] C1220 [EIA CC0508] C1632 [EIA CC0612] Issue date: January 2011 TDK MLCC US Catalog Version A11 ...
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If you intend to use a product listed in this catalog for a purpose that may cause loss of life or other damage, you must contact our company’s sales window may modify products or discontinue production of ...
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Positioning the electrodes along the length of the chip Features device, reduces ESR and ESL components over conventional products. • Provides high frequency noise suppression effect because the resonating frequency is high. • Flipped geometry provides low inductance (less ...
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Capacitance Range Chart Capacitance Range Chart Temperature Characteristics: X6S (± 22%) Rated Voltage: 4V (0G) Capacitance Cap Tolerance (pF) Code 10,000 103 M: ± 20% 22,000 223 47,000 473 100,000 104 220,000 224 470,000 474 1,000,000 105 2,200,000 225 Capacitance ...
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... Capacitance Range Table Class 2 (Temperature Stable) Temperature Characteristics: X7R, (± 15%), X7S (± 22%), X5R (± 15%), X6S (± 22%) TDK Part Number Temperature (Ordering Code) Characteristics C0816X7R1C103K X7R C0816X7R1C223K X7R C0816X7R1C473K X7R C0816X7R1C104K X7R C0816X7R0J224K X7R C0816X7S0G474K X7S C0816X7S0G105M ...
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Capacitance Range Chart Capacitance Range Chart Temperature Characteristics: X7R, (± 15%), X5R (± 15%) Rated Voltage: 50V (1H), 25V (1E), 16V (1C), 10V (1A), 6.3V (0J) Capacitance Cap Tolerance (pF) Code 10,000 103 K: ± 10% 22,000 223 M: ± ...
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Capacitance Range Chart Capacitance Range Chart Temperature Characteristics: X7R, (± 15%), X7S (± 22%), X5R (± 15%) Rated Voltage: 50V (1H), 25V (1E), 16V (1C), 10V (1A), 6.3 (0J), 4V (0G) Capacitance Cap Tolerance (pF) Code 10,000 103 K: ± ...
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... Capacitance (Class 2) 7 Robustness of No sign of termination coming off, breakage of ceramic, or other abnormal Terminations signs. • All specifications are subject to change without notice. Please read the precautions before using the product. US Catalog // C Series — Flipped Type // Version A11 C Series — Low ESL Flipped Type Rated Voltage D ...
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... No mechanical damage. 9 Solderability New solder to cover over 75% of termination. 25% may have pinholes or rough spots but not concentrated in one spot. Ceramic surface of “A sections” shall not be exposed due to melting or shifting of termination material. 10 Resistance to solder heat External No cracks are allowed and terminations ...
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... Repeat this for 2h each in 3 perpendicular directions. X7R X7S ± 7.5 % X5R X6S Solder the capacitors on P.C. board (shown in Appendix 1) before testing. Expose the capacitor in the conditions step1 through 4 and repeat 5 times consecutively. Change from the Leave the capacitor in ambient conditions for 24 ± 2h value before test before measurement ...
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... DC, 10MΩ•μF min. *As for the initial measurement of capacitors on number 6, 10, 11, 12 and 13, leave capacitor at 150 -10, 0°C for 1h and measure the value after leaving capacitor for 24 ± ambient condition. • All specifications are subject to change without notice. Please read the precautions before using the product. ...
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General Specifications Appendix - 1 P.C. Board for reliability test 100 mm c Solder Resist Material : Glass Epoxy ( As per JIS C6484 GE4 ) P.C. Board thickness : Appendix 1,2 Copper ( thickness 0.035mm ) Solder resist • ...
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Soldering Information • Recommended Soldering Land Pattern Chip capacitor Solder land Reflow Soldering C0510 C0816 Type [CC0204] [CC0306] Symbol A 0.20 0.30 B 0.20 0.35 C 1.00 1.60 • Recommended Solder Amount Excessive solder Adequate solder Insufficient ...
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Packaging Information • Carrier Tape Configuration Bulk Chips 160mm min. Drawing direction • Peel Back Force (Top Tape) Top cover tape Carrier tape Bottom cover tape (Paper carrier tape of type 2) • Chip Quantity Per Reel and Structure of ...
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... Class 2 BaTiO 3 Nickel (Ni) Copper (Cu) Nickel (Ni) Tin (Sn) TDK Corporation established internal product environmental assurance standards that include the six hazardous substances banned by the EU RoHS Directive enforced on July 1, 2006 1 along with additional substances independently banned by TDK and has successfully completed making general purpose electronic components conform to the RoHS Directive 1 ...