C3225X7R1E106M TDK Corporation, C3225X7R1E106M Datasheet - Page 60

CAP CER 10UF 25V X7R 20% 1210

C3225X7R1E106M

Manufacturer Part Number
C3225X7R1E106M
Description
CAP CER 10UF 25V X7R 20% 1210
Manufacturer
TDK Corporation
Series
Cr

Specifications of C3225X7R1E106M

Capacitance
10µF
Package / Case
1210 (3225 Metric)
Voltage - Rated
25V
Tolerance
±20%
Temperature Coefficient
X7R
Mounting Type
Surface Mount, MLCC
Operating Temperature
-55°C ~ 125°C
Features
Low ESR
Applications
General Purpose
Size / Dimension
0.126" L x 0.098" W (3.20mm x 2.50mm)
Thickness
2.50mm
Tolerance (+ Or -)
20%
Voltage
25VDC
Temp Coeff (dielectric)
X7R
Operating Temp Range
-55C to 125C
Mounting Style
Surface Mount
Construction
SMT Chip
Case Style
Ceramic Chip
Failure Rate
Not Required
Wire Form
Not Required
Product Length (mm)
3.2mm
Product Depth (mm)
2.5mm
Product Height (mm)
2.5mm
Product Diameter (mm)
Not Requiredmm
Dielectric Characteristic
X7R
Capacitance Tolerance
± 20%
Voltage Rating
25VDC
Capacitor Case Style
1210
No. Of Pins
2
Capacitor Mounting
SMD
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Ratings
-
Lead Spacing
-
Lead Free Status / RoHS Status
Compliant, Lead free / RoHS Compliant
Other names
445-1434-2
C3225X7R1E106MT

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
C3225X7R1E106MT
Manufacturer:
TDK
Quantity:
7 614
Part Number:
C3225X7R1E106MTJ00N
Manufacturer:
TDK
Quantity:
3 000
Wave Soldering
Symbol
Reflow Soldering
Symbol
Reflow Soldering
Symbol
Excessive
solder
Adequate
solder
Insufficient
solder
• Recommended Soldering Land Pattern
• Recommended Solder Amount
• All specifications are subject to change without notice. Please read the precautions before using the product.
US Catalog // C Series — General Application // Version A11
A
B
C
A
B
C
A
B
C
Type
Type
Type
Soldering
Information
C
B
0.25 - 0.35
0.25 - 0.35
[CC0603]
[CC0201]
[CC1206]
0.7 - 1.0
0.8 - 1.0
0.6 - 0.8
0.2 - 0.3
2.0 - 2.4
1.0 - 1.2
1.1 - 1.6
C1608
C0603
C3216
Chip capacitor
A
0.35 - 0.45
[CC0805]
[CC0402]
[CC1210]
1.0 - 1.3
1.0 - 1.2
0.8 - 1.1
0.3 - 0.5
0.4 - 0.6
2.0 - 2.4
1.0 - 1.2
1.9 - 2.5
C2012
C1005
C3225
Solder land
[CC1206]
[CC0603]
[CC1812]
2.1 - 2.5
1.1 - 1.3
1.0 - 1.3
0.6 - 0.8
0.6 - 0.8
0.6 - 0.8
3.1 - 3.7
1.2 - 1.4
2.4 - 3.2
Unit: mm
C3216
C1608
C4532
Maximum amount
Minimum amount
Solder resist
Higher tensile
force on the chip
capacitor may
cause cracking.
Small solder fillet
may cause
contact failure or
failure to hold the
chip capacitor to
the P.C. board.
[CC0805]
[CC2220]
0.9 - 1.2
0.7 - 0.9
0.9 - 1.2
4.1 - 4.8
1.2 - 1.4
4.0 - 5.0
Unit: mm
C2012
Unit: mm
C5750
C Series — General Application
Peak
Temp
• Recommended Soldering Profile
Solder
0
Recommended soldering duration
Recommended solder compositions
Preheating Condition
Lead-Free
Soldering
soldering
soldering
soldering
Manual
Sn-37Pb (Sn-Pb solder)
Sn-3.0Ag-0.5Cu (Lead Free Solder)
Over 60 sec.
Reflow
Solder
Solder
Sn-Pb
Preheating
Wave
△T
Wave Soldering
Temp./
Dura.
Peak Temp time
Soldering
C1608(CC0603), C2012(CC0805),
C3216(CC1206)
C0603(CC0201), C1005(CC0402),
C1608(CC0603), C2012(CC0805),
C3216(CC1206)
C3225(CC1210), C4532(CC1812),
C5750(CC2220)
C0603(CC0201), C1005(CC0402),
C1608(CC0603), C2012(CC0805),
C3216(CC1206)
C3225(CC1210), C4532(CC1812),
C5750(CC2220)
Peak temp
250 max.
260 max.
300
0
(°C)
Wave Soldering
Over 60 sec.
Natural
cooling
Case Size - JIS (EIA)
∆T
Manual soldering
Preheating
(Solder iron)
Duration
3 max.
5 max.
(sec.)
3sec. (As short as possible)
Peak
Temp
0
Over 60 sec.
∆T
Peak temp
230 max.
260 max.
Preheating
Reflow Soldering
(°C)
Reflow Soldering
Peak Temp time
Soldering Natural
Temp. (ºC)
∆T ≤ 150
∆T ≤ 150
∆T ≤ 130
∆T ≤ 150
∆T ≤ 130
Duration
20 max.
10 max.
(sec.)
cooling

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