C4520C0G3F820K TDK Corporation, C4520C0G3F820K Datasheet - Page 10

• Manufacturer Part Number: C4520C0G3F820K
• Description: CAP CER 82PF 3000V C0G 10% 1808
• Manufacturer: TDK Corporation
• Series: Cr

Specifications of C4520C0G3F820K

• Capacitance: 82pF
• Tolerance: ±10%
• Package / Case: 1808 (4520 Metric)
• Voltage - Rated: 3000V (3kV)
• Temperature Coefficient: C0G, NP0
• Mounting Type: Surface Mount, MLCC
• Operating Temperature: -55°C ~ 125°C
• Features: High Voltage
• Applications: General Purpose
• Size / Dimension: 0.177" L x 0.079" W (4.50mm x 2.00mm)
• Thickness: 2.00mm
• Voltage Rating: 3 KVolts
• Operating Temperature Range: - 55 C to + 125 C
• Temperature Coefficient / Code: C0G (NP0)
• Product: High Voltage MLCCs
• Dimensions: 2 mm W x 4.5 mm L
• Termination Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Ratings: -
• Lead Spacing: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 445-2374-2; C4520C0G3F820KT; C4520COG3F820K

Excessive
solder
Adequate
solder
Insufficient
solder
• Recommended Soldering Land Pattern
• This product intended solely for reflow soldering.
• A slit of about 1mm on the circuit board is
recommended to improve removal of the flux after
soldering.
• Ensure that this product is completely dried following
washing.
• Because this product will be subjected to high
voltages, use only low-activity rosin flux (with 0.2% max.
of chlorine).
• Using this product with aluminum circuit boards must
be considered a special implementation because the
high heat stress levels are involved. In case of using
aluminum circuit boards, please contact TDK.
• Recommended Solder Amount
• All specifications are subject to change without notice. Please read the precautions before using the product.
US Catalog // C Series — High Voltage Application // Version A11
Chip capacitor
Reflow Soldering
Symbol
Soldering
Information
C
C
D
A
B
B
Type
[CC1808]
3.1 — 3.7
1.2 — 1.4
1.5 — 2.0
1.0 — 1.3
C4520
A
D
Slit
[CC1812]
3.1 — 3.7
1.2 — 1.4
2.4 — 3.2
1.0 — 1.3
C4532
Unit: mm
Solder land
Solder resist
Maximum amount
Minimum amount
Higher tensile
force on the chip
capacitor may
cause cracking.
Small solder fillet
may cause
contact failure or
failure to hold the
chip capacitor to
the P.C. board.
C Series — High Voltage Application
Peak
Temp
• Recommended Soldering Profile
0
Solder
Recommended soldering duration
Recommended solder compositions
Preheating Condition
Over 60 sec.
Lead-Free Solder
Manual soldering
Reflow soldering
∆T
Sn-37Pb (Sn-Pb solder)
Sn-3.0Ag-0.5Cu (Lead Free Solder)
Sn-Pb Solder
Preheating
Soldering
Reflow Soldering
Peak Temp time
Temp./
Soldering Natural
Dura.
cooling
Peak temp
230 max.
260 max.
(°C)
Reflow Soldering
300
Temp. (ºC)
∆T ≤ 130
∆T ≤ 130
0
Duration
∆T
20 max.
10 max.
Manual soldering
(sec.)
Preheating
(Solder iron)
3sec. (As short as possible)