JMK325BJ226MM-T Taiyo Yuden, JMK325BJ226MM-T Datasheet - Page 50

• Manufacturer Part Number: JMK325BJ226MM-T
• Description: CAP CER 22UF 6.3V X5R 1210
• Manufacturer: Taiyo Yuden
• Series: JMKr

Specifications of JMK325BJ226MM-T

• Capacitance: 22µF
• Voltage - Rated: 6.3V
• Tolerance: ±20%
• Temperature Coefficient: X5R
• Mounting Type: Surface Mount, MLCC
• Operating Temperature: -55°C ~ 85°C
• Applications: General Purpose
• Package / Case: 1210 (3225 Metric)
• Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
• Thickness: 2.50mm
• Dielectric Characteristic: X5R
• Capacitance Tolerance: ± 20%
• Voltage Rating: 6.3VDC
• Capacitor Case Style: 1210
• No. Of Pins: 2
• Capacitor Mounting: SMD
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -
• Ratings: -
• Lead Spacing: -
• Other names: 587-1384-2; CE JMK325 BJ226MM-T; JMK325BJ226MM-T

mlcc_prec-P3
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Precautions on the use of Multilayer Ceramic Capacitors
＊ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
4. Soldering
Precautions
Technical
consider-
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
PRECAUTIONS
ations
◆Selection of Flux
◆Soldering
◆Selection of Flux
1-1. When too much halogenated substance （Chlorine, etc.） content is used to activate fl ux, or highly acidic fl ux is used, it may lead to corrosion of terminal elec-
1-2. Flux is used to increase solderability in wave soldering. However if too much flux is applied, a large amount of flux gas may be emitted and may adversely affect
1-3. Since the residue of water-soluble flux is easily dissolved in moisture in the air, the residues on the surfaces of capacitors in high humidity conditions may cause
◆Soldering
Since flux may have a significant effect on the performance of capacitors, it is necessary to verify the following conditions prior to use;
Temperature, time, amount of solder, etc. shall be set in accordance with their recommended conditions.
Sn-Zn solder paste can adversely affect MLCC reliability.
Please contact us prior to usage of Sn-Zn solder.
• Ceramic chip capacitors are susceptible to thermal shock when exposed to rapid or concentrated heating or rapid cooling.
• Therefore, the soldering must be conducted with great care so as to prevent malfunction of the components due to excessive thermal shock.
• Preheating : Capacitors shall be preheated sufficiently, and the temperature difference between the capacitors and solder shall be within 100 to 130℃.
• Cooling : The temperature difference between the capacitors and cleaning process shall not be greater than 100℃.
（1） Flux used shall be less than or equal to 0.1 wt% （in CI equivalent） of halogenated content. Flux having a strong acidity content shall not be applied.
（2） When shall capacitors are soldered on boards, the amount of flux applied shall be controlled at the optimum level.
（3） When water-soluble flux is used, special care shall be taken to properly clean the boards.
［Wave soldering］
【Recommended conditions for eutectic soldering】
［Hand soldering］
【Recommended conditions for eutectic soldering】
［Reflow soldering］
【Recommended conditions for eutectic soldering】
trodes or degradation of insulation resistance on the surfaces of the capacitors.
the solderability. To minimize the amount of flux applied, it is recommended to use a flux-bubbling system.
a degradation of insulation resistance and reliability of the capacitors. Therefore, the cleaning methods and the capability of the machines used shall also be
considered carefully when water-soluble flux is used.
Caution
①Wave soldering must not be applied to capacitors designated as for reflow soldering only.
Caution
①Use a 50W soldering iron with a maximum tip diameter of 1.0 mm.
②The soldering iron shall not directly touch capacitors.
Caution
①The ideal condition is to have solder mass （fillet） controlled to 1/2 to 1/3 of the thickness of a capacitor.
②Because excessive dwell times can adversely affect solderability, soldering duration shall be kept as
close to recommended times as possible.
300
300
200
200
300
100
100
200
300
300
100
200
200
300
100
100
200
400
400
100
300
300
200
200
400
100
100
300
200
100
300
300
200
200
300
100
100
200
300
100
200
100
300
200
100
400
300
200
100
300
200
100
300
200
100
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Preheating
Preheating
60sec. Min.
60sec. Min.
Preheating
60sec. Min.
Preheating
60sec. Min.
Preheating
Preheating
120sec. Min.
120sec. Min.
Preheating
120sec. Min.
120sec. Min.
120sec. Min.
120sec. Min.
60sec.
Min.
Preheating
120sec. Min.
120sec. Min.
Preheating 150℃
Preheating 150℃
60sec. Min.
60sec. Min.
Preheating 150℃
60sec. Min.
Preheating 150℃
60sec. Min.
Preheating
230∼280℃
230∼280℃
Within 3 sec.
Within 3 sec.
230∼280℃
Within 3 sec.
230∼280℃
Within 3 sec.
60sec.
Min.
Preheating
Preheating
150℃
150℃
Preheating
150℃
Preheating
150℃
230∼250℃
230∼250℃
Within 3sec.
Within 3sec.
230∼250℃
Within 3sec.
Slow cooling
Slow cooling
Slow cooling
Heating above
Heating above
230℃
230℃
40sec. Max.
40sec. Max.
230∼250℃
Within 3sec.
Heating above
230℃
40sec. Max.
Slow cooling
230℃
Within 10 sec.
Heating above
230℃
40sec. Max.
Peak 260℃ Max.
Peak 260℃ Max.
Within 10sec.
Within 10sec.
Peak 260℃ Max.
Within 10sec.
Peak 260℃ Max.
Within 10sec.
Peak 260℃ Max.
Peak 260℃ Max.
Within 10sec.
Within 10sec.
Peak 260℃ Max.
Within 10sec.
Peak 260℃ Max.
Within 10sec.
Slow cooling
Slow cooling
Slow cooling
Slow cooling
Slow cooling
Slow
Slow
cooling
cooling
Slow
cooling
Slow
cooling
（Chlorine, etc.） content is used to activate fl ux, or highly acidic fl ux is used, it may lead to corrosion of terminal elec-
Slow
Slow
cooling
cooling
Slow
cooling
Slow
cooling
Chlorine, etc.） content is used to activate fl ux, or highly acidic fl ux is used, it may lead to corrosion of terminal elec-
） content is used to activate fl ux, or highly acidic fl ux is used, it may lead to corrosion of terminal elec-
【Recommended condition for Pb-free soldering】
【Recommended condition for Pb-free soldering】
【Recommended condition for Pb-free soldering】
content is used to activate flux, or highly acidic flux is used, it may lead to corrosion of terminal elec-
400
400
300
300
200
200
400
100
100
300
200
100
300
200
100
300
200
100
400
300
200
400
100
300
200
100
300
200
100
300
200
100
300
200
100
400
300
200
100
0
0
0
300
200
100
0
0
0
0
0
0
0
0
0
316type or less
Preheating
60sec. Min.
Preheating
120sec. Min.
120sec. Min.
Preheating
60sec. Min.
Preheating 150℃
60sec. Min.
120sec. Min.
Preheating
120sec. Min.
Preheating 150℃
60sec. Min.
60sec. Min.
60sec. Min.
60sec. Min.
⊿T
⊿T
⊿T
60sec. Min.
230∼280℃
Within 3 sec.
⊿T
230∼280℃
Within 3 sec.
Preheating
Preheating
150℃ Min.
150℃ Min.
Preheating
150℃ Min.
Preheating
150℃ Min.
Preheating
150℃
Preheating
150℃
Peak 350℃ Max.
Peak 350℃ Max.
Within 3sec.
Within 3sec.
Peak 350℃ Max.
Within 3sec.
Peak 350℃ Max.
Within 3sec.
⊿T≦150℃
230∼250℃
Within 3sec.
Slow cooling
Heating above
230℃
40sec. Max.
Peak 260℃ Max.
Within 10sec.
230∼250℃
Within 3sec.
Slow cooling
Peak 260℃ Max.
Within 10sec.
Slow cooling
Slow cooling
Slow cooling
Heating above
230℃
40sec. Max.
Slow cooling
Peak 260℃ Max.
Within 10sec.
1 1
Peak 260℃ Max.
Within 10sec.
⊿T
Slow cooling
Slow cooling
Slow
cooling
Slow
cooling
Slow
cooling
Slow
cooling
400
400
300
300
200
200
400
100
100
300
200
100
400
300
200
400
100
300
200
100
400
300
200
100
0
0
0
0
0
0
Solder
325type or more
⊿T
⊿T
⊿T
⊿T
60sec. Min.
60sec. Min.
60sec. Min.
60sec. Min.
60sec. Min.
⊿T
60sec. Min.
⊿T
Capacitor
PC board
Preheating
150℃ Min.
Preheating
Preheating
150℃ Min.
150℃ Min.
Preheating
150℃ Min.
Preheating
150℃ Min.
Preheating
150℃ Min.
Peak 280℃ Max.
Peak 280℃ Max.
Within 3sec.
Within 3sec.
Peak 280℃ Max.
Within 3sec.
Peak 280℃ Max.
Within 3sec.
Peak 350℃ Max.
Within 3sec.
Peak 350℃ Max.
Within 3sec.
Slow cooling
Slow cooling
Slow cooling
⊿T≦130℃
Slow cooling
Slow cooling
Slow cooling
⊿T
mlcc_prec_e-01
T
400
300
200
100
400
300
200
100
0
0
⊿T
60sec. M
⊿T
60sec.