2225AC104KAT1A AVX Corporation, 2225AC104KAT1A Datasheet
2225AC104KAT1A
Manufacturer Part Number
2225AC104KAT1A
Description
CAP CER .10UF 1000V X7R 10% 2225
Manufacturer
AVX Corporation
Series
2225r
Datasheet
1.1206GC102KAT1A.pdf
(2 pages)
Specifications of 2225AC104KAT1A
Capacitance
0.1µF
Package / Case
2522 (6456 Metric) Wide, 2225 (5664 Metric)
Voltage - Rated
1000V (1kV)
Tolerance
±10%
Temperature Coefficient
X7R
Mounting Type
Surface Mount, MLCC
Operating Temperature
-55°C ~ 125°C
Features
High Voltage
Applications
General Purpose
Size / Dimension
0.225" L x 0.250" W (5.72mm x 6.35mm)
Thickness
2.54mm Max
Tolerance (+ Or -)
10%
Voltage
1000VDC
Temp Coeff (dielectric)
X7R
Operating Temp Range
-55C to 125C
Mounting Style
Surface Mount
Construction
SMT Chip
Case Style
Ceramic Chip
Failure Rate
Not Required
Wire Form
Not Required
Product Length (mm)
5.72mm
Product Depth (mm)
6.35mm
Product Height (mm)
2.54mm
Product Diameter (mm)
Not Requiredmm
Capacitor Application
High Voltage
Dielectric Characteristic
X7R
Capacitance Tolerance
± 10%
Voltage Rating
1000VDC
Capacitor Case Style
2225
No. Of Pins
2
Rohs Compliant
Yes
Operating Temperature Range
- 55 C to + 125 C
Temperature Coefficient / Code
X7R
Product
High Voltage MLCCs
Dimensions
0.250 in W x 0.225 in L x 0.100 in H
Termination Style
SMD/SMT
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Ratings
-
Lead Spacing
-
Lead Free Status / Rohs Status
Details
Other names
2225AC104KAT1A
478-4741-2
478-4741-2
High Voltage MLC Chips
For 600V to 5000V Applications
HOW TO ORDER
Notes: Capacitors with X7R dielectrics are not intended for applications across AC supply mains or AC line filtering with polarity reversal. Contact plant for recommendations.
** The 3640 Style is not available on 7" Reels.
*** AVX offers nonstandard chip sizes. Contact factory for details.
DIMENSIONS
*Reflow Soldering Only
SIZE
(L) Length
(W) Width
(T) Thickness
(t) terminal min.
1808
Style
0805
1206
1210
1808
1812
1825
2220
2225
3640
AVX
Max.
***
Contact factory for availability of Termination and Tolerance options for Specific Part Numbers.
600V/630V = C
max. (0.020 ± 0.010)
Voltage
NEW 630V RANGE
1000V = A
1500V = S
2000V = G
2500V = W
3000V = H
4000V = J
5000V = K
(0.079 ± 0.008) (0.126 ± 0.008) (0.126 ± 0.008) (0.180 ± 0.010) (0.177 ± 0.012) (0.177 ± 0.012) (0.224 ± 0.016) (0.225 ± 0.010) (0.360 ± 0.010)
(0.049 ±0.008) (0.063 ± 0.008) (0.098 ± 0.008) (0.080 ± 0.010) (0.126 ± 0.008) (0.252 ± 0.012) (0.197 ± 0.016) (0.250 ± 0.010) (0.400 ± 0.010)
A
2.01 ± 0.20
1.25 ± 0.20
0.50 ± 0.25
(0.051)
0805
1.30
Temperature
Coefficient
C0G = A
X7R = C
0.25 (0.010)
0.75 (0.030)
3.20 ± 0.20
1.60 ± 0.20
A
(0.060)
1206
1.52
Examples:
Capacitance Code
220,000 pF = 224
(2 significant digits
22,000 pF = 223
+ no. of zeros)
1,000 pF = 102
0.25 (0.010)
0.75 (0.030)
3.20 ± 0.20
2.50 ± 0.20
100 pF = 101
(0.067)
1210*
10 pF = 100
1.70
271
1 μF = 105
T
L
0.25 (0.010)
1.02 (0.040)
4.57 ± 0.25
2.03 ± 0.25
*Note: Terminations with 5% minimum lead (Pb) is available, see pages 89 and 90 for LD style.
High value, low leakage and small size are difficult parameters to obtain
in capacitors for high voltage systems. AVX special high voltage MLC
chip capacitors meet these performance characteristics and are
designed for applications such as snubbers in high frequency power
converters, resonators in SMPS, and high voltage coupling/dc blocking.
These high voltage chip designs exhibit low ESRs at high frequencies.
Larger physical sizes than normally encountered chips are used to make
high voltage MLC chip products. Special precautions must be taken in
applying these chips in surface mount assemblies. The temperature
gradient during heating or cooling cycles should not exceed 4ºC per
second. The preheat temperature must be within 50ºC of the peak tem-
perature reached by the ceramic bodies through the soldering process.
Chip sizes 1210 and larger should be reflow soldered only. Capacitors
may require protective surface coating to prevent external arcing.
For 1825, 2225 and 3640 sizes, AVX offers leaded version in either
thru-hole or SMT configurations (for details see section on high voltage
leaded MLC chips).
(0.080)
1808*
2.03
C0G:J = ±5%
X7R:K = ±10%
Capacitance
Tolerance
t
M = ±20%
M = ±20%
Leaded terminations are available, see pages 93 and 94.
K = ±10%
Z = +80%,
K
-20%
0.25 (0.010)
1.02 (0.040)
4.50 ± 0.30
3.20 ± 0.20
W
(0.100)
1812*
2.54
A = Standard
Test Level
A
0.25 (0.010)
1.02 (0.040)
4.50 ± 0.30
6.40 ± 0.30
(0.100)
1825*
2.54
1 = Pd/Ag
T = Plated
Termination*
Ni and Sn
(RoHS Compliant)
0.25 (0.010)
1.02 (0.040)
5.70 ± 0.40
5.00 ± 0.40
1
(0.130)
2220*
3.30
1 = 7"
3 = 13" Reel
9 = Bulk
Packaging
0.25 (0.010)
1.02 (0.040)
5.72 ± 0.25
6.35 ± 0.25
(0.100)
2225*
millimeters (inches)
1
2.54
Reel**
A = Standard
0.76 (0.030)
1.52 (0.060)
Special
9.14 ± 0.25
10.2 ± 0.25
Code
(0.100)
3640*
A
2.54
87
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2225AC104KAT1A Summary of contents
Page 1
... The preheat temperature must be within 50ºC of the peak tem- perature reached by the ceramic bodies through the soldering process. Chip sizes 1210 and larger should be reflow soldered only. Capacitors may require protective surface coating to prevent external arcing. ...
Page 2
High Voltage MLC Chips For 600V to 5000V Applications C0G Dielectric Performance Characteristics Capacitance Range Capacitance Tolerances Dissipation Factor Operating Temperature Range Temperature Characteristic Voltage Ratings Insulation Resistance (+25°C, at 500 VDC) Insulation Resistance (+125°C, at 500 VDC) Dielectric Strength ...