CAP CER 56PF 10% 1500V C0G 1808

1808SA560KAT1A

Manufacturer Part Number1808SA560KAT1A
DescriptionCAP CER 56PF 10% 1500V C0G 1808
ManufacturerAVX Corporation
1808SA560KAT1A datasheet
 


Specifications of 1808SA560KAT1A

Capacitance56pFVoltage - Rated1500V (1.5kV)
Tolerance±10%Temperature CoefficientC0G, NP0
Mounting TypeSurface Mount, MLCCOperating Temperature-55°C ~ 125°C
FeaturesHigh VoltageApplicationsGeneral Purpose
Package / Case1808 (4520 Metric)Size / Dimension0.180" L x 0.080" W (4.57mm x 2.03mm)
Thickness2.03mm MaxLead Free Status / RoHS StatusLead free / RoHS Compliant
Ratings-Lead Spacing-
1
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2
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High Voltage MLC Chips
For 600V to 5000V Applications
NEW 630V RANGE
HOW TO ORDER
1808
A
A
AVX
Voltage
Temperature
Capacitance Code
Style
600V/630V = C
Coefficient
(2 significant digits
0805
1000V = A
C0G = A
1206
1500V = S
X7R = C
Examples:
1210
2000V = G
1808
2500V = W
1812
3000V = H
1825
4000V = J
2220
5000V = K
220,000 pF = 224
2225
3640
***
Notes: Capacitors with X7R dielectrics are not intended for applications across AC supply mains or AC line filtering with polarity reversal. Contact plant for recommendations.
Contact factory for availability of Termination and Tolerance options for Specific Part Numbers.
** The 3640 Style is not available on 7" Reels.
*** AVX offers nonstandard chip sizes. Contact factory for details.
DIMENSIONS
SIZE
0805
1206
(L) Length
2.01 ± 0.20
3.20 ± 0.20
(0.079 ± 0.008) (0.126 ± 0.008) (0.126 ± 0.008) (0.180 ± 0.010) (0.177 ± 0.012) (0.177 ± 0.012) (0.224 ± 0.016) (0.225 ± 0.010) (0.360 ± 0.010)
(W) Width
1.25 ± 0.20
1.60 ± 0.20
(0.049 ±0.008) (0.063 ± 0.008) (0.098 ± 0.008) (0.080 ± 0.010) (0.126 ± 0.008) (0.252 ± 0.012) (0.197 ± 0.016) (0.250 ± 0.010) (0.400 ± 0.010)
(T) Thickness
1.30
1.52
Max.
(0.051)
(0.060)
(t) terminal min.
0.50 ± 0.25
0.25 (0.010)
max. (0.020 ± 0.010)
0.75 (0.030)
*Reflow Soldering Only
High value, low leakage and small size are difficult parameters to obtain
in capacitors for high voltage systems. AVX special high voltage MLC
chip capacitors meet these performance characteristics and are
designed for applications such as snubbers in high frequency power
converters, resonators in SMPS, and high voltage coupling/dc blocking.
These high voltage chip designs exhibit low ESRs at high frequencies.
Larger physical sizes than normally encountered chips are used to make
high voltage MLC chip products. Special precautions must be taken in
applying these chips in surface mount assemblies. The temperature
gradient during heating or cooling cycles should not exceed 4ºC per
second. The preheat temperature must be within 50ºC of the peak tem-
perature reached by the ceramic bodies through the soldering process.
Chip sizes 1210 and larger should be reflow soldered only. Capacitors
may require protective surface coating to prevent external arcing.
For 1825, 2225 and 3640 sizes, AVX offers leaded version in either
thru-hole or SMT configurations (for details see section on high voltage
leaded MLC chips).
271
K
A
Capacitance
Test Level
Tolerance
A = Standard
+ no. of zeros)
C0G:J = ±5%
K = ±10%
10 pF = 100
M = ±20%
100 pF = 101
X7R:K = ±10%
1,000 pF = 102
M = ±20%
22,000 pF = 223
Z = +80%,
-20%
1 μF = 105
*Note: Terminations with 5% minimum lead (Pb) is available, see pages 89 and 90 for LD style.
Leaded terminations are available, see pages 93 and 94.
W
L
T
t
1210*
1808*
1812*
3.20 ± 0.20
4.57 ± 0.25
4.50 ± 0.30
4.50 ± 0.30
2.50 ± 0.20
2.03 ± 0.25
3.20 ± 0.20
6.40 ± 0.30
1.70
2.03
2.54
(0.067)
(0.080)
(0.100)
0.25 (0.010)
0.25 (0.010)
0.25 (0.010)
0.25 (0.010)
0.75 (0.030)
1.02 (0.040)
1.02 (0.040)
1.02 (0.040)
1
1
A
Termination*
Packaging
Special
1 = Pd/Ag
1 = 7"
Reel**
Code
T = Plated
3 = 13" Reel
A = Standard
Ni and Sn
9 = Bulk
(RoHS Compliant)
millimeters (inches)
1825*
2220*
2225*
3640*
5.70 ± 0.40
5.72 ± 0.25
9.14 ± 0.25
5.00 ± 0.40
6.35 ± 0.25
10.2 ± 0.25
2.54
3.30
2.54
2.54
(0.100)
(0.130)
(0.100)
(0.100)
0.25 (0.010)
0.25 (0.010)
0.76 (0.030)
1.02 (0.040)
1.02 (0.040)
1.52 (0.060)
87

1808SA560KAT1A Summary of contents

  • Page 1

    ... The preheat temperature must be within 50ºC of the peak tem- perature reached by the ceramic bodies through the soldering process. Chip sizes 1210 and larger should be reflow soldered only. Capacitors may require protective surface coating to prevent external arcing. ...

  • Page 2

    High Voltage MLC Chips For 600V to 5000V Applications C0G Dielectric Performance Characteristics Capacitance Range Capacitance Tolerances Dissipation Factor Operating Temperature Range Temperature Characteristic Voltage Ratings Insulation Resistance (+25°C, at 500 VDC) Insulation Resistance (+125°C, at 500 VDC) Dielectric Strength ...