CC0805JRNP09BN331 Yageo, CC0805JRNP09BN331 Datasheet - Page 13

CAP CERAMIC 330PF 50V NP0 0805

CC0805JRNP09BN331

Manufacturer Part Number
CC0805JRNP09BN331
Description
CAP CERAMIC 330PF 50V NP0 0805
Manufacturer
Yageo
Series
CCr
Datasheet

Specifications of CC0805JRNP09BN331

Capacitance
330pF
Voltage - Rated
50V
Tolerance
±5%
Temperature Coefficient
C0G, NP0
Mounting Type
Surface Mount, MLCC
Operating Temperature
-55°C ~ 125°C
Applications
General Purpose
Package / Case
0805 (2012 Metric)
Size / Dimension
0.079" L x 0.049" W (2.00mm x 1.25mm)
Thickness
0.60mm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-
Ratings
-
Lead Spacing
-
Other names
0805CG331J9B200
223886115331
311-1117-2
311-1313-2
311-1313-2
CC0805JRNP09BN331B
CC0805JRNPO9BN331
CC0805JRNPO9BN331B
Jan 06, 2011 V6
TEST
Resistance to
soldering heat
Solderability
Rapid change
of
temperature
Surface-Mount Ceramic Multilayer Capacitors
TEST METHOD
IEC 60384-
21/22
4.9
4.10
4.11
PROCEDURE
Precondition: 150 +0/–10 °C for 1 hour, then keep for 24
±1 hours at room temperature
Preheating: for size ≤ 1206: 120 °C to 150 °C for 1 minute
Preheating: for size >1206: 100 °C to 120 °C for 1 minute
and 170 °C to 200 °C for 1 minute
Solder bath temperature: 260 ±5 °C
Dipping time: 10 ±0.5 seconds
Recovery time: 24 ±2 hours
Preheated the temperature of 80 °C to 140 °C and
maintained for 30 seconds to 60 seconds.
Test conditions for lead containing solder alloy
Temperature: 235 ±5 °C
Dipping time: 2 ±0.2 seconds
Depth of immersion: 10 mm
Alloy Composition: 60/40 Sn/Pb
Number of immersions: 1
Test conditions for lead-free containing solder alloy
Temperature: 245 ±5 °C
Dipping time: 3 ±0.3 seconds
Depth of immersion: 10 mm
Alloy Composition: SAC305
Number of immersions: 1
Preconditioning;
150 +0/–10 °C for 1 hour, then keep for
24 ±1 hours at room temperature
5 cycles with following detail:
30 minutes at lower category temperature
30 minutes at upper category temperature
Recovery time 24 ±2 hours
General Purpose
REQUIREMENTS
Dissolution of the end face plating shall
not exceed 25% of the length of the
edge concerned
<General purpose series>
∆C/C
Class 1:
NP0: within ±0.5% or 0.5 pF
whichever is greater
D.F. within initial specified value
R
The solder should cover over 95% of
the critical area of each termination
No visual damage
<General purpose series>
∆C/C
Class 1:
NP0: within ±1% or 1 pF
whichever is greater
D.F. meet initial specified value
R
ins
ins
within initial specified value
meet initial specified value
NP0
16 V to 50 V
Product specification
www.yageo.com
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