QMK316B7473ML-T Taiyo Yuden, QMK316B7473ML-T Datasheet - Page 18

CAP CERM 47000PF 250V X7R 1206

QMK316B7473ML-T

Manufacturer Part Number
QMK316B7473ML-T
Description
CAP CERM 47000PF 250V X7R 1206
Manufacturer
Taiyo Yuden
Series
QMKr
Datasheet

Specifications of QMK316B7473ML-T

Capacitance
0.047µF
Voltage - Rated
250V
Tolerance
±20%
Temperature Coefficient
X7R
Mounting Type
Surface Mount, MLCC
Operating Temperature
-55°C ~ 125°C
Applications
General Purpose
Package / Case
1206 (3216 Metric)
Size / Dimension
0.126" L x 0.063" W (3.20mm x 1.60mm)
Thickness
1.60mm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-
Ratings
-
Lead Spacing
-
Other names
CG QMK316 B7473ML-T
QMK316BJ473ML-T
QMK316BJ473ML-T
Precautions on the use of Multilayer Ceramic Capacitors
4. Soldering
PRECAUTIONS
当社カタログをご使用の際には 「当社製品に関するお断り」 を必ずお読みください。
Stages
1. Since flux may have a significant effect on the performance
Soldering
Temperature, time, amount of solder, etc. are specified in ac-
cordance with the following recommended conditions.
Sn-Zn solder paste can affect MLCC reliability performance.
Please contact us prior to usage.
Selection of Flux
(1) Flux used should be with less than or equal to 0.1 wt%
(2) When soldering capacitors on the board, the amount of
(3) When using water-soluble flux, special care should be
of capacitors, it is necessary to verify the following condi-
tions prior to use;
(equivelent to chroline) of halogenated content. Flux
having a strong acidity content should not be applied.
flux applied should be controlled at the optimum level.
taken to properly clean the boards.
Precautions
温度 (℃)
温度 (℃)
温度 (℃)
温度 (℃)
温度 (℃)
温度 (℃)
300
200
300
200
300
200
400
300
200
300
200
400
300
200
100
100
100
100
100
100
0
0
0
0
0
0
(※⊿ T ≦190℃ (3216タ イ プ以下) 、 ⊿ T ≦130℃ (3225以上) 。 )
(※⊿ T ≦190℃ (3216タ イ プ以下) 、 ⊿ T ≦130℃ (3225以上) 。 )
※チッ プと はんだ温度との差が100∼ 1 3 0℃以下になるよ
 う に十分予熱を行って く だ さ い。
※回数は 2回迄の保証と な り ます。
※チッ プと はんだ温度との差が1 0 0 ∼ 1 3 0℃以下になるよ
 う に十分予熱を行って く だ さ い。
※回数は 1回迄の保証と な り ます。
※リ フロー仕様アイ テムは除き ます。
※チッ プと はんだ温度との差が100∼ 1 3 0℃以下になるよ
 う に十分予熱を行って く だ さ い。
※回数は 2回迄の保証と な り ます。
※はんだコテは20Wで先端が1φ以下のものを推奨致 し ます。
※コテ先がチッ プに直接触れないよ う にご留意下さ い。
※回数は1回迄の保証と な り ます。
注 : 上記温度プロファ イルは最大許容条件であ り、
  常にこれを推奨する ものではご ざいません。
※チッ プと はんだ温度との差が1 0 0 ∼ 1 3 0℃以下になるよ
 う に十分予熱を行って く だ さ い。
※回数は 1回迄の保証と な り ます。
※リ フロー仕様アイ テムは除き ます。
※はんだコテは20Wで先端が1φ以下のものを推奨致 し ます。
※コテ先がチッ プに直接触れないよ う にご留意下さ い。
※回数は1回迄の保証と な り ます。
注 : 上記温度プロファ イルは最大許容条件であ り、
  常にこれを推奨する ものではご ざいません。
1-1. When too much halogenated substance (Chlorine, etc.) content is used to activate
1-2. Flux is used to increase solderability in flow soldering, but if too much is applied, a
1-3. Since the residue of water-soluble flux is easily dissolved by water content in the
1-1. Preheating when soldering
Heating: Ceramic chip components should be preheated to within 100 to 130℃ of the
Cooling: The temperature difference between the components and cleaning process
Ceramic chip capacitors are susceptible to thermal shock when exposed to rapid or concen-
trated heating or rapid cooling.
great care so as to prevent malfunction of the components due to excessive thermal shock.
Recommended conditions for soldering
Temperature profile
Caution
1. The ideal condition is to have solder mass (fillet) controlled to 1/2 to 1/3 of the
Caution
1. Make sure the capacitors are preheated sufficiently.
2. The temperature difference between the capacitor and melted solder should not be
3. Cooling after soldering should be as gradual as possible.
4. Wave soldering must not be applied to the capacitors designated as for reflow sol-
the flux, or highly acidic flux is used, an excessive amount of residue after soldering
may lead to corrosion of the terminal electrodes or degradation of insulation resis-
tance on the surface of the capacitors.
large amount of flux gas may be emitted and may detrimentally affect solderability. To
minimize the amount of flux applied, it is recommended to use a flux-bubbling system.
air, the residue on the surface of capacitors in high humidity conditions may cause a
degradation of insulation resistance and therefore affect the reliability of the compo-
nents. The cleaning methods and the capability of the machines used should also be
considered carefully when selecting water-soluble flux.
2. Because excessive dwell times can detrimentally affect solderability, soldering du-
Temperature profile
[Reflow soldering]
thickness of the capacitor, as shown below:
greater than 100 to 130℃
dering only.
ピーク260℃以下
ration should be kept as close to recommended times as possible.
ピーク260℃以下
[Wave soldering]
ピーク260℃以下
120秒以上
ピーク260℃以下
120秒以上
予熱150℃
予熱150℃
予熱150℃
予熱150℃
60秒以上
60秒以上
soldering.
should not be greater than 100℃.
10秒迄
10秒迄
10秒迄
10秒迄
⊿ T
⊿ T
60秒以上
60秒以上
本加熱230℃以上
本加熱230℃以上
40秒迄
徐冷
40秒迄
350℃以下
徐冷
350℃以下
徐冷
徐冷
徐冷
Please read the "Notice for TAIYO YUDEN products" before using this catalog.
徐冷
3秒迄
3秒迄
Solder
Therefore, the soldering process must be conducted with
Technical considerations
Capacitor
PC board
Temperature ( ℃)
Temperature ( ℃)
Temperature ( ℃)
Temperature ( ℃)
Temperature ( ℃)
Temperature ( ℃)
300
300
400
300
200
100
200
100
300
200
200
100
300
200
400
300
200
100
100
100
0
0
0
0
0
0
(※⊿ T ≦190℃ (3216Type max) , ⊿ T ≦130℃ (3225
(※⊿ T ≦190℃ (3216Type max) , ⊿ T ≦130℃ (3225
※Ceramic chip components should be preheated to
※Assured to be reflow soldering for 2 times.
※Ceramic chip components should be preheated to
※Assured to be wave soldering for 1 time.
※Except for reflow soldering type.
※Ceramic chip components should be preheated to
※Assured to be reflow soldering for 2 times.
※It is recommended to use 20W soldering iron and
※The soldering iron should not directly touch the
※Assured to be soldering iron for 1 time.
※Ceramic chip components should be preheated to
Note: The above profiles are the maximum allowable
※Assured to be wave soldering for 1 time.
※Except for reflow soldering type.
※It is recommended to use 20W soldering iron and
※The soldering iron should not directly touch the
※Assured to be soldering iron for 1 time.
Note: The above profiles are the maximum allowable
Type min) )
Type min) )
components.
components.
within 100 to 130℃ of the soldering.
within 100 to 130℃ of the soldering.
the tip is 1φ or less.
within 100 to 130℃ of the soldering.
within 100 to 130℃ of the soldering.
the tip is 1φ or less.
soldering condition, therefore these profiles are
not always recommended.
soldering condition, therefore these profiles are
not always recommended.
Preheating
Preheating
120 sec min
120 sec min
Peak 260℃ max
Peak 260℃ max
Peak 260℃ max
Peak 260℃ max
150℃
150℃
10 sec max
10 sec max
10 sec max
10 sec max
60 sec min
Preheating
Preheating
60 sec min
150℃
150℃
60 sec min
60 sec min
⊿ T
⊿ T
(Pb free soldering)
(Pb free soldering)
(Pb free soldering)
(Pb free soldering)
(Pb free soldering)
(Pb free soldering)
Heating above 230℃
Heating above 230℃
40 sec max
40 sec max
4/6
350℃ max
3 sec max
350℃ max
3 sec max
Gradually
Gradually
Gradually
Gradually
Gradually
Gradually
cooling
cooling
cooling
cooling
cooling
cooling
115
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