CAP CERM 47000PF 250V X7R 1206

QMK316B7473ML-T

Manufacturer Part NumberQMK316B7473ML-T
DescriptionCAP CERM 47000PF 250V X7R 1206
ManufacturerTaiyo Yuden
SeriesQMK
QMK316B7473ML-T datasheet
 

Specifications of QMK316B7473ML-T

Capacitance0.047µFVoltage - Rated250V
Tolerance±20%Temperature CoefficientX7R
Mounting TypeSurface Mount, MLCCOperating Temperature-55°C ~ 125°C
ApplicationsGeneral PurposePackage / Case1206 (3216 Metric)
Size / Dimension0.126" L x 0.063" W (3.20mm x 1.60mm)Thickness1.60mm
Lead Free Status / RoHS StatusLead free / RoHS CompliantFeatures-
Ratings-Lead Spacing-
Other namesCG QMK316 B7473ML-T
QMK316BJ473ML-T
QMK316BJ473ML-T
  
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PRECAUTIONS
Precautions on the use of Multilayer Ceramic Capacitors
Stages
Precautions
4. Soldering
Selection of Flux
1. Since flux may have a significant effect on the performance
of capacitors, it is necessary to verify the following condi-
tions prior to use;
(1) Flux used should be with less than or equal to 0.1 wt%
(equivelent to chroline) of halogenated content. Flux
having a strong acidity content should not be applied.
(2) When soldering capacitors on the board, the amount of
flux applied should be controlled at the optimum level.
(3) When using water-soluble flux, special care should be
taken to properly clean the boards.
Soldering
Temperature, time, amount of solder, etc. are specified in ac-
cordance with the following recommended conditions.
Sn-Zn solder paste can affect MLCC reliability performance.
Please contact us prior to usage.
当社カタログをご使用の際には 「当社製品に関するお断り」 を必ずお読みください。
Technical considerations
1-1. When too much halogenated substance (Chlorine, etc.) content is used to activate
the flux, or highly acidic flux is used, an excessive amount of residue after soldering
may lead to corrosion of the terminal electrodes or degradation of insulation resis-
tance on the surface of the capacitors.
1-2. Flux is used to increase solderability in flow soldering, but if too much is applied, a
large amount of flux gas may be emitted and may detrimentally affect solderability. To
minimize the amount of flux applied, it is recommended to use a flux-bubbling system.
1-3. Since the residue of water-soluble flux is easily dissolved by water content in the
air, the residue on the surface of capacitors in high humidity conditions may cause a
degradation of insulation resistance and therefore affect the reliability of the compo-
nents. The cleaning methods and the capability of the machines used should also be
considered carefully when selecting water-soluble flux.
1-1. Preheating when soldering
Heating: Ceramic chip components should be preheated to within 100 to 130℃ of the
soldering.
Cooling: The temperature difference between the components and cleaning process
should not be greater than 100℃.
Ceramic chip capacitors are susceptible to thermal shock when exposed to rapid or concen-
trated heating or rapid cooling.
Therefore, the soldering process must be conducted with
great care so as to prevent malfunction of the components due to excessive thermal shock.
Recommended conditions for soldering
[Reflow soldering]
Temperature profile
温度 (℃)
Temperature ( ℃)
300
300
ピーク260℃以下
10秒迄
200
200
徐冷
100
100
予熱150℃
本加熱230℃以上
60秒以上
40秒迄
0
※チッ プと はんだ温度との差が100∼ 1 3 0℃以下になるよ
 う に十分予熱を行って く だ さ い。
※回数は 2回迄の保証と な り ます。
Caution
温度 (℃)
Temperature ( ℃)
300
1. The ideal condition is to have solder mass (fillet) controlled to 1/2 to 1/3 of the
300
ピーク260℃以下
10秒迄
thickness of the capacitor, as shown below:
200
200
予熱150℃
徐冷
100
100
温度 (℃)
Temperature ( ℃)
300
300
Capacitor
120秒以上
ピーク260℃以下
0
10秒迄
Solder
※チッ プと はんだ温度との差が1 0 0 ∼ 1 3 0℃以下になるよ
200
200
 う に十分予熱を行って く だ さ い。
徐冷
※回数は 1回迄の保証と な り ます。
PC board
※リ フロー仕様アイ テムは除き ます。
100
100
2. Because excessive dwell times can detrimentally affect solderability, soldering du-
予熱150℃
本加熱230℃以上
温度 (℃)
Temperature ( ℃)
60秒以上
40秒迄
0
ration should be kept as close to recommended times as possible.
400
400
※チッ プと はんだ温度との差が100∼ 1 3 0℃以下になるよ
350℃以下
 う に十分予熱を行って く だ さ い。
[Wave soldering]
3秒迄
※回数は 2回迄の保証と な り ます。
300
300
Temperature profile
⊿ T
徐冷
200
200
温度 (℃)
Temperature ( ℃)
100
100
300
300
ピーク260℃以下
60秒以上
0
10秒迄
(※⊿ T ≦190℃ (3216タ イ プ以下) 、 ⊿ T ≦130℃ (3225以上) 。 )
200
200
※はんだコテは20Wで先端が1φ以下のものを推奨致 し ます。
予熱150℃
徐冷
※コテ先がチッ プに直接触れないよ う にご留意下さ い。
※回数は1回迄の保証と な り ます。
100
100
注 : 上記温度プロファ イルは最大許容条件であ り、
  常にこれを推奨する ものではご ざいません。
120秒以上
0
※チッ プと はんだ温度との差が1 0 0 ∼ 1 3 0℃以下になるよ
 う に十分予熱を行って く だ さ い。
※回数は 1回迄の保証と な り ます。
※リ フロー仕様アイ テムは除き ます。
Caution
温度 (℃)
Temperature ( ℃)
400
400
1. Make sure the capacitors are preheated sufficiently.
350℃以下
3秒迄
300
300
2. The temperature difference between the capacitor and melted solder should not be
⊿ T
徐冷
greater than 100 to 130℃
200
200
3. Cooling after soldering should be as gradual as possible.
100
100
4. Wave soldering must not be applied to the capacitors designated as for reflow sol-
60秒以上
0
(※⊿ T ≦190℃ (3216タ イ プ以下) 、 ⊿ T ≦130℃ (3225以上) 。 )
dering only.
※はんだコテは20Wで先端が1φ以下のものを推奨致 し ます。
※コテ先がチッ プに直接触れないよ う にご留意下さ い。
※回数は1回迄の保証と な り ます。
注 : 上記温度プロファ イルは最大許容条件であ り、
  常にこれを推奨する ものではご ざいません。
Please read the "Notice for TAIYO YUDEN products" before using this catalog.
4/6
4
(Pb free soldering)
Peak 260℃ max
10 sec max
Gradually
cooling
Preheating
150℃
Heating above 230℃
60 sec min
40 sec max
0
※Ceramic chip components should be preheated to
within 100 to 130℃ of the soldering.
※Assured to be reflow soldering for 2 times.
(Pb free soldering)
Peak 260℃ max
10 sec max
Gradually
Preheating
cooling
150℃
(Pb free soldering)
Peak 260℃ max
120 sec min
0
10 sec max
※Ceramic chip components should be preheated to
within 100 to 130℃ of the soldering.
Gradually
※Assured to be wave soldering for 1 time.
cooling
※Except for reflow soldering type.
Preheating
150℃
Heating above 230℃
(Pb free soldering)
60 sec min
40 sec max
0
※Ceramic chip components should be preheated to
350℃ max
within 100 to 130℃ of the soldering.
3 sec max
※Assured to be reflow soldering for 2 times.
Gradually
⊿ T
cooling
(Pb free soldering)
60 sec min
Peak 260℃ max
0
10 sec max
(※⊿ T ≦190℃ (3216Type max) , ⊿ T ≦130℃ (3225
Type min) )
Gradually
Preheating
※It is recommended to use 20W soldering iron and
cooling
150℃
the tip is 1φ or less.
※The soldering iron should not directly touch the
components.
120 sec min
※Assured to be soldering iron for 1 time.
0
※Ceramic chip components should be preheated to
Note: The above profiles are the maximum allowable
within 100 to 130℃ of the soldering.
soldering condition, therefore these profiles are
※Assured to be wave soldering for 1 time.
not always recommended.
※Except for reflow soldering type.
(Pb free soldering)
350℃ max
3 sec max
Gradually
⊿ T
cooling
60 sec min
0
(※⊿ T ≦190℃ (3216Type max) , ⊿ T ≦130℃ (3225
Type min) )
※It is recommended to use 20W soldering iron and
the tip is 1φ or less.
※The soldering iron should not directly touch the
components.
※Assured to be soldering iron for 1 time.
Note: The above profiles are the maximum allowable
soldering condition, therefore these profiles are
not always recommended.
115