BAT60 STMicroelectronics, BAT60 Datasheet
BAT60
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BAT60 Summary of contents
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... Rth THERMAL RESISTANCE Symbol R Junction to ambient (*) th (j-a) (*) Mounted on epoxy board with recommended pad layout. January 2003 - Ed: 6A SMALL SIGNAL SCHOTTKY DIODE Parameter = 0.11 tp=10ms Ta=25°C Parameter BAT60J SOD-323 Value Unit 310 +150 °C 150 °C ...
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... BAT60J STATIC ELECTRICAL CHARACTERISTICS Symbol Tests Conditions V * Forward voltage drop Reverse leakage current R Pulse test 380 s, < 5ms, < evaluate the conduction losses the following equation 0. 0.17 I F(AV) F (RMS) 2/5 Tests conditions Tj = 25° 100 25° ...
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... Fig. 3: Non repetitive surge peak forward current versus overload duration (maximum values). IM(A) 3.0 2.5 2.0 1.5 1 0.5 0.0 1E-3 100 125 150 Fig. 5: Reverse leackage current versus reverse voltage applied (typical values). IR(mA) 1E+1 1E+0 1E-1 1E-2 T 1E-3 tp =tp/T 1E-4 1E+0 1E+1 1E Tamb(° 100 Ta=25°C Ta=50°C t t(s) =0.5 1E-2 1E-1 Tj=150°C Tj=80°C Tj=25°C VR( BAT60J 125 150 Ta=75°C 1E 3/5 ...
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... BAT60J Fig. 6: Reverse leackage current versus junction temperature (typical values). IR[Tj] / IR[Tj=25°C] 1E+5 VR=8V 1E+4 1E+3 1E+2 1E+1 1E+0 Tj(°C) 1E Fig. 8-1: Forward voltage drop versus forward cur- rent (High level). IFM(A) 1E+1 Tj=150°C (Typical values) Tj=25°C 1E+0 (Maximum values) Tj=80°C (Typical values) VFM(V) 1E-1 0.0 0.2 0.4 0.6 0.8 1.0 Fig. 9: Thermal resistance junction to ambient ver- sus copper surface (epoxy printed circuit board FR4, copper thickness ...
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... Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Singapore Spain - Sweden - Switzerland - United Kingdom - United States. REF Package Weight SOD-323 0.005 g. STMicroelectronics GROUP OF COMPANIES http://www.st.com BAT60J DIMENSIONS Millimeters Inches Min. Max. Min. 1.17 0.046 0 0.1 0 0.004 0.25 0.44 0.01 0.017 0.1 0.25 0.004 1 ...