bub323 ON Semiconductor, bub323 Datasheet
bub323
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bub323 Summary of contents
Page 1
... High Voltage Autoprotected 2 D PAK for Surface Mount The BUB323Z is a planar, monolithic, high–voltage power Darlington with a built–in active zener clamping circuit. This device is specifically designed for unclamped, inductive applications such as Electronic Ignition, Switching Regulators and Motor Control, and exhibit the following main features: Integrated High– ...
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... Cross–over Time Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î 1. Pulse Test: Pulse Width 300 s, Duty Cycle = 2.0%. BUB323Z (T = 25_C unless otherwise noted) C Î Î Î Î Î Î Î Î Î Î ...
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... unfamiliar shape compared to standard products as shown in Figure 1. . BUB323Z Figure 2. Basic Energy Test Circuit The bias parameters, V the inductance, are applied according to the Device Under Test (DUT) specifications. V test system while making sure the load line remains within the limits as described in Figure 4 ...
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... BUB323Z The shaded area represents the amount of energy the de- vice can sustain, under given DC biases ( gram, Figure 2. . The transistor PASSES the Energy test if, for the inductive load and I the shaded area and greater than the V Figure 4. a. (a) (b) The transistor FAILS if the V (minimum limit) at any point along the V shown on Figures 4 ...
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... Figure 5. DC Current Gain Figure 7. Collector Saturation Region Figure 9. Base–Emitter Saturation Voltage BUB323Z Figure 6. DC Current Gain Figure 8. Collector–Emitter Saturation Voltage Figure 10. Base–Emitter “ON” Voltages http://onsemi.com 5 ...
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... One is to increase the area of the Collector pad. By increasing the area of the collection pad, the power dissipation can be increased. BUB323Z 2 PAK SURFACE MOUNT PACKAGE interface between the board and the package. With the correct pad geometry, the packages will self align when subjected to a solder reflow process ...
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... C. The soldering temperature and time shall not exceed 260 C for more than 10 seconds. BUB323Z SOLDER STENCIL GUIDELINES typical stencil for the DPAK and D pattern of the opening in the stencil for the Collector pad is not critical as long as it allows approximately 50% of the pad to be covered with paste ...
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... This profile shows temperature versus time. BUB323Z TYPICAL SOLDER HEATING PROFILE The line on the graph shows the actual temperature that might be experienced on the surface of a test board at or near a central solder joint ...
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... PACKAGE DIMENSIONS –B– S –T– BUB323Z 2 D PAK CASE 418B–03 ISSUE http://onsemi.com 9 ...
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... Notes BUB323Z http://onsemi.com 10 ...
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... Notes BUB323Z http://onsemi.com 11 ...
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... N. American Technical Support: 800–282–9855 Toll Free USA/Canada BUB323Z JAPAN: ON Semiconductor, Japan Customer Focus Center 4–32–1 Nishi–Gotanda, Shinagawa–ku, Tokyo, Japan 141–0031 Phone: 81–3–5740–2700 Email: r14525@onsemi.com ON Semiconductor Website: http://onsemi.com For additional information, please contact your local Sales Representative. http://onsemi.com 12 BUB323Z/D ...