FDD6N50 Fairchild Semiconductor, FDD6N50 Datasheet

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FDD6N50

Manufacturer Part Number
FDD6N50
Description
Manufacturer
Fairchild Semiconductor
Datasheet

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©2006 Fairchild Semiconductor Corporation
FDD6N50/FDU6N50 REV. A
FDD6N50
500V N-Channel MOSFET
Features
• 6A, 500V, R
• Low gate charge ( typical 12.8 nC)
• Low C
• Fast switching
• 100% avalanche tested
• Improved dv/dt capability
Absolute Maximum Ratings
Thermal Characteristics
V
I
I
V
E
I
E
dv/dt
P
T
T
R
R
D
DM
AR
J,
L
DSS
GSS
AS
AR
D
Symbol
Symbol
θJC
θJA
T
STG
rss
( typical 9 pF)
DS(on)
Drain-Source Voltage
Drain Current
Drain Current
Gate-Source voltage
Single Pulsed Avalanche Energy
Avalanche Current
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt
Power Dissipation
Maximum Lead Temperature for Soldering Purpose,
1/8” from Case for 5 Seconds
Thermal Resistance, Junction-to-Case
Thermal Resistance, Junction-to-Ambient
Operating and Storage Temperature Range
= 0.9Ω @V
G
/FDU6N50
S
GS
D-PAK
FDD Series
= 10 V
- Continuous (T
- Continuous (T
- Pulsed
(T
- Derate above 25°C
Parameter
D
Parameter
C
= 25°C)
G
C
C
D
= 25°C)
= 100°C)
S
1
Description
These N-Channel enhancement mode power field effect
transistors are produced using Fairchild’s proprietary, planar
stripe, DMOS technology.
This advanced technology has been especially tailored to
minimize on-state resistance, provide superior switching
performance, and withstand high energy pulse in the avalanche
and commutation mode. These devices are well suited for high
efficient switched mode power supplies and active power factor
correction.
(Note 2)
(Note 1)
(Note 1)
(Note 3)
(Note 1)
I-PAK
FDU Series
FDD6N50/FDU6N50
Min.
--
--
-55 to +150
0.71
500
±30
270
300
3.8
8.9
4.5
24
89
6
6
G
UniFET
Max.
1.4
83
D
S
January 2006
www.fairchildsemi.com
Unit
W/°C
V/ns
Unit
mJ
mJ
°C/W
°C/W
°C
°C
W
V
A
A
A
V
A
TM

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FDD6N50 Summary of contents

Page 1

... Thermal Resistance, Junction-to-Case θJC R Thermal Resistance, Junction-to-Ambient θJA ©2006 Fairchild Semiconductor Corporation FDD6N50/FDU6N50 REV. A Description These N-Channel enhancement mode power field effect transistors are produced using Fairchild’s proprietary, planar stripe, DMOS technology. This advanced technology has been especially tailored to ...

Page 2

... G ≤ 6A, di/dt ≤ 200A/µs, V ≤ Starting DSS 4. Pulse Test: Pulse width ≤ 300µs, Duty Cycle ≤ Essentially Independent of Operating Temperature Typical Characteristics FDD6N50/FDU6N50 REV. A Package Reel Size D-PAK 380mm D-PAK 380mm I-PAK - T = 25°C unless otherwise noted ...

Page 3

... I , Drain Current [A] D Figure 5. Capacitance Characteristics 1000 C iss C oss 100 C rss Drain-Source Voltage [V] DS FDD6N50/FDU6N50 REV. A Figure 2. Transfer Characteristics ∝ Notes : - 250 レ s Pulse Test 25∩ Figure 4. Body Diode Forward Voltage ...

Page 4

... 150 Single Pulse - Drain-Source Voltage [ FDD6N50/FDU6N50 REV. A (Continued) Figure 8. On-Resistance Variation 3.0 2.5 2.0 1.5 1.0 ♦ Notes : 250 µ A 0.5 D 0.0 100 150 200 -100 o C] Figure 10. Maximum Drain Current ...

Page 5

... Unclamped Inductive Switching Test Circuit & Waveforms FDD6N50/FDU6N50 REV. A Gate Charge Test Circuit & Waveform Resistive Switching Test Circuit & Waveforms 5 www.fairchildsemi.com ...

Page 6

... FDD6N50/FDU6N50 REV. A Peak Diode Recovery dv/dt Test Circuit & Waveforms 6 www.fairchildsemi.com ...

Page 7

... Mechanical Dimensions FDD6N50/FDU6N50 REV. A D-PAK 7 Dimensions in Millimeters www.fairchildsemi.com ...

Page 8

... Mechanical Dimensions FDD6N50/FDU6N50 REV. A (Continued) I-PAK 8 Dimensions in Millimeters www.fairchildsemi.com ...

Page 9

... TRADEMARKS The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended exhaustive list of all such trademarks. FAST ® ACEx™ ActiveArray™ FASTr™ Bottomless™ FPS™ Build it Now™ FRFET™ CoolFET™ ...

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