HI5860IB Intersil, HI5860IB Datasheet

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HI5860IB

Manufacturer Part Number
HI5860IB
Description
CONV D/A 12-BIT 130MSPS 28-SOIC
Manufacturer
Intersil
Datasheet

Specifications of HI5860IB

Settling Time
35ns
Number Of Bits
12
Data Interface
Parallel
Number Of Converters
1
Voltage Supply Source
Analog and Digital
Power Dissipation (max)
200mW
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
28-SOIC (7.5mm Width)
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HI5860IB
Manufacturer:
Intersil
Quantity:
144
Company:
Part Number:
HI5860IB
Quantity:
143
Part Number:
HI5860IBZ
Manufacturer:
INTERSIL
Quantity:
20 000
12-Bit, 130MSPS, High Speed D/A
Converter
The HI5860 is a 12-bit, 130MSPS (Mega Samples Per
Second), high speed, low power, D/A converter which is
implemented in an advanced CMOS process. Operating
from a single +3V to +5V supply, the converter provides
20mA of full scale output current and includes
edge-triggered CMOS input data latches. Low glitch energy
and excellent frequency domain performance are achieved
using a segmented current source architecture.
This device complements the HI5x60 and HI5x28 family of high
speed converters, which includes 8-, 10-, 12-, and 14-bit
devices.
Pinout
Ordering Information
HI5860IA*
HI5860IB
HI5860IBZ*
(Note)
HI5860SOICEVAL1
*Add “-T” suffix for tape and reel. Please refer to TB347 for details on reel specifications.
NOTE: These Intersil Pb-free plastic packaged products employ special Pb-free material sets; molding compounds/die attach materials and 100%
matte tin plate PLUS ANNEAL - e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations.
Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J
STD-020.
NUMBER
PART
(MSB) D11
(LSB) D0
D10
NC
NC
D9
D8
D7
D6
D5
D4
D3
D2
D1
10
11
12
13
14
1
2
3
4
5
6
7
8
9
(28 LD SOIC, TSSOP)
HI5860 IA
HI5860IB
HI5860IBZ
PART MARKING
TOP VIEW
HI5860
®
1
Data Sheet
28
27
26
25
24
23
22
21
20
19
18
17
16
15
TEMP. RANGE (°C)
CLK
DV
DCOM
ACOM
AV
COMP2
IOUTA
IOUTB
ACOM
COMP1
FSADJ
REFIO
REFLO
SLEEP
DD
DD
-40 to +85
-40 to +85
-40 to +85
+25
1-888-INTERSIL or 1-888-468-3774
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
28 Ld TSSOP
28 Ld SOIC
28 Ld SOIC (Pb-free)
Evaluation Platform
Features
• Throughput Rate . . . . . . . . . . . . . . . . . . . . . . . . 130MSPS
• Low Power . . . 175mW at 5V, 32mW at 3V (At 100MSPS)
• Integral Linearity Error (Typ) . . . . . . . . . . . . . . . ±0.5 LSB
• Adjustable Full Scale Output Current . . . . . 2mA to 20mA
• Internal 1.2V Bandgap Voltage Reference
• Single Power Supply from +5V to +3V
• Power-Down Mode
• CMOS Compatible Inputs
• Excellent Spurious Free Dynamic Range
• Excellent Multitone Intermodulation Distortion
• Pb-Free Available (RoHS Compliant)
Applications
• Basestations (Cellular, WLL)
• Medical/Test Instrumentation
• Wireless Communications Systems
• Direct Digital Frequency Synthesis
• Signal Reconstruction
• High Resolution Imaging Systems
• Arbitrary Waveform Generators
(76dBc, f
PACKAGE
February 6, 2008
All other trademarks mentioned are the property of their respective owners.
|
Copyright Intersil Americas Inc. 2000, 2005, 2008. All Rights Reserved
S
Intersil (and design) is a registered trademark of Intersil Americas Inc.
= 50MSPS, f
M28.173
M28.3
M28.3
OUT
PKG. DWG. #
= 2.51MHz)
130MHz
130MHz
130MHz
130MHz
CLOCK SPEED
HI5860
FN4654.7

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HI5860IB Summary of contents

Page 1

... HI5860IA* HI5860 IA HI5860IB HI5860IB HI5860IBZ* HI5860IBZ (Note) HI5860SOICEVAL1 *Add “-T” suffix for tape and reel. Please refer to TB347 for details on reel specifications. NOTE: These Intersil Pb-free plastic packaged products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate PLUS ANNEAL - e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations ...

Page 2

Typical Applications Circuit D11 D10 50Ω BEAD + 10µH 10µF 0.1µF Functional Block Diagram (LSB LATCH D10 (MSB) D11 CLK ...

Page 3

Pin Descriptions PIN NUMBER PIN NAME 1 through 12 D11 (MSB) Through D0 (LSB) 13, SLEEP 16 REFLO 17 REFIO 18 FSADJ 19 COMP1 21 IOUTB 22 IOUTA 23 COMP2 20, 25 ACOM 26 DCOM ...

Page 4

... SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TSSOP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . + 0.3V Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . +150° 0.3V Maximum Storage Temperature Range . . . . . . . . . -65°C to +150°C DD Pb-free reflow profile . . . . . . . . . . . . . . . . . . . . . . . . . .see link below http://www.intersil.com/pbfree/Pb-FreeReflow.asp = DV = +5V (except where otherwise noted +25°C for All Typical Values. A TEST CONDITIONS = 25Ω (Note Internal 1.2V, IOUTFS = 20mA, ...

Page 5

Electrical Specifications -40°C to +85° PARAMETER AC CHARACTERISTICS +5V Power Supply f Spurious Free Dynamic Range, f SFDR Within a Window f +5V Power Supply f Total Harmonic Distortion (THD Nyquist f ...

Page 6

Electrical Specifications -40°C to +85° PARAMETER +3V Power Supply f Spurious Free Dynamic Range, f SFDR to Nyquist (f /2) CLK +3V Power ...

Page 7

Electrical Specifications -40°C to +85° PARAMETER TIMING CHARACTERISTICS Data Set-up Time, t See Figure 4 (Note 3) SU Data Hold Time, t See Figure 4 (Note 3) HLD Propagation Delay Time, t See Figure ...

Page 8

Definition of Specifications Differential Linearity Error, DNL, is the measure of the step size output deviation from code to code. Ideally, the step size should be 1 LSB. A DNL specification of 1 LSB or less guarantees monotonicity. Full Scale ...

Page 9

The same is true for the analog components and the analog ground plane. Consult Application Note 9853. Noise Reduction To minimize power supply ...

Page 10

Timing Diagrams CLK D11-D0 I OUT t SETT t PD FIGURE 2. OUTPUT SETTLING TIME DIAGRAM CLK t SU D11-D0 I OUT t PD FIGURE 4. PROPAGATION DELAY, SETUP TIME, HOLD TIME AND MINIMUM PULSE WIDTH DIAGRAM 10 HI5860 50% ...

Page 11

Thin Shrink Small Outline Plastic Packages (TSSOP) N INDEX 0.25(0.010) E AREA E1 - 0.05(0.002) SEATING PLANE - -C- α 0.10(0.004) 0.10(0.004 NOTES: 1. These package ...

Page 12

... Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use ...

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