IDT72V2103 IDT [Integrated Device Technology], IDT72V2103 Datasheet

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IDT72V2103

Manufacturer Part Number
IDT72V2103
Description
3.3 VOLT HIGH-DENSITY SUPERSYNC II NARROW BUS FIFO
Manufacturer
IDT [Integrated Device Technology]
Datasheet

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FEATURES:
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FUNCTIONAL BLOCK DIAGRAM
*Available on the
IDT and the IDT logo are registered trademarks of Integrated Device Technology, Inc. SuperSync II FIFO is a trademark of Integrated Device Technology, Inc.
COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES
BGA package only.
2003 Integrated Device Technology, Inc. All rights reserved. Product specifications subject to change without notice.
Choose among the following memory organizations:
IDT72V275/72V285 SuperSync FIFOs
Master Reset clears entire FIFO
Functionally compatible with the IDT72V255LA/72V265LA and
Up to 166 MHz Operation of the Clocks
User selectable Asynchronous read and/or write ports (BGA Only)
7.5 ns read/write cycle time (5.0 ns access time)
User selectable input and output port bus-sizing
- x9 in to x9 out
- x9 in to x18 out
- x18 in to x9 out
- x18 in to x18 out
Big-Endian/Little-Endian user selectable byte representation
5V tolerant inputs
Fixed, low first word latency
Zero latency retransmit
Auto power down minimizes standby power consumption
IDT72V2103     
IDT72V2113 
*
*
*
* *
*
ASYW
TRST
MRS
TMS
PRS
TCK
TDO
OW
BE
TDI
IP
IW
131,072 x 18/262,144 x 9
262,144 x 18/524,288 x 9
CONFIGURATION
WRITE CONTROL
WRITE POINTER
JTAG CONTROL
WEN
(BOUNDARY
CONTROL
RESET
LOGIC
LOGIC
LOGIC
SCAN)
BUS
WCLK/WR
3.3 VOLT HIGH-DENSITY SUPERSYNC II™
NARROW BUS FIFO
131,072 x 18/262,144 x 9
262,144 x 18/524,288 x 9
*
*
OE
OUTPUT REGISTER
131,072 x 18 or 262,144 x 9
262,144 x 18 or 524,288 x 9
INPUT REGISTER
D
Q
0
0
-D
RAM ARRAY
-Q
n
n
(x9 or x18)
(x9 or x18)
1
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Partial Reset clears data, but retains programmable settings
Empty, Full and Half-Full flags signal FIFO status
Programmable Almost-Empty and Almost-Full flags, each flag can
default to one of eight preselected offsets
Selectable synchronous/asynchronous timing modes for Almost-
Empty and Almost-Full flags
Program programmable flags by either serial or parallel means
Select IDT Standard timing (using EF and FF flags) or First Word
Fall Through timing (using OR and IR flags)
Output enable puts data outputs into high impedance state
Easily expandable in depth and width
JTAG port, provided for Boundary Scan function (BGA Only)
Independent Read and Write Clocks (permit reading and writing
simultaneously)
Available in a 80-pin Thin Quad Flat Pack (TQFP) or a 100-pin Ball
Grid Array (BGA) (with additional features)
Pin compatible to the SuperSync II (IDT72V223/72V233/72V243/
72V253/72V263/72V273/72V283/72V293) family
High-performance submicron CMOS technology
Industrial temperature range (–40° ° ° ° ° C to +85° ° ° ° ° C) is available
OFFSET REGISTER
READ POINTER
LOGIC
CONTROL
FLAG
LOGIC
READ
LD
SEN
SEPTEMBER 2003
RCLK/RD
REN
RT
RM
ASYR
EF/OR
FSEL1
FF/IR
PAF
PAE
HF
FWFT/SI
PFM
FSEL0
*
6119 drw01
IDT72V2103
IDT72V2113
*
DSC-6119/10

Related parts for IDT72V2103

IDT72V2103 Summary of contents

Page 1

... FEATURES: • Choose among the following memory organizations: IDT72V2103      131,072 x 18/262,144 x 9 IDT72V2113  262,144 x 18/524,288 x 9 • • • • • Functionally compatible with the IDT72V255LA/72V265LA and IDT72V275/72V285 SuperSync FIFOs • • • • • ...

Page 2

... DESCRIPTION: The IDT72V2103/72V2113 are exceptionally deep, high speed, CMOS First-In-First-Out (FIFO) memories with clocked read and write controls and a flexible Bus-Matching x9/x18 data flow. These FIFOs offer numerous improve- ments over previous SuperSync FIFOs, including the following: • ...

Page 3

... IDT72V2103/72V2113 3.3V HIGH DENSITY SUPERSYNC II IDT72V263/273/283/293/103/113 3.3V HIGH DENSITY SUPERSYNC 18, 16K x 9/18, 32K x 9/18, 64K x 9/18, 128K x 9/18, 256K x 9/18, 512K x9 131,072 x 18/262,144 x 9, 262,144 x 18/524,288 x 9 DESCRIPTION (CONTINUED) Each FIFO has a data input port (D ) and a data output port (Q n which can assume either an 18-bit or a 9-bit width as determined by the state of external control pins Input Width (IW) and Output Width (OW) during the Master Reset cycle ...

Page 4

... IDT72V2103/72V2113 3.3V HIGH DENSITY SUPERSYNC II IDT72V263/273/283/293/103/113 3.3V HIGH DENSITY SUPERSYNC 18, 16K x 9/18, 32K x 9/18, 64K x 9/18, 128K x 9/18, 256K x 9/18, 512K x9 131,072 x 18/262,144 x 9, 262,144 x 18/524,288 x 9 DESCRIPTION (CONTINUED) not have to be asserted for accessing the first word. However, subsequent words written to the FIFO do require a LOW on REN for access. The state of the FWFT/SI input during Master Reset determines the timing mode in use ...

Page 5

... Once in the power down state, the standby supply current consumption is minimized. Initiating any operation (by activating control inputs) will immediately take the device out of the power down state. The IDT72V2103/72V2113 are fabricated using IDT’s high speed submi- cron CMOS technology. OW ...

Page 6

... IDT72V2103/72V2113 3.3V HIGH DENSITY SUPERSYNC II IDT72V263/273/283/293/103/113 3.3V HIGH DENSITY SUPERSYNC 18, 16K x 9/18, 32K x 9/18, 64K x 9/18, 128K x 9/18, 256K x 9/18, 512K x9 131,072 x 18/262,144 x 9, 262,144 x 18/524,288 x 9 PIN DESCRIPTION (TQFP & BGA PACKAGES) Symbol Name I/O BE During Master Reset, a LOW on BE will select Big-Endian operation. A HIGH on BE during Master Reset will ...

Page 7

... IDT72V2103/72V2113 3.3V HIGH DENSITY SUPERSYNC II IDT72V263/273/283/293/103/113 3.3V HIGH DENSITY SUPERSYNC 18, 16K x 9/18, 32K x 9/18, 64K x 9/18, 128K x 9/18, 256K x 9/18, 512K x9 131,072 x 18/262,144 x 9, 262,144 x 18/524,288 x 9 PIN DESCRIPTION-CONTINUED (TQFP & BGA PACKAGES) Symbol Name I/O RM (1) Retransmit Timing I During Master Reset, a LOW on RM will select zero latency Retransmit timing Mode. A HIGH on RM will select Mode normal latency mode ...

Page 8

... IDT72V2103/72V2113 3.3V HIGH DENSITY SUPERSYNC II IDT72V263/273/283/293/103/113 3.3V HIGH DENSITY SUPERSYNC 18, 16K x 9/18, 32K x 9/18, 64K x 9/18, 128K x 9/18, 256K x 9/18, 512K x9 131,072 x 18/262,144 x 9, 262,144 x 18/524,288 x 9 ABSOLUTE MAXIMUM RATINGS Symbol Rating (2) V Terminal Voltage TERM with respect to GND T Storage Temperature STG I DC Output Current OUT NOTE: 1 ...

Page 9

... IDT72V2103/72V2113 3.3V HIGH DENSITY SUPERSYNC II IDT72V263/273/283/293/103/113 3.3V HIGH DENSITY SUPERSYNC 18, 16K x 9/18, 32K x 9/18, 64K x 9/18, 128K x 9/18, 256K x 9/18, 512K x9 131,072 x 18/262,144 x 9, 262,144 x 18/524,288 ELECTRICAL CHARACTERISTICS (Commercial 3.3V ± 0.15V 0°C to +70°C; Industrial Symbol Parameter f Clock Cycle Frequency S (5) t Data Access Time ...

Page 10

... IDT72V2103/72V2113 3.3V HIGH DENSITY SUPERSYNC II IDT72V263/273/283/293/103/113 3.3V HIGH DENSITY SUPERSYNC 18, 16K x 9/18, 32K x 9/18, 64K x 9/18, 128K x 9/18, 256K x 9/18, 512K x9 131,072 x 18/262,144 x 9, 262,144 x 18/524,288 ELECTRICAL CHARACTERISTICS (Commercial 3.3V ± 0.15V 0°C to +70°C;Industrial Symbol Parameter (4) f Cycle Frequency (Asynchronous mode (4) ...

Page 11

... IDT72V2103/72V2113 3.3V HIGH DENSITY SUPERSYNC II IDT72V263/273/283/293/103/113 3.3V HIGH DENSITY SUPERSYNC 18, 16K x 9/18, 32K x 9/18, 64K x 9/18, 128K x 9/18, 256K x 9/18, 512K x9 131,072 x 18/262,144 x 9, 262,144 x 18/524,288 TEST CONDITIONS Input Pulse Levels Input Rise/Fall Times Input Timing Reference Levels Output Reference Levels Output Load for t = 10ns ...

Page 12

... HF would toggle to LOW once the (D words were written into the FIFO. If x18 Input or x18 Output bus Width is selected, (D the 65,538th word for the IDT72V2103 and 131,074th word for the IDT72V2113. If both x9 Input and x9 Output bus Widths are selected, (D the 131,074th word for the IDT72V2103 and 262,146th word for the IDT72V2113 ...

Page 13

... PROGRAMMING FLAG OFFSETS Full and Empty Flag offset values are user programmable. The IDT72V2103/ 72V2113 has internal registers for these offsets. There are eight default offset values selectable during Master Reset. These offset values are shown in Table 2. Offset values can also be programmed into the FIFO in one of two ways ...

Page 14

... IDT72V2103/72V2113 3.3V HIGH DENSITY SUPERSYNC II IDT72V263/273/283/293/103/113 3.3V HIGH DENSITY SUPERSYNC 18, 16K x 9/18, 32K x 9/18, 64K x 9/18, 128K x 9/18, 256K x 9/18, 512K x9 131,072 x 18/262,144 x 9, 262,144 x 18/524,288 x 9 TABLE 3  STATUS FLAGS FOR IDT STANDARD MODE ≠ IDT72V2103 x18 Number of (n+1) to 65,536 ...

Page 15

... IDT72V2103/72V2113 3.3V HIGH DENSITY SUPERSYNC II IDT72V263/273/283/293/103/113 3.3V HIGH DENSITY SUPERSYNC 18, 16K x 9/18, 32K x 9/18, 64K x 9/18, 128K x 9/18, 256K x 9/18, 512K x9 131,072 x 18/262,144 x 9, 262,144 x 18/524,288 x 9 1st Parallel Offset Write/Read Cycle D/Q8 EMPTY OFFSET REGISTER 2nd Parallel Offset Write/Read Cycle D/Q8 EMPTY OFFSET REGISTER 16 15 ...

Page 16

... IDT72V2103/72V2113 3.3V HIGH DENSITY SUPERSYNC II IDT72V263/273/283/293/103/113 3.3V HIGH DENSITY SUPERSYNC 18, 16K x 9/18, 32K x 9/18, 64K x 9/18, 128K x 9/18, 256K x 9/18, 512K x9 131,072 x 18/262,144 x 9, 262,144 x 18/524,288 x 9 WCLK LD WEN REN SEN ...

Page 17

... IDT72V2103 and 38 bits for the IDT72V2113. For any other mode of operation (that includes x18 bus width on either the Input or Output), minus 2 bits from the values above. So, a total of 34 bits for the IDT72V2103 and 36 bits for the IDT72V2113. See Figure 15, Serial Loading of Programmable Flag Regis- ters, for the timing diagram for this mode ...

Page 18

... FIFO, between Reset (Master or Partial) and the time of Retransmit setup. If x18 Input or x18 Output bus Width is selected 131,072 for the IDT72V2103 and 262,144 for the IDT72V2113. If both x9 Input and x9 Output bus Widths are selected 262,144 for the IDT72V2103 and 524,288 for the IDT72V2113 ...

Page 19

... IDT72V2103/72V2113 3.3V HIGH DENSITY SUPERSYNC II IDT72V263/273/283/293/103/113 3.3V HIGH DENSITY SUPERSYNC 18, 16K x 9/18, 32K x 9/18, 64K x 9/18, 128K x 9/18, 256K x 9/18, 512K x9 131,072 x 18/262,144 x 9, 262,144 x 18/524,288 x 9 SIGNAL DESCRIPTION INPUTS: DATA Data inputs for 18-bit wide data ( data inputs for 9-bit wide data ...

Page 20

... IDT72V2103/72V2113 3.3V HIGH DENSITY SUPERSYNC II IDT72V263/273/283/293/103/113 3.3V HIGH DENSITY SUPERSYNC 18, 16K x 9/18, 32K x 9/18, 64K x 9/18, 128K x 9/18, 256K x 9/18, 512K x9 131,072 x 18/262,144 x 9, 262,144 x 18/524,288 x 9 FIRST WORD FALL THROUGH/SERIAL IN (FWFT/SI) This is a dual purpose pin. During Master Reset, the state of the FWFT/ SI input determines whether the device will operate in IDT Standard mode or First Word Fall Through (FWFT) mode ...

Page 21

... NARROW BUS FIFO after a reset (either MRS or PRS), FF will go LOW after D writes to the FIFO. If x18 Input or x18 Output bus Width is selected 131,072 for the IDT72V2103 and 262,144 for the IDT72V2113. If both x9 Input and x9 Output bus Widths are selected 262,144 for the IDT72V2103 and 524,288 for the IDT72V2113. ...

Page 22

... In IDT Standard mode reads are performed after reset (MRS or PRS), HF will go LOW after (D writes to the FIFO. If x18 Input or x18 Output bus Width is selected 131,072 for the IDT72V2103 and 262,144 for the IDT72V2113. If both x9 Input and x9 Output bus Widths are selected 262,144 for the IDT72V2103 and 524,288 for the IDT72V2113 ...

Page 23

... IDT72V2103/72V2113 3.3V HIGH DENSITY SUPERSYNC II IDT72V263/273/283/293/103/113 3.3V HIGH DENSITY SUPERSYNC 18, 16K x 9/18, 32K x 9/18, 64K x 9/18, 128K x 9/18, 256K x 9/18, 512K x9 131,072 x 18/262,144 x 9, 262,144 x 18/524,288 x 9 BYTE ORDER ON INPUT PORT: BYTE ORDER ON OUTPUT PORT ...

Page 24

... IDT72V2103/72V2113 3.3V HIGH DENSITY SUPERSYNC II IDT72V263/273/283/293/103/113 3.3V HIGH DENSITY SUPERSYNC 18, 16K x 9/18, 32K x 9/18, 64K x 9/18, 128K x 9/18, 256K x 9/18, 512K x9 131,072 x 18/262,144 x 9, 262,144 x 18/524,288 x 9 MRS t RSS REN t RSS WEN t RSS FWFT/SI t RSS LD t RSS ASYW, ASYR t RSS FSEL0, FSEL1 t RSS OW RSS BE t RSS ...

Page 25

... IDT72V2103/72V2113 3.3V HIGH DENSITY SUPERSYNC II IDT72V263/273/283/293/103/113 3.3V HIGH DENSITY SUPERSYNC 18, 16K x 9/18, 32K x 9/18, 64K x 9/18, 128K x 9/18, 256K x 9/18, 512K x9 131,072 x 18/262,144 x 9, 262,144 x 18/524,288 x 9 PRS t RSS REN t RSS WEN t RSS RT t RSS SEN EF/OR FF/IR PAE PAF NARROW BUS FIFO TM NARROW BUS FIFO ...

Page 26

... IDT72V2103/72V2113 3.3V HIGH DENSITY SUPERSYNC II IDT72V263/273/283/293/103/113 3.3V HIGH DENSITY SUPERSYNC 18, 16K x 9/18, 32K x 9/18, 64K x 9/18, 128K x 9/18, 256K x 9/18, 512K x9 131,072 x 18/262,144 x 9, 262,144 x 18/524,288 WRITE WCLK 1 t (1) SKEW1 WEN RCLK t t ENS ENH REN DATA IN OUTPUT REGISTER NOTES: is the minimum time between a rising RCLK edge and a rising WCLK edge to guarantee that FF will go high (after one WCLK cycle pus t 1 ...

Page 27

... IDT72V2103/72V2113 3.3V HIGH DENSITY SUPERSYNC II IDT72V263/273/283/293/103/113 3.3V HIGH DENSITY SUPERSYNC 18, 16K x 9/18, 32K x 9/18, 64K x 9/18, 128K x 9/18, 256K x 9/18, 512K x9 131,072 x 18/262,144 x 9, 262,144 x 18/524,288 NARROW BUS FIFO TM NARROW BUS FIFO 27 COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES ...

Page 28

... IDT72V2103/72V2113 3.3V HIGH DENSITY SUPERSYNC II IDT72V263/273/283/293/103/113 3.3V HIGH DENSITY SUPERSYNC 18, 16K x 9/18, 32K x 9/18, 64K x 9/18, 128K x 9/18, 256K x 9/18, 512K x9 131,072 x 18/262,144 x 9, 262,144 x 18/524,288 NARROW BUS FIFO TM NARROW BUS FIFO 28 COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES ...

Page 29

... If x18 Input or x18 Output bus Width is selected 131,072 for the IDT72V2103 and 262,144 for the IDT72V2113. If both x9 Input and x9 Output bus Widths are selected 262,144 for the IDT72V2103 and 524,288 for the IDT72V2113. 5. There must be at least two words written to and two words read from the FIFO before a Retransmit operation can be invoked. ...

Page 30

... No more than words may be written to the FIFO between Reset (Master or Partial) and Retransmit setup. Therefore, IR will be LOW throughout the Retransmit setup procedure. If x18 Input or x18 Output bus Width is selected 131,073 for the IDT72V2103 and 262,145 for the IDT72V2113. If both x9 Input and x9 Output bus Widths are selected 262,145 for the IDT72V2103 and 524,289 for the IDT72V2113 LOW 4 ...

Page 31

... If x18 Input or x18 Output bus Width is selected 131,072 for the IDT72V2103 and 262,144 for the IDT72V2113. If both x9 Input and x9 Output bus Widths are selected 262,144 for the IDT72V2103 and 524,288 for the IDT72V2113. 5. There must be at least two words written to and read from the FIFO before a Retransmit operation can be invoked. ...

Page 32

... No more than words may be written to the FIFO between Reset (Master or Partial) and Retransmit setup. Therefore, IR will be LOW throughout the Retransmit setup procedure. If x18 Input or x18 Output bus Width is selected 131,073 for the IDT72V2103 and 262,145 for the IDT72V2113. If both x9 Input and x9 Output bus Widths are selected 262,145 for the IDT72V2103 and 524,289 for the IDT72V2113 LOW 4 ...

Page 33

... PAF offset . maximum FIFO depth. In IDT Standard mode: if x18 Input or x18 Output bus Width is selected 131,072 for the IDT72V2103 and 262,144 for the IDT72V2113. If both x9 Input and x9 Output bus Widths are selected 262,144 for the IDT72V2103 and 524,288 for the IDT72V2113. ...

Page 34

... PAF offset maximum FIFO Depth. In IDT Standard mode: if x18 Input or x18 Output bus Width is selected 131,072 for the IDT72V2103 and 262,144 for the IDT72V2113. If both x9 Input and x9 Output bus Widths are selected 262,144 for the IDT72V2103 and 524,288 for the IDT72V2113. ...

Page 35

... NOTES IDT Standard mode maximum FIFO depth. If x18 Input or x18 Output bus Width is selected 131,072 for the IDT72V2103 and 262,144 for the IDT72V2113. If both x9 Input and x9 Output bus Widths are selected 262,144 for the IDT72V2103 and 524,288 for the IDT72V2113. ...

Page 36

... IDT72V2103/72V2113 3.3V HIGH DENSITY SUPERSYNC II IDT72V263/273/283/293/103/113 3.3V HIGH DENSITY SUPERSYNC 18, 16K x 9/18, 32K x 9/18, 64K x 9/18, 128K x 9/18, 256K x 9/18, 512K x9 131,072 x 18/262,144 x 9, 262,144 x 18/524,288 x 9 RCLK REN FFA NOTE LOW and WEN = LOW. Figure 23. Asynchronous Write, Synchronous Read, Full Flag Operation (IDT Standard Mode) ...

Page 37

... IDT72V2103/72V2113 3.3V HIGH DENSITY SUPERSYNC II IDT72V263/273/283/293/103/113 3.3V HIGH DENSITY SUPERSYNC 18, 16K x 9/18, 32K x 9/18, 64K x 9/18, 128K x 9/18, 256K x 9/18, 512K x9 131,072 x 18/262,144 x 9, 262,144 x 18/524,288 Write WCLK 1 WEN SKEW t CYL Last Word W X NOTES LOW and REN = LOW. 2. Asynchronous Read is available in IDT Standard Mode only. ...

Page 38

... IDT72V2103/72V2113 3.3V HIGH DENSITY SUPERSYNC II IDT72V263/273/283/293/103/113 3.3V HIGH DENSITY SUPERSYNC 18, 16K x 9/18, 32K x 9/18, 64K x 9/18, 128K x 9/18, 256K x 9/18, 512K x9 131,072 x 18/262,144 x 9, 262,144 x 18/524,288 CYC t t CYH CYL Last Word in O/P Register t RPE t EFA EF NOTES LOW, WEN = LOW, and REN = LOW. ...

Page 39

... FIFO, and separately ANDing FF of every FIFO. In FWFT mode, composite flags can be created by ORing OR of every FIFO, and separately ORing IR of every FIFO. Figure 29 demonstrates a width expansion using two IDT72V2103/ 72V2113 devices. If x18 Input or x18 Output bus Width is selected, D each device form a 36-bit wide input bus and Q a 36-bit wide output bus ...

Page 40

... Input or x18 Output bus Width is selected and 262,144 for the IDT72V2113. When both x9 Input and x9 Output bus Widths are selected, depths greater than 262,144 can be adapted for the IDT72V2103 and 524,288 for the IDT72V2113. In FWFT mode, the FIFOs can be connected in series (the data outputs of one FIFO connected to the data inputs of the next) with no external logic necessary ...

Page 41

... IDT72V2103/72V2113 3.3V HIGH DENSITY SUPERSYNC II IDT72V263/273/283/293/103/113 3.3V HIGH DENSITY SUPERSYNC 18, 16K x 9/18, 32K x 9/18, 64K x 9/18, 128K x 9/18, 256K x 9/18, 512K x9 131,072 x 18/262,144 x 9, 262,144 x 18/524,288 JTCKR t JTCKF t JTCKL TCK TDI/ TMS TDO t JRSR TRST (1) t JRST NOTE: 1. During power up, TRST could be driven low or not be used since the JTAG circuit resets automatically. TRST is an optional JTAG reset. ...

Page 42

... JTAG INTERFACE Five additional pins (TDI, TDO, TMS, TCK and TRST) are provided to support the JTAG boundary scan interface. The IDT72V2103/72V2113 incorporates the necessary tap controller and modified pad cells to implement the JTAG facility. Note that IDT provides appropriate Boundary Scan Description Language program files for these devices ...

Page 43

... IDT72V2103/72V2113 3.3V HIGH DENSITY SUPERSYNC II IDT72V263/273/283/293/103/113 3.3V HIGH DENSITY SUPERSYNC 18, 16K x 9/18, 32K x 9/18, 64K x 9/18, 128K x 9/18, 256K x 9/18, 512K x9 131,072 x 18/262,144 x 9, 262,144 x 18/524,288 Input = TMS NOTE: 1. Five consecutive TCK cycles with TMS = 1 will reset the TAP. Refer to the IEEE Standard Test Access Port Specification (IEEE Std. ...

Page 44

... TAP in response to the IDCODE instruction. IDT JEDEC ID number is 0xB3. This translates to 0x33 when the parity is dropped in the 11-bit Manufacturer ID field. For the IDT72V2103/72V2113, the Part Number field contains the following values: Device Part# Field ...

Page 45

... IDT72V2103/72V2113 3.3V HIGH DENSITY SUPERSYNC II IDT72V263/273/283/293/103/113 3.3V HIGH DENSITY SUPERSYNC 18, 16K x 9/18, 32K x 9/18, 64K x 9/18, 128K x 9/18, 256K x 9/18, 512K x9 131,072 x 18/262,144 x 9, 262,144 x 18/524,288 x 9 HIGH-IMPEDANCE The optional High-Impedance instruction sets all outputs (including two-state as well as three-state types disabled (high-impedance) state and selects the one-bit bypass register to be connected between TDI and TDO ...

Page 46

ORDERING INFORMATION IDT XXXXX X XX Device Type Power Speed NOTE: 1. Industrial temperature range product for the 10ns is available as a standard device. All other speed grades are available by special order. DATASHEET DOCUMENT HISTORY 12/18/2000 pgs. 7, ...

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