IRF1404S International Rectifier, IRF1404S Datasheet

MOSFET N-CH 40V 162A D2PAK

IRF1404S

Manufacturer Part Number
IRF1404S
Description
MOSFET N-CH 40V 162A D2PAK
Manufacturer
International Rectifier
Series
HEXFET®r
Datasheet

Specifications of IRF1404S

Fet Type
MOSFET N-Channel, Metal Oxide
Fet Feature
Logic Level Gate
Rds On (max) @ Id, Vgs
4 mOhm @ 95A, 10V
Drain To Source Voltage (vdss)
40V
Current - Continuous Drain (id) @ 25° C
162A
Vgs(th) (max) @ Id
4V @ 250µA
Gate Charge (qg) @ Vgs
200nC @ 10V
Input Capacitance (ciss) @ Vds
7360pF @ 25V
Power - Max
3.8W
Mounting Type
Surface Mount
Package / Case
D²Pak, TO-263 (2 leads + tab)
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Other names
*IRF1404S

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
IRF1404S
Manufacturer:
IR
Quantity:
5 220
Part Number:
IRF1404STRLPBF
0
Description
Seventh Generation HEXFET
International Rectifier utilize advanced processing
techniques to achieve extremely low on-resistance per
silicon area.
switching speed and ruggedized device design that
HEXFET power MOSFETs are well known for, provides
the designer with an extremely efficient and reliable
device for use in a wide variety of applications.
The D
accommodating die sizes up to HEX-4. It provides the
highest power capability and the lowest possible on-
resistance in any existing surface mount package. The
D
its low internal connection resistance and can dissipate up
to 2.0W in a typical surface mount application.
The through-hole version (IRF1404L) is available for low-
profile applications.
Absolute Maximum Ratings
Thermal Resistance
I
I
I
P
P
V
E
I
E
dv/dt
T
T
www.irf.com
R
R
D
D
DM
AR
2
J
STG
D
D
GS
AS
AR
Pak is suitable for high current applications because of
@ T
@ T
JC
JA
Advanced Process Technology
Ultra Low On-Resistance
Dynamic dv/dt Rating
175°C Operating Temperature
Fast Switching
Fully Avalanche Rated
@T
@T
2
Pak is a surface mount power package capable of
C
C
A
C
= 25°C
= 100°C
= 25°C
= 25°C
This benefit, combined with the fast
Continuous Drain Current, V
Continuous Drain Current, V
Pulsed Drain Current
Linear Derating Factor
Gate-to-Source Voltage
Single Pulse Avalanche Energy
Avalanche Current
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt
Operating Junction and
Storage Temperature Range
Soldering Temperature, for 10 seconds
Power Dissipation
Power Dissipation
Junction-to-Case
Junction-to-Ambient (PCB mounted, steady-state)
®
Power MOSFETs from
Parameter
Parameter
GS
GS
@ 10V
@ 10V
G
*
IRF1404S
Typ.
300 (1.6mm from case )
–––
–––
D
HEXFET
2
Pak
-55 to +175
-55 to +175
D
S
162
115
Max.
650
200
± 20
519
3.8
1.3
5.0
95
20
®
R
Power MOSFET
DS(on)
IRF1404L
Max.
I
V
TO-262
0.75
D
40
DSS
IRF1404S
IRF1404L
= 162A
= 0.004
PD -93853C
= 40V
Units
Units
W/°C
°C/W
V/ns
mJ
mJ
°C
W
W
A
V
A
1
5/18/01

Related parts for IRF1404S

IRF1404S Summary of contents

Page 1

... HEXFET Pak IRF1404S Max. @ 10V 162 GS @ 10V 115 GS -55 to +175 -55 to +175 300 (1.6mm from case ) Typ. ––– * ––– PD -93853C IRF1404S IRF1404L ® Power MOSFET V = 40V DSS R = 0.004 DS(on 162A D TO-262 IRF1404L Units A 650 3.8 W 200 W 1.3 W/° ...

Page 2

... IRF1404S/L Electrical Characteristics @ T Parameter V Drain-to-Source Breakdown Voltage (BR)DSS Breakdown Voltage Temp. Coefficient (BR)DSS J R Static Drain-to-Source On-Resistance DS(on) V Gate Threshold Voltage GS(th) g Forward Transconductance fs I Drain-to-Source Leakage Current DSS Gate-to-Source Forward Leakage I GSS Gate-to-Source Reverse Leakage Q Total Gate Charge g Q Gate-to-Source Charge ...

Page 3

... Fig 2. Typical Output Characteristics 2 ° 175 C 2.0 J 1.5 1.0 0.5 = 25V 0.0 -60 -40 -20 0 8.0 9.0 Fig 4. Normalized On-Resistance IRF1404S/L VGS 15V 10V 8.0V 7.0V 6.0V 5.5V 5.0V 4.5V 4.5V 20µs PULSE WIDTH ° 175 Drain-to-Source Voltage (V) DS 159A ...

Page 4

... IRF1404S/L 12000 1MHz iss rss gd 10000 oss ds gd 8000 C iss 6000 4000 C oss 2000 C rss Drain-to-Source Voltage (V) DS Fig 5. Typical Capacitance Vs. Drain-to-Source Voltage 1000 ° 175 C J 100 ° 0.4 0.8 1.2 1.6 V ,Source-to-Drain Voltage (V) SD Fig 7. Typical Source-Drain Diode ...

Page 5

... Fig 11. Maximum Effective Transient Thermal Impedance, Junction-to-Case www.irf.com R G 10V Pulse Width Duty Factor Fig 10a. Switching Time Test Circuit V DS 90% 150 175 ° 10 d(on) Fig 10b. Switching Time Waveforms Notes: 1. Duty factor Peak 0.001 0. Rectangular Pulse Duration (sec) 1 IRF1404S D.U. µ d(off ...

Page 6

... IRF1404S Fig 12a. Unclamped Inductive Test Circuit Fig 12b. Unclamped Inductive Waveforms Charge Fig 13a. Basic Gate Charge Waveform Current Regulator Same Type as D.U.T. 50K .2 F 12V .3 F D.U. 3mA Current Sampling Resistors Fig 13b. Gate Charge Test Circuit 6 1200 1000 ...

Page 7

... Low Leakage Inductance Current Transformer - - dv/dt controlled Driver same type as D.U.T. I controlled by Duty Factor "D" SD D.U.T. - Device Under Test P.W. Period D = Period Body Diode Forward Current di/dt Waveform Diode Recovery dv/dt Body Diode Forward Drop Ripple 5% ® HEXFET Power MOSFETs IRF1404S =10V ...

Page 8

... IRF1404S Pak Package Outline 2 D Pak Part Marking Information 8 www.irf.com ...

Page 9

... TO-262 Package Outline TO-262 Part Marking Information www.irf.com IRF1404S/L 9 ...

Page 10

... IRF1404S Pak Tape & Reel Information TIO .00 (1 4.1 73 IA- 418 . LIN ILL DIM WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105 (. (. . . . . 1 1 3.50 (.5 32) 2 7.40 (1. 2.80 (.5 04) 2 3.90 (.941 ) 26 .40 (1. .40 (. Data and specifications subject to change without notice. ...

Page 11

Note: For the most current drawings please refer to the IR website at: http://www.irf.com/package/ ...

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